MY158638A - 2-benzly-4-(3,4-dichlorophenyl)-5-methylimidazole compound - Google Patents

2-benzly-4-(3,4-dichlorophenyl)-5-methylimidazole compound

Info

Publication number
MY158638A
MY158638A MYPI2011000846A MYPI20110846A MY158638A MY 158638 A MY158638 A MY 158638A MY PI2011000846 A MYPI2011000846 A MY PI2011000846A MY PI20110846 A MYPI20110846 A MY PI20110846A MY 158638 A MY158638 A MY 158638A
Authority
MY
Malaysia
Prior art keywords
compound
dichlorophenyl
benzyl
benzly
methylimidazole
Prior art date
Application number
MYPI2011000846A
Inventor
Murai Takayuki
Hirao Hirohiko
Takasaku Koji
Miyazaki Masayuki
Original Assignee
Shikoku Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chem filed Critical Shikoku Chem
Publication of MY158638A publication Critical patent/MY158638A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)

Abstract

AN OBJECT IS TO PROVIDE A 2-BENZYL-4-(3,4-DICHLOROPHENYL)-5-METHYLIRNIDAZOLE COMPOUND USEFUL AS AN ANTIOXIDANT FOR COPPER SURFACE, A CURING AGENT FOR EPOXY RESINS, OR AN INTERMEDIATE FOR NEDICAMENTS AND AGRICULTURAL CHEMICALS.A 2-BENZYL-4-(3,4-DICHLOROPHENYL) -5-METHYLIMIDAZOLE COMPOUND REPRESENTED BY THE FORMULA (I).THE COMPOUND CAN BE SYNTHESIZED BY REACTING A 2-HALOGENATED 31,4?- DICHIOROPROPIOPHENONE COMPOUND WITH AN ARYLACETAMIDINE COMPOUND UNDER HEATING IN THE PRESENCE OF A DEHYDROHALOGENATING AGENT IN AN ORGANIC SOLVENT.WHEREIN X1 AND X2 ARE THE SAME OR DIFFERENT AND REPRESENT A HYDROGEN ATOM, A CHLORINE ATOM, OR A BROMINE ATOM.
MYPI2011000846A 2008-09-03 2009-09-02 2-benzly-4-(3,4-dichlorophenyl)-5-methylimidazole compound MY158638A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008225632 2008-09-03
JP2009130022 2009-05-29
JP2009140655A JP5484795B2 (en) 2008-09-03 2009-06-12 2-Benzyl-4- (3,4-dichlorophenyl) -5-methylimidazole compound

Publications (1)

Publication Number Publication Date
MY158638A true MY158638A (en) 2016-10-31

Family

ID=41323603

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011000846A MY158638A (en) 2008-09-03 2009-09-02 2-benzly-4-(3,4-dichlorophenyl)-5-methylimidazole compound

Country Status (6)

Country Link
JP (1) JP5484795B2 (en)
KR (1) KR101602978B1 (en)
CN (1) CN102144046B (en)
MY (1) MY158638A (en)
TW (1) TWI507395B (en)
WO (1) WO2010027077A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260208B2 (en) * 2008-09-22 2013-08-14 四国化成工業株式会社 2- (2,4-Dichlorobenzyl) -4- (halogenated phenyl) imidazole compound
JP5260367B2 (en) * 2008-09-26 2013-08-14 四国化成工業株式会社 2- (Chlorobenzyl) -4-phenylimidazole compound
JP5615227B2 (en) * 2011-05-23 2014-10-29 四国化成工業株式会社 Surface treatment agent for copper or copper alloy and use thereof
JP5615233B2 (en) * 2011-06-20 2014-10-29 四国化成工業株式会社 Surface treatment agent for copper or copper alloy and use thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW270944B (en) * 1993-05-10 1996-02-21 Shikoku Kakoki Co Ltd
JP3277025B2 (en) * 1993-05-10 2002-04-22 四国化成工業株式会社 Copper and copper alloy surface treatment agent
JPH06329635A (en) * 1993-05-24 1994-11-29 Shikoku Chem Corp New imidazole compound
JP3311858B2 (en) * 1994-03-08 2002-08-05 四国化成工業株式会社 Copper and copper alloy surface treatment agent
AR024077A1 (en) * 1999-05-25 2002-09-04 Smithkline Beecham Corp ANTIBACTERIAL COMPOUNDS
US7661577B2 (en) * 2003-03-19 2010-02-16 Shikoku Chemicals Corporation Imidazole compound and use thereof

Also Published As

Publication number Publication date
JP2011006323A (en) 2011-01-13
KR20110050663A (en) 2011-05-16
KR101602978B1 (en) 2016-03-11
TW201010982A (en) 2010-03-16
WO2010027077A1 (en) 2010-03-11
TWI507395B (en) 2015-11-11
CN102144046B (en) 2014-02-26
JP5484795B2 (en) 2014-05-07
CN102144046A (en) 2011-08-03

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