MY168665A - Resin-encapsulation apparatus and resin-encapsulation method - Google Patents

Resin-encapsulation apparatus and resin-encapsulation method

Info

Publication number
MY168665A
MY168665A MYPI2011001406A MYPI2011001406A MY168665A MY 168665 A MY168665 A MY 168665A MY PI2011001406 A MYPI2011001406 A MY PI2011001406A MY PI2011001406 A MYPI2011001406 A MY PI2011001406A MY 168665 A MY168665 A MY 168665A
Authority
MY
Malaysia
Prior art keywords
resin
encapsulation
unencapsulated
substrate
unencapsulated substrate
Prior art date
Application number
MYPI2011001406A
Inventor
Takada Naoki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY168665A publication Critical patent/MY168665A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

[Problem to be Solved] To appropriately preheat an unencapsulated substrate that is arranged on a molding die for resin-encapsulation. [Solution] A resin-encapsulation apparatus 1 for performing resin-encapsulation of a chip mounted on an unencapsulated substrate 5 comprises molding modules 3A to 3D, lower dies 10 provided on the respective molding modules 3A to 3D, upper dies provided so as to face the respective lower dies 10, cavities 11 to be filled with a flowable resin and provided on the respective lower dies 10, a first carrying means 9 carrying the unencapsulated substrate 5 to each of the molding modules 3A to 3D, a first heater provided on the first carrying means 9, a second carrying means 13 transferring the unencapsulated substrate 5 received from the first carrying means 9 so as to be placed above the cavity 11 and delivering the unencapsulated substrate 5 to a die surface of the upper die, and a second heater provided on the second carrying means 13. The first heater planarly heats the unencapsulated substrate 5 during the process of carrying the unencapsulated substrate 5 to each of the molding modules 3A to 3D. The second heater planary heats the received unencapsulated substrate 5 until the unencapsulated substrate 5 is delivered to the die surface of the upper die. Fig.I
MYPI2011001406A 2010-07-29 2011-03-29 Resin-encapsulation apparatus and resin-encapsulation method MY168665A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010170011A JP5697919B2 (en) 2010-07-29 2010-07-29 Resin sealing device and resin sealing method

Publications (1)

Publication Number Publication Date
MY168665A true MY168665A (en) 2018-11-29

Family

ID=45545794

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011001406A MY168665A (en) 2010-07-29 2011-03-29 Resin-encapsulation apparatus and resin-encapsulation method

Country Status (6)

Country Link
JP (1) JP5697919B2 (en)
KR (1) KR101639253B1 (en)
CN (1) CN102347244B (en)
MY (1) MY168665A (en)
SG (1) SG177810A1 (en)
TW (1) TWI543276B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5878054B2 (en) * 2012-03-27 2016-03-08 ルネサスエレクトロニクス株式会社 Semiconductor device manufacturing method and semiconductor device
JP5774538B2 (en) * 2012-04-11 2015-09-09 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP5985402B2 (en) * 2013-01-08 2016-09-06 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
CN105874606B (en) * 2014-01-06 2021-01-12 Mc10股份有限公司 Encapsulated conformal electronic systems and devices and methods of making and using the same
JP6310724B2 (en) * 2014-02-25 2018-04-11 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
US10170339B2 (en) * 2016-10-25 2019-01-01 Nanya Technology Corporation Semiconductor structure and a manufacturing method thereof
JP6804410B2 (en) * 2017-08-09 2020-12-23 Ｔｏｗａ株式会社 Conveying mechanism, resin molding device, method of delivering the object to be molded to the molding mold, and method of manufacturing the resin molded product
CN113442361A (en) * 2021-06-29 2021-09-28 顺德职业技术学院 Improve moulding device that encapsulation of LED display concatenation effect was glued
CN113394326A (en) * 2021-06-29 2021-09-14 顺德职业技术学院 Molding device for waterproof LED water inlet packaging adhesive
CN113451485A (en) * 2021-06-29 2021-09-28 顺德职业技术学院 Molding device for packaging adhesive for preventing LED display from light crosstalk

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307218A (en) * 1991-04-04 1992-10-29 Matsushita Electron Corp Semiconductor resin sealing device
JPH05162138A (en) * 1991-12-13 1993-06-29 Toshiba Corp Mold device
JP2694509B2 (en) 1994-05-19 1997-12-24 トーワ株式会社 Resin sealing molding method for electronic parts
JP3077645B2 (en) * 1997-10-24 2000-08-14 日本電気株式会社 Lead frame transport device and resin sealing device having the same
JP4031881B2 (en) * 1998-12-08 2008-01-09 アピックヤマダ株式会社 Resin sealing device
JP4037564B2 (en) * 1999-07-14 2008-01-23 第一精工株式会社 Semiconductor device sealing device
JP4519398B2 (en) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 Resin sealing method and semiconductor device manufacturing method
JP4078231B2 (en) * 2003-03-10 2008-04-23 アピックヤマダ株式会社 Molded product storage device and resin sealing device
JP5192646B2 (en) * 2006-01-16 2013-05-08 Ｔｏｗａ株式会社 Optical element resin sealing method, resin sealing apparatus, and manufacturing method thereof
JP2009105273A (en) * 2007-10-24 2009-05-14 Sumitomo Heavy Ind Ltd Resin sealing mold

Also Published As

Publication number Publication date
KR101639253B1 (en) 2016-07-13
CN102347244A (en) 2012-02-08
SG177810A1 (en) 2012-02-28
JP5697919B2 (en) 2015-04-08
JP2012033584A (en) 2012-02-16
CN102347244B (en) 2016-07-06
TW201205690A (en) 2012-02-01
KR20120011773A (en) 2012-02-08
TWI543276B (en) 2016-07-21

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