MY155995A - Prepreg, laminate, printed wiring board, and semiconductor device - Google Patents
Prepreg, laminate, printed wiring board, and semiconductor deviceInfo
- Publication number
- MY155995A MY155995A MYPI2013002669A MYPI2013002669A MY155995A MY 155995 A MY155995 A MY 155995A MY PI2013002669 A MYPI2013002669 A MY PI2013002669A MY PI2013002669 A MYPI2013002669 A MY PI2013002669A MY 155995 A MY155995 A MY 155995A
- Authority
- MY
- Malaysia
- Prior art keywords
- prepreg
- semiconductor device
- wiring board
- printed wiring
- laminate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
Abstract
PREPREG RELATED TO THE INVENTION IS PREPREG (40) FORMED BY IMPREGNATING FIBER WOVEN FABRIC (20) CONSTITUTED BY STRANDS WITH A RESIN COMPOSITION. IN THE PREPREG (40) RELATED TO THE INVENTION, SILICA PARTICLES ARE PRESENT IN THE STRAND. ACCORDING TO THIS, PREPREG (40) IN WHICH IMPREGNATION PROPERTIES OF THE RESIN COMPOSITION WITH RESPECT TO THE FIBER WOVEN FABRIC (20) IS EXCELLENT MAY BE OBTAINED. IN ADDITION, A PRINTED WIRING BOARD AND A SEMICONDUCTOR DEVICE MAY BE MANUFACTURED USING THE PREPREG (40) AND/OR A METAL-CLAD LAMINATE (51, 52) MANUFACTURED USING THE PREPREG (40). (FIGURES 1(A), (B) AND (C))
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011012166 | 2011-01-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY155995A true MY155995A (en) | 2015-12-31 |
Family
ID=46580569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013002669A MY155995A (en) | 2011-01-24 | 2012-01-19 | Prepreg, laminate, printed wiring board, and semiconductor device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5234195B2 (en) |
KR (1) | KR101355777B1 (en) |
CN (1) | CN103347938B (en) |
MY (1) | MY155995A (en) |
TW (1) | TWI539869B (en) |
WO (1) | WO2012101991A1 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6008104B2 (en) * | 2012-09-04 | 2016-10-19 | 住友ベークライト株式会社 | Prepreg and metal-clad laminate |
JP6217069B2 (en) * | 2012-10-26 | 2017-10-25 | 住友ベークライト株式会社 | Resin substrate, metal-clad laminate, printed wiring board, and semiconductor device |
JP6226232B2 (en) * | 2012-11-12 | 2017-11-08 | パナソニックIpマネジメント株式会社 | Metal-clad laminate, metal-clad laminate production method, printed wiring board, multilayer printed wiring board |
JP2014111719A (en) * | 2012-11-12 | 2014-06-19 | Panasonic Corp | Laminate, metal-clad laminate, printed wiring board, and multilayer printed wiring board |
DE102012025409A1 (en) * | 2012-12-20 | 2014-06-26 | Thomas Hofmann | CONDUCTOR PLATE WITH NATURAL AGGREGATE MATERIAL |
JP6327429B2 (en) | 2013-08-01 | 2018-05-23 | パナソニックIpマネジメント株式会社 | Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board |
JP6221620B2 (en) * | 2013-10-22 | 2017-11-01 | 住友ベークライト株式会社 | Metal-clad laminate, printed wiring board, and semiconductor device |
WO2015079820A1 (en) * | 2013-11-29 | 2015-06-04 | 日東紡績株式会社 | Glass fiber fabric-resin composition laminate |
CN103796435B (en) * | 2014-01-16 | 2017-08-11 | 广州兴森快捷电路科技有限公司 | The method that measurement circuitry flaggy presses off normal |
JP2016069401A (en) * | 2014-09-26 | 2016-05-09 | 住友ベークライト株式会社 | Prepreg, resin board, metal-clad laminate, printed wiring board, and semiconductor device |
JP6435947B2 (en) * | 2015-03-24 | 2018-12-12 | 住友ベークライト株式会社 | Filler impregnation rate evaluation method, filler impregnation rate evaluation apparatus, and computer program |
JP6497652B2 (en) * | 2015-04-15 | 2019-04-10 | 京セラ株式会社 | Epoxy resin molding material for sealing and electronic parts |
US11497117B2 (en) | 2016-05-25 | 2022-11-08 | Showa Denko Materials Co., Ltd. | Metal-clad laminate, printed wiring board and semiconductor package |
JP6972522B2 (en) * | 2016-09-01 | 2021-11-24 | 住友ベークライト株式会社 | Prepregs, metal-clad laminates, printed wiring boards and semiconductor packages |
US11040517B2 (en) * | 2016-11-09 | 2021-06-22 | Showa Denko Materials Co., Ltd. | Printed wiring board and semiconductor package |
JP7465093B2 (en) * | 2017-10-10 | 2024-04-10 | 味の素株式会社 | Cured product and method for producing same, resin sheet and resin composition |
WO2019111416A1 (en) * | 2017-12-08 | 2019-06-13 | 日立化成株式会社 | Prepreg, layered plate, method for manufacturing prepreg and layered plate, printed wiring board, and semiconductor package |
JP7123744B2 (en) * | 2018-10-26 | 2022-08-23 | 旭化成株式会社 | Long glass cloth rolls, prepregs, and printed wiring boards |
CN112423463A (en) * | 2019-08-23 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | Multilayer circuit board and manufacturing method thereof |
WO2021039582A1 (en) * | 2019-08-27 | 2021-03-04 | 日東紡績株式会社 | Glass cloth, prepreg, and glass fiber-reinforced resin molded product |
CN113529237B (en) * | 2020-03-30 | 2023-04-07 | 旭化成株式会社 | Roll-shaped long glass cloth, prepreg, and printed wiring board |
JPWO2021261284A1 (en) * | 2020-06-26 | 2021-12-30 | ||
CN112566356B (en) * | 2020-11-20 | 2022-03-18 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
DE102021117278B4 (en) * | 2021-07-05 | 2023-05-04 | Lisa Dräxlmaier GmbH | CIRCUIT BOARD FOR A VEHICLE CONTROL UNIT AND METHOD FOR MANUFACTURING SUCH CIRCUIT BOARD |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2993065B2 (en) * | 1990-07-27 | 1999-12-20 | 三菱瓦斯化学株式会社 | Metal foil-clad laminate with smooth surface |
JP3166324B2 (en) * | 1992-06-17 | 2001-05-14 | 信越化学工業株式会社 | Silica fine powder, method for producing the same, and resin composition containing the silica fine powder |
JPH091680A (en) * | 1995-06-19 | 1997-01-07 | Matsushita Electric Works Ltd | Manufacture of composite material |
JPH09209233A (en) * | 1996-01-29 | 1997-08-12 | Nitto Boseki Co Ltd | Glass cloth for print circuit substrate and print circuit substrate |
JP4348785B2 (en) * | 1999-07-29 | 2009-10-21 | 三菱瓦斯化学株式会社 | High elastic modulus glass cloth base thermosetting resin copper clad laminate |
JP2003213021A (en) * | 2002-01-18 | 2003-07-30 | Hitachi Chem Co Ltd | Prepreg, metal-clad laminated plate and printed wiring plate using the same |
JP2005105035A (en) * | 2003-09-29 | 2005-04-21 | Asahi Schwebel Co Ltd | Prepreg, manufacturing method thereof and laminated plate |
JP4903989B2 (en) * | 2004-07-27 | 2012-03-28 | 株式会社アドマテックス | Composition for printed circuit boards |
JP2007277463A (en) * | 2006-04-10 | 2007-10-25 | Hitachi Chem Co Ltd | Low dielectric prepreg, and metal foil clad laminate and multilayer printed wiring board using the same |
JP5112157B2 (en) * | 2008-04-23 | 2013-01-09 | 株式会社アドマテックス | Silica fine particles and silica fine particle-containing resin composition |
US8852734B2 (en) * | 2009-10-14 | 2014-10-07 | Sumitomo Bakelite Company, Ltd. | Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device |
-
2012
- 2012-01-19 WO PCT/JP2012/000316 patent/WO2012101991A1/en active Application Filing
- 2012-01-19 MY MYPI2013002669A patent/MY155995A/en unknown
- 2012-01-19 CN CN201280006279.3A patent/CN103347938B/en active Active
- 2012-01-19 KR KR1020137022082A patent/KR101355777B1/en active IP Right Grant
- 2012-01-19 JP JP2012009112A patent/JP5234195B2/en active Active
- 2012-01-20 TW TW101102467A patent/TWI539869B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI539869B (en) | 2016-06-21 |
KR20130102654A (en) | 2013-09-17 |
CN103347938A (en) | 2013-10-09 |
JP2012167256A (en) | 2012-09-06 |
KR101355777B1 (en) | 2014-02-04 |
CN103347938B (en) | 2014-07-30 |
TW201251534A (en) | 2012-12-16 |
WO2012101991A1 (en) | 2012-08-02 |
JP5234195B2 (en) | 2013-07-10 |
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