MY158230A - Polyacetal resin composition - Google Patents

Polyacetal resin composition

Info

Publication number
MY158230A
MY158230A MYPI2011002978A MYPI2011002978A MY158230A MY 158230 A MY158230 A MY 158230A MY PI2011002978 A MYPI2011002978 A MY PI2011002978A MY PI2011002978 A MYPI2011002978 A MY PI2011002978A MY 158230 A MY158230 A MY 158230A
Authority
MY
Malaysia
Prior art keywords
weight
resin composition
polyacetal resin
compound
byweight
Prior art date
Application number
MYPI2011002978A
Inventor
Akihide Shimoda
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of MY158230A publication Critical patent/MY158230A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • C08L59/04—Copolyoxymethylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

THE PRESENT INVENTION PRDVIDES A POLYACETAL RESIN COMPOSITION HAVING EXCELLENT PROPERTIES SUCH AS HIGH RIGIDITY, LOW WARPAGE, AND LOW DEFORMATION, HAVING IMPROVED MECHANICAL STRENGTH, AND HAVING SIGNIFICANTLY IMPROVED PROPERTIES SUCH AS FRACTURE LIFE (CREEP PROPERTIES) IN A HOT-WATER IMMERSION STATE OR UNDER A CERTAIN LEVEL OF STRESS. SPECIFICALLY, THEPOLYACETAL RESIN COMPOSITION CONTAINS: 30 TO 95% BY WEIGHT OF (A1) A POLYACETAL RESIN HAVING A STRAIGHT-CHAIN MOLECULAR STRUCTURE; 0.05 TO 10% BYWEIGHT OF (A2) APOLYACETAL RESIN HAVING ABRANCHED OR CROSS-LINKED STRUCTURE; 5 TO 50% BY WEIGHT OF (B) A POWDER AND GRANULAR GLASS-BASED INORGANIC FILLER; 0.1 TO 10% BY WEIGHT OF (C) ATRIFUNCTIONAL ISOCYANATE COMPOUND; 0.05 TO 2%BYWEIGHT OF (D) A COMPOUND SELECTED FROM (DL) AN AMINE-BASED COMPOUND AND (D2) AN ORGANIC METAL COMPOUND CONTAINING A METAL SELECTED FROM SN, ZN, AND PI; AND 0 TO 20% BY WEIGHT OF (E) AN ARBITRARY ADDITIVE; THE SUM OF THE CONTENTS BEING 100% BY WEIGHT.
MYPI2011002978A 2008-12-24 2009-12-14 Polyacetal resin composition MY158230A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008326888A JP5612262B2 (en) 2008-12-24 2008-12-24 Polyacetal resin composition

Publications (1)

Publication Number Publication Date
MY158230A true MY158230A (en) 2016-09-15

Family

ID=42287187

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011002978A MY158230A (en) 2008-12-24 2009-12-14 Polyacetal resin composition

Country Status (5)

Country Link
JP (1) JP5612262B2 (en)
CN (1) CN102264833B (en)
MY (1) MY158230A (en)
TW (1) TW201033277A (en)
WO (1) WO2010073529A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201012554D0 (en) * 2010-07-27 2010-09-08 Thompson Gary Process for manufacturing a building material
MX344215B (en) 2010-10-14 2016-12-07 Celanese Sales Germany Gmbh Coupled glass-fiber reinforced polyoxymethylene.
CN102558755A (en) 2010-10-14 2012-07-11 提克纳有限公司 Glass-fiber reinforced polyoxymethylene
EP2581408B1 (en) 2011-10-14 2015-07-29 Ticona GmbH Tribologically modified glass-fiber reinforced polyoxymethylene
EP2653497B1 (en) 2012-04-17 2015-01-28 Ticona GmbH Weather resistant polyoxymethylene compositions
US9062183B2 (en) 2012-12-20 2015-06-23 Ticona Gmbh Fiber reinforced polyoxymethylene composition with improved thermal properties
JP6105305B2 (en) * 2013-02-04 2017-03-29 ポリプラスチックス株式会社 Polyacetal resin composition and method for producing the same
JP6700178B2 (en) 2013-10-21 2020-05-27 ティコナ ゲゼルシャフト ミット ベシュレンクテル ハフツング Intrinsically low friction polyoxymethylene
US10196577B2 (en) 2015-09-30 2019-02-05 Celanese Sales Germany Gmbh Low friction squeak free assembly
EP3577168B1 (en) 2017-03-10 2022-09-07 Celanese Sales Germany GmbH Polyester polymer compositions
JP6998122B2 (en) * 2017-03-30 2022-01-18 ポリプラスチックス株式会社 Polyacetal resin composition
CN110741045A (en) 2017-06-16 2020-01-31 塞拉尼斯销售德国有限公司 Reinforced polyoxymethylene compositions with low emissions
JP7129284B2 (en) * 2018-09-07 2022-09-01 ポリプラスチックス株式会社 Polyacetal copolymer and method for producing the same
JP7141330B2 (en) * 2018-12-26 2022-09-22 ポリプラスチックス株式会社 Polyacetal resin composition and method for producing polyacetal resin composition
CN110643006B (en) * 2019-09-24 2022-07-26 开滦能源化工股份有限公司 High-melt-strength copolyformaldehyde and preparation method thereof
JP7240469B1 (en) * 2021-10-04 2023-03-15 ポリプラスチックス株式会社 Polyacetal resin composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3080979B2 (en) * 1990-10-04 2000-08-28 ポリプラスチックス株式会社 Adhesive products made of polyacetal resin
JP3612416B2 (en) * 1997-12-25 2005-01-19 ポリプラスチックス株式会社 Fiber reinforced polyacetal resin composition
JP3607806B2 (en) * 1997-12-25 2005-01-05 ポリプラスチックス株式会社 Fiber reinforced conductive polyacetal resin composition
JP2005029714A (en) * 2003-07-08 2005-02-03 Polyplastics Co Polyacetal resin composition
JP2008044995A (en) * 2006-08-11 2008-02-28 Polyplastics Co Polyacetal resin composition
JP5281239B2 (en) * 2006-11-27 2013-09-04 ポリプラスチックス株式会社 Polyacetal resin composition and molded article thereof

Also Published As

Publication number Publication date
CN102264833A (en) 2011-11-30
WO2010073529A1 (en) 2010-07-01
TW201033277A (en) 2010-09-16
JP2010150306A (en) 2010-07-08
CN102264833B (en) 2013-07-17
JP5612262B2 (en) 2014-10-22

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