MY168564A - Electrodynamics (mems) micro speaker - Google Patents

Electrodynamics (mems) micro speaker

Info

Publication number
MY168564A
MY168564A MYPI2014701301A MYPI2014701301A MY168564A MY 168564 A MY168564 A MY 168564A MY PI2014701301 A MYPI2014701301 A MY PI2014701301A MY PI2014701301 A MYPI2014701301 A MY PI2014701301A MY 168564 A MY168564 A MY 168564A
Authority
MY
Malaysia
Prior art keywords
wafer
silicon wafer
electrodynamics
mems
micro
Prior art date
Application number
MYPI2014701301A
Inventor
Yeop Majlis Burhanuddin
Sugandi Gandi
Original Assignee
Univ Kebangsaan Malaysia Ukm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Kebangsaan Malaysia Ukm filed Critical Univ Kebangsaan Malaysia Ukm
Priority to MYPI2014701301A priority Critical patent/MY168564A/en
Priority to PCT/MY2015/050035 priority patent/WO2015178760A1/en
Publication of MY168564A publication Critical patent/MY168564A/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

The present invention provides a method for fabrication of an electrodynamics microelectromechanical systems (MEMS) micro speaker (100). Accordingly, the method includes: a) forming a first silicon wafer, i.e. wafer 1 (200), having a moving parts that serves a actuator system, said moving part includes flexible polyimide diaphragm (204) and micro coil or voice coil (202); b) forming a second silicon wafer, i.e. wafer 2 (300), with back cavity (306) for a seating or supporting a permanent magnet (302); said second silicon wafer includes venting or acoustic hole (304) on its back chamber (206); c) bonding the permanent magnet (302) to the second silicon wafer using adhesive epoxy bonding followed by boding the both wafer 1 (200) and wafer 2 (300) together using adhesive epoxy bonding, to form the complete electrodynamics MEMS micro speaker (100); wherein the flexible polyimide diaphragm (204) is formed by wet and dry etching of the first silicon wafer; such that a thin planar of the micro coil or voice coil (202) is suspended on the flexible polyimide diaphragm (204). The most illustrative drawing: FIG. 1b
MYPI2014701301A 2014-05-20 2014-05-20 Electrodynamics (mems) micro speaker MY168564A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2014701301A MY168564A (en) 2014-05-20 2014-05-20 Electrodynamics (mems) micro speaker
PCT/MY2015/050035 WO2015178760A1 (en) 2014-05-20 2015-05-20 Electrodynamics (mems) micro speaker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2014701301A MY168564A (en) 2014-05-20 2014-05-20 Electrodynamics (mems) micro speaker

Publications (1)

Publication Number Publication Date
MY168564A true MY168564A (en) 2018-11-13

Family

ID=54554335

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014701301A MY168564A (en) 2014-05-20 2014-05-20 Electrodynamics (mems) micro speaker

Country Status (2)

Country Link
MY (1) MY168564A (en)
WO (1) WO2015178760A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106454660A (en) * 2016-10-31 2017-02-22 歌尔股份有限公司 Electret sound production device and electronic equipment
CN106454668A (en) * 2016-10-31 2017-02-22 歌尔股份有限公司 MEMS sound production apparatus and electronic device
CN106454659A (en) * 2016-10-31 2017-02-22 歌尔股份有限公司 Sound production apparatus and manufacturing method thereof
DE102017118815A1 (en) 2017-08-17 2019-02-21 USound GmbH Speaker assembly and headphones for spatially locating a sound event
CN109211281B (en) * 2018-08-06 2019-10-22 歌尔股份有限公司 A kind of sensor
US11051106B2 (en) * 2019-04-29 2021-06-29 Fortemedia, Inc. Movable embedded microstructure
CN114430520B (en) * 2020-10-29 2024-07-09 富迪科技(南京)有限公司 Packaging structure of miniature loudspeaker
CN112188369B (en) * 2020-11-02 2021-08-27 地球山(苏州)微电子科技有限公司 Loudspeaker and manufacturing method thereof
CN113452234A (en) * 2021-07-26 2021-09-28 北京航空航天大学 Ultra-miniature voice coil motor based on MEMS three-dimensional coil
US20240007793A1 (en) * 2022-07-01 2024-01-04 Fortemedia, Inc. Package structure of micro speaker

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4652882B2 (en) * 2005-03-29 2011-03-16 古河電気工業株式会社 Thin speaker
EP2495212A3 (en) * 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
JPWO2007020925A1 (en) * 2005-08-17 2009-02-26 富士電機デバイステクノロジー株式会社 Electroacoustic transducer
KR101411416B1 (en) * 2007-12-14 2014-06-26 삼성전자주식회사 Micro speaker manufacturing method and micro speaker

Also Published As

Publication number Publication date
WO2015178760A1 (en) 2015-11-26

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