MY155215A - Amorphous silica powder, process for its production and its use - Google Patents

Amorphous silica powder, process for its production and its use

Info

Publication number
MY155215A
MY155215A MYPI2010005080A MYPI20105080A MY155215A MY 155215 A MY155215 A MY 155215A MY PI2010005080 A MYPI2010005080 A MY PI2010005080A MY PI20105080 A MYPI20105080 A MY PI20105080A MY 155215 A MY155215 A MY 155215A
Authority
MY
Malaysia
Prior art keywords
amorphous silica
silica powder
pyridine
under heating
amount
Prior art date
Application number
MYPI2010005080A
Inventor
Nishi Yasuhisa
Sasaki Syuji
Murata Hiroshi
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of MY155215A publication Critical patent/MY155215A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A RESIN COMPOSITION, PARTICULARLY A SEALING MATERIAL FOR SEMICONDUCTORS, IS PROVIDED WHICH HAS A LOW VISCOSITY AT THE TIME OF SEALING AND HAS ITS MOLDABILITY FURTHER IMPROVED, EVEN WHEN AN INORGANIC FILLER IS HIGHLY FILLED. FURTHER, AN AMORPHOUS SILICA POWDER SUITABLE FOR PREPARATION OF SUCH A RESIN COMPOSITION, AND A PROCESS FOR PRODUCING SUCH AN AMORPHOUS SILICA POWDER ARE PROVIDED. THE AMORPHOUS SILICA POWDER IS CHARACTERIZED IN THAT AFTER HAVING PYRIDINE ADSORBED ON THE AMORPHOUS SILICA POWDER, THE RATIO OF L/B IS AT MOST 0.8, WHERE L IS THE AMOUNT OF PYRIDINE DESORBED UNDER HEATING AT FROM 450°C TO LOWER THAN 550°C, AND B IS THE AMOUNT OF PYRIDINE DESORBED UNDER HEATING AT FROM 150°C TO LOWER THAN 250°C. FURTHER, IT IS PREFERRED THAT AFTER HAVING PYRIDINE ADSORBED ON THE AMORPHOUS SILICA POWDER, THE PROPORTION OF THE AMOUNT B OF PYRIDINE DESORBED UNDER HEATING AT FROM 150°C TO LOWER THAN 250°C IN THE TOTAL AMOUNT A OF PYRIDINE DESORBED UNDER HEATING AT FROM 150°C TO LOWER THAN 550°C, I.E. (B/A)x100%, IS AT LEAST 20%. FURTHER, THE AMORPHOUS SILICA POWDER PREFERABLY HAS A SPECIFIC SURFACE AREA OF FROM 0.5 TO 45 M2/G, AN AVERAGE PARTICLE SIZE OF FROM 0.1 TO 60 µm AND AN AVERAGE SPHERICITY OF AT LEAST 0.80. (NO SUITABLE
MYPI2010005080A 2008-05-16 2009-05-13 Amorphous silica powder, process for its production and its use MY155215A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008129122 2008-05-16

Publications (1)

Publication Number Publication Date
MY155215A true MY155215A (en) 2015-09-30

Family

ID=41318791

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010005080A MY155215A (en) 2008-05-16 2009-05-13 Amorphous silica powder, process for its production and its use

Country Status (6)

Country Link
JP (1) JP5553749B2 (en)
KR (1) KR101256299B1 (en)
CN (1) CN102015531B (en)
MY (1) MY155215A (en)
TW (1) TWI458682B (en)
WO (1) WO2009139425A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103232045B (en) * 2013-05-13 2015-09-16 神华集团有限责任公司 A kind of synthetic method of molecular sieve
JP6305007B2 (en) * 2013-10-18 2018-04-04 新日鉄住金マテリアルズ株式会社 Spherical amorphous silica particles, method for producing the same, and resin composition containing the same
JP6506940B2 (en) * 2014-10-15 2019-04-24 株式会社アドマテックス Method of producing inorganic filler, method of producing resin composition, and method of producing molded article
JP6812093B2 (en) * 2015-06-26 2021-01-13 日本電気硝子株式会社 Inorganic filler particles and resin composition for three-dimensional modeling using them
JP6966189B2 (en) * 2016-09-29 2021-11-10 デンカ株式会社 Amorphous aluminosilicate toner external additive
JP7112179B2 (en) * 2016-10-19 2022-08-03 日鉄ケミカル＆マテリアル株式会社 Spherical siliceous powder for semiconductor encapsulant and method for producing the same
WO2018186315A1 (en) * 2017-04-04 2018-10-11 デンカ株式会社 Powder mixture
CN111670107B (en) * 2018-04-06 2022-06-07 惠普发展公司，有限责任合伙企业 Three-dimensional (3D) object printing based on build material moisture content levels
JP6612919B2 (en) * 2018-04-13 2019-11-27 デンカ株式会社 Amorphous silica powder, resin composition, and semiconductor encapsulant

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661519A (en) * 1970-07-01 1972-05-09 Cities Service Co Hydrolysis of silicon tetrafluoride
DE69633066D1 (en) * 1995-12-19 2004-09-09 Corning Inc METHOD AND DEVICE FOR PRODUCING A QUARTZ GLASS BY COMBUSTION OF LIQUID REAGENTS
JP3478468B2 (en) * 1997-08-25 2003-12-15 電気化学工業株式会社 Method and apparatus for producing inorganic spherical particles
JP3608968B2 (en) * 1999-02-08 2005-01-12 電気化学工業株式会社 Method for producing spherical inorganic particles
DE19919635A1 (en) * 1999-04-30 2000-11-23 Degussa Silicon-aluminum mixed oxide
JP4112125B2 (en) * 1999-08-13 2008-07-02 電気化学工業株式会社 Method for producing fine spherical silica powder
WO2001098211A1 (en) * 2000-06-20 2001-12-27 Nippon Aerosil Co., Ltd. Amorphous, fine silica particles, and method for their production and their use
JP3694474B2 (en) * 2001-10-30 2005-09-14 秀博 神谷 Method for producing spherical silica powder
JP3868347B2 (en) * 2002-07-25 2007-01-17 電気化学工業株式会社 Inorganic powder and resin composition filled therewith
WO2004080916A1 (en) * 2003-03-10 2004-09-23 Ngk Insulators, Ltd. Inorganic porous body and method for producing same
JP2005306923A (en) * 2004-04-19 2005-11-04 Denki Kagaku Kogyo Kk Inorganic powder and composition containing the same
JP4815209B2 (en) * 2005-03-17 2011-11-16 株式会社アドマテックス Curing agent and resin composition
WO2007125891A1 (en) * 2006-04-24 2007-11-08 Denki Kagaku Kogyo Kabushiki Kaisha Inorganic hollow particle, process for producing the same, and composition containing the same
TWI412506B (en) * 2006-05-12 2013-10-21 Denki Kagaku Kogyo Kk Ceramic powder and uses thereof

Also Published As

Publication number Publication date
JP5553749B2 (en) 2014-07-16
TW201000401A (en) 2010-01-01
KR20110018309A (en) 2011-02-23
TWI458682B (en) 2014-11-01
CN102015531A (en) 2011-04-13
KR101256299B1 (en) 2013-04-18
JPWO2009139425A1 (en) 2011-09-22
CN102015531B (en) 2013-10-16
WO2009139425A1 (en) 2009-11-19

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