MY164298A - Method and device for encapsulating electronic components, wherein the encapsulating material is cooled - Google Patents
Method and device for encapsulating electronic components, wherein the encapsulating material is cooledInfo
- Publication number
- MY164298A MY164298A MYPI20092009A MYPI20092009A MY164298A MY 164298 A MY164298 A MY 164298A MY PI20092009 A MYPI20092009 A MY PI20092009A MY PI20092009 A MYPI20092009 A MY PI20092009A MY 164298 A MY164298 A MY 164298A
- Authority
- MY
- Malaysia
- Prior art keywords
- encapsulating
- electronic components
- cooled
- encapsulating material
- encapsulating electronic
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/02—Thermal after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C2045/735—Heating or cooling of the mould heating a mould part and cooling another mould part during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, WHEREIN A LIQUID ENCAPSULATING MATERIAL (9) COMPRISING POLYMER AFTER CURING IS COOLED IN FORCED MANNER. THE INVENTION FURTHER ALSO COMPRISES A MOULD PART (30) FOR APPLYING IN A DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, AND SUCH A DEVICE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2000356A NL2000356C2 (en) | 2006-12-05 | 2006-12-05 | Method and device for encapsulating electronic components wherein the encapsulating material is cooled. |
Publications (1)
Publication Number | Publication Date |
---|---|
MY164298A true MY164298A (en) | 2017-12-15 |
Family
ID=38255465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20092009A MY164298A (en) | 2006-12-05 | 2007-11-28 | Method and device for encapsulating electronic components, wherein the encapsulating material is cooled |
Country Status (6)
Country | Link |
---|---|
KR (1) | KR101495576B1 (en) |
CN (1) | CN101583475B (en) |
MY (1) | MY164298A (en) |
NL (1) | NL2000356C2 (en) |
TW (1) | TWI440144B (en) |
WO (1) | WO2008085026A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102490330B (en) * | 2011-12-02 | 2014-06-04 | 北京化工大学 | Temperature control method based on phase-transition energy-accumulation material |
CN104960198B (en) * | 2015-07-07 | 2017-05-10 | 北京博简复才技术咨询有限公司 | Sensor element adhering device |
US10486378B2 (en) | 2016-08-01 | 2019-11-26 | GM Global Technology Operations LLC | Methods of manufacturing vehicle assemblies |
US10408163B2 (en) | 2016-08-01 | 2019-09-10 | GM Global Technology Operations LLC | Polymeric composite engine assembly and methods of heating and cooling said assembly |
NL2021845B1 (en) * | 2018-10-22 | 2020-05-13 | Besi Netherlands Bv | Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2874751A (en) * | 1956-03-13 | 1959-02-24 | Thermel Inc | Temperature controlled press |
JP2684677B2 (en) * | 1988-05-25 | 1997-12-03 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
JPH03129839A (en) * | 1989-10-16 | 1991-06-03 | Nec Yamagata Ltd | Manufacture of semiconductor device |
KR910011421A (en) * | 1989-12-26 | 1991-08-07 | 빈센트 죠셉 로너 | Isothermal Injection Molding Method |
JP3162522B2 (en) * | 1992-12-01 | 2001-05-08 | アピックヤマダ株式会社 | Resin molding method and resin molding device for semiconductor device |
JP2000037745A (en) * | 1998-07-21 | 2000-02-08 | Matsushita Electronics Industry Corp | Method and apparatus for manufacture of thermosetting resin molded product, and mold assembly |
-
2006
- 2006-12-05 NL NL2000356A patent/NL2000356C2/en active Search and Examination
-
2007
- 2007-11-28 CN CN200780044105.5A patent/CN101583475B/en active Active
- 2007-11-28 MY MYPI20092009A patent/MY164298A/en unknown
- 2007-11-28 WO PCT/NL2007/050602 patent/WO2008085026A1/en active Application Filing
- 2007-11-28 KR KR20097011650A patent/KR101495576B1/en active IP Right Grant
- 2007-12-04 TW TW096146001A patent/TWI440144B/en active
Also Published As
Publication number | Publication date |
---|---|
KR101495576B1 (en) | 2015-02-25 |
TW200841432A (en) | 2008-10-16 |
CN101583475B (en) | 2014-09-10 |
KR20090099520A (en) | 2009-09-22 |
CN101583475A (en) | 2009-11-18 |
NL2000356C2 (en) | 2008-06-06 |
TWI440144B (en) | 2014-06-01 |
WO2008085026A1 (en) | 2008-07-17 |
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