MY168372A - Resin-bond wire saw - Google Patents
Resin-bond wire sawInfo
- Publication number
- MY168372A MY168372A MYPI2015001761A MYPI2015001761A MY168372A MY 168372 A MY168372 A MY 168372A MY PI2015001761 A MYPI2015001761 A MY PI2015001761A MY PI2015001761 A MYPI2015001761 A MY PI2015001761A MY 168372 A MY168372 A MY 168372A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin
- wire saw
- bond
- bond wire
- mass spectrometry
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rotary Pumps (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A RESIN-BOND WIRE SAW IN WHICH ABRASIVE GRAINS ARE FIXED TO A SURFACE OF A WIRE WITH A RESIN BOND CONTAINING A NOVOLAK-TYPE PHENOL RESIN, A RESOL-TYPE PHENOL RESIN, AND AN AMINE-BASED SILANE COUPLING AGENT. THE RESIN BOND SHOWS A PLURALITY OF PEAKS AT INTERVALS OF 208 (M/Z) THAT REPRESENT FRAGMENTS IN CATIONS IN MATRIX-ASSISTED LASER DESORPTION IONIZATION-TIME OF FLIGHT-MASS SPECTROMETRY (MASS SPECTROMETRY) AND A PEAK THAT CORRESPONDS TO A SOFTENING POINT AT 175°C TO 182°C IN THERMOGRAVIMETRY AND DIFFERENTIAL THERMAL ANALYSIS (DIFFERENTIAL THERMAL ANALYSIS). (FIG. 4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013002792A JP5792208B2 (en) | 2013-01-10 | 2013-01-10 | Resin bond wire saw |
Publications (1)
Publication Number | Publication Date |
---|---|
MY168372A true MY168372A (en) | 2018-10-31 |
Family
ID=51166811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015001761A MY168372A (en) | 2013-01-10 | 2013-12-04 | Resin-bond wire saw |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5792208B2 (en) |
KR (1) | KR101594747B1 (en) |
CN (1) | CN104918752B (en) |
MY (1) | MY168372A (en) |
SG (1) | SG11201504210SA (en) |
TW (1) | TWI519366B (en) |
WO (1) | WO2014109149A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201708638PA (en) * | 2015-04-20 | 2017-11-29 | Tkx Corp | Method for producing fine silicon powder, and method for producing fine silicon nitride powder |
WO2016186075A1 (en) * | 2015-05-21 | 2016-11-24 | 三井化学東セロ株式会社 | Method for manufacturing gas-barrier layered product |
WO2017203801A1 (en) * | 2016-05-24 | 2017-11-30 | 株式会社Tkx | Device for manufacturing coated wire |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940001070B1 (en) * | 1990-12-29 | 1994-02-12 | 고려화학 주식회사 | Preparation of epoxy resin compositions for encapsulating semiconductor |
JP3734854B2 (en) | 1995-07-18 | 2006-01-11 | 古河電気工業株式会社 | Hot air circulation type individual multiple enamel wire baking furnace and method for producing enamel wire using the same |
KR100306358B1 (en) * | 1997-02-14 | 2001-11-30 | 추후보충 | File Saws and Manufacturing Methods |
JP2000263452A (en) | 1999-03-12 | 2000-09-26 | Osaka Diamond Ind Co Ltd | Super-abrasive grain wire saw |
JP2000271872A (en) | 1999-03-23 | 2000-10-03 | Osaka Diamond Ind Co Ltd | Super abrasive grain resin bond wire saw |
JP2001259993A (en) * | 2000-03-10 | 2001-09-25 | Noritake Diamond Ind Co Ltd | Resin bond wire saw |
JP2008006584A (en) * | 2000-05-15 | 2008-01-17 | Allied Material Corp | Cutting method using super-abrasive grain wire saw |
JP2003334763A (en) | 2002-05-16 | 2003-11-25 | Read Co Ltd | Fixed abrasive grain wire saw |
US7435276B2 (en) * | 2003-05-09 | 2008-10-14 | Diamond Innovations, Inc. | Abrasive particles having coatings with tortuous surface topography |
JP2006123024A (en) | 2004-10-26 | 2006-05-18 | Nakamura Choko:Kk | Fixed abrasive grain type wire saw and its manufacturing method |
JP4703448B2 (en) * | 2006-03-22 | 2011-06-15 | 株式会社ノリタケスーパーアブレーシブ | Resin bond wire saw |
JP2008103690A (en) | 2007-08-24 | 2008-05-01 | Mitsubishi Electric Corp | Slurry used for cutting silicon ingot |
CN101712135B (en) * | 2008-09-30 | 2014-07-02 | 日本则武超精密磨料磨具有限公司 | Resin bonder wire saw |
CN101445587B (en) * | 2008-12-26 | 2011-11-16 | 南京师范大学 | Resin binding agent for a diamond wire saw and preparation method thereof |
JP5443825B2 (en) | 2009-05-15 | 2014-03-19 | 古河電気工業株式会社 | Enamel wire printing equipment |
CN102513609B (en) * | 2011-12-28 | 2013-09-25 | 山东大学 | Resin bond consolidation abrasive wire saw production system |
-
2013
- 2013-01-10 JP JP2013002792A patent/JP5792208B2/en not_active Expired - Fee Related
- 2013-12-04 KR KR1020157011316A patent/KR101594747B1/en not_active IP Right Cessation
- 2013-12-04 SG SG11201504210SA patent/SG11201504210SA/en unknown
- 2013-12-04 WO PCT/JP2013/082639 patent/WO2014109149A1/en active Application Filing
- 2013-12-04 CN CN201380070217.3A patent/CN104918752B/en not_active Expired - Fee Related
- 2013-12-04 MY MYPI2015001761A patent/MY168372A/en unknown
- 2013-12-18 TW TW102146989A patent/TWI519366B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI519366B (en) | 2016-02-01 |
TW201433391A (en) | 2014-09-01 |
CN104918752A (en) | 2015-09-16 |
CN104918752B (en) | 2016-04-20 |
WO2014109149A1 (en) | 2014-07-17 |
KR20150102946A (en) | 2015-09-09 |
JP5792208B2 (en) | 2015-10-07 |
KR101594747B1 (en) | 2016-02-16 |
SG11201504210SA (en) | 2015-07-30 |
JP2014133288A (en) | 2014-07-24 |
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