MY155097A - Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate - Google Patents
Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrateInfo
- Publication number
- MY155097A MY155097A MYPI2010001142A MYPI20101142A MY155097A MY 155097 A MY155097 A MY 155097A MY PI2010001142 A MYPI2010001142 A MY PI2010001142A MY PI20101142 A MYPI20101142 A MY PI20101142A MY 155097 A MY155097 A MY 155097A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor chips
- coordinates
- substrate
- picking
- wafer table
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
THE INVENTION RELATES TO A METHOD FOR PICKING UP SEMICONDUCTOR CHIPS (2) FROM A WAFER TABLE (1) AND, OPTIONALLY, THEIR MOUNTING ON A SUBSTRATE (4) BY MEANS OF A PICK-AND-PLACE SYSTEM (5). THE POSITION AND ORIENTATION OF THE SEMICONDUCTOR CHIP (2) TO BE MOUNTED NEXT ARE DETERMINED BY MEANS OF A FIRST CAMERA (6) AND MADE AVAILABLE IN THE FORM OF POSITIONAL DATA RELATING TO A FIRST SYSTEM OF COORDINATES. THE POSITION AND ORIENTATION OF THE SUBSTRATE PLACE ON WHICH THE SEMICONDUCTOR CHIP (2) WILL BE MOUNTED ARE DETERMINED BY MEANS OF A SECOND CAMERA (7) AND MADE AVAILABLE IN THE FORM OF POSITIONAL DATA RELATING TO A SECOND SYSTEM OF COORDINATES. THE CONVERSION OF COORDINATES OF THE FIRST OR SECOND SYSTEM OF COORDINATES INTO COORDINATES OF MOTION OF THE PICK-AND-PLACE SYSTEM (5) OCCURS BY MEANS OF TWO FIXED MAPPING FUNCTIONS AND TWO CHANGEABLE CORRECTION VECTORS. THE CORRECTION VECTORS ARE READJUSTED ON THE OCCURRENCE OF A PREDETERMINED EVENT.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH15622007 | 2007-10-09 | ||
CH11362008A CH698334B1 (en) | 2007-10-09 | 2008-07-17 | A process for the removal and installation of a wafer table provided on the semiconductor chip on a substrate. |
Publications (1)
Publication Number | Publication Date |
---|---|
MY155097A true MY155097A (en) | 2015-09-15 |
Family
ID=40908817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010001142A MY155097A (en) | 2007-10-09 | 2008-10-03 | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP5258068B2 (en) |
KR (1) | KR101503556B1 (en) |
CN (1) | CN101861637B (en) |
CH (1) | CH698334B1 (en) |
DE (1) | DE112008002467B4 (en) |
HK (1) | HK1144235A1 (en) |
MY (1) | MY155097A (en) |
TW (1) | TWI464820B (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367208B (en) * | 2013-07-02 | 2015-10-28 | 华中科技大学 | A kind of back bonding platform for superchip |
EP3154882B1 (en) * | 2014-06-11 | 2020-09-30 | Universal Instruments Corporation | Test device for establishing, verifying, and/or managing accuracy |
CN104362120B (en) * | 2014-10-30 | 2017-04-19 | 深圳市大能智造科技有限公司 | Camera position adjustment method of visual positioning system of crystal plate pickup device |
US10223589B2 (en) | 2015-03-03 | 2019-03-05 | Cognex Corporation | Vision system for training an assembly system through virtual assembly of objects |
JP6510838B2 (en) * | 2015-03-11 | 2019-05-08 | ファスフォードテクノロジ株式会社 | Bonding apparatus and bonding method |
JP6438826B2 (en) * | 2015-04-02 | 2018-12-19 | ファスフォードテクノロジ株式会社 | Bonding apparatus and bonding method |
JP6470088B2 (en) * | 2015-04-02 | 2019-02-13 | ファスフォードテクノロジ株式会社 | Bonding apparatus and bonding method |
DE102015106224B4 (en) * | 2015-04-22 | 2022-09-01 | Asm Assembly Systems Gmbh & Co. Kg | Process for repeated measurement of a component carrier located in a placement area of a placement machine, as well as placement machine and computer program for carrying out this method |
US10290118B2 (en) * | 2015-08-06 | 2019-05-14 | Cognex Corporation | System and method for tying together machine vision coordinate spaces in a guided assembly environment |
CH711536B1 (en) * | 2015-08-31 | 2019-02-15 | Besi Switzerland Ag | Method for mounting bumped semiconductor chips on substrate sites of a substrate. |
JP6584234B2 (en) * | 2015-08-31 | 2019-10-02 | ファスフォードテクノロジ株式会社 | Die bonder, bonding method and semiconductor device manufacturing method |
JP6692376B2 (en) * | 2016-02-01 | 2020-05-13 | 芝浦メカトロニクス株式会社 | Electronic component mounting apparatus and mounting method, and package component manufacturing method |
CN106409746A (en) * | 2016-10-21 | 2017-02-15 | 合肥矽迈微电子科技有限公司 | Chip upright patching equipment |
CN108575053B (en) * | 2017-03-08 | 2020-03-27 | 台达电子电源(东莞)有限公司 | Electronic component inserting and positioning device and automatic component inserting machine |
CN106829469A (en) * | 2017-03-30 | 2017-06-13 | 武汉库柏特科技有限公司 | A kind of unordered grabbing device of robot based on double camera and method |
JP6649316B2 (en) * | 2017-03-31 | 2020-02-19 | 平田機工株式会社 | Transfer method and transfer system |
WO2018207462A1 (en) * | 2017-05-11 | 2018-11-15 | 村田機械株式会社 | Conveyance system and conveyance method |
TWI651795B (en) * | 2017-06-20 | 2019-02-21 | 梭特科技股份有限公司 | Image assist method for placing chip and chip apparatus using the method |
JP7018341B2 (en) * | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
CN110767577A (en) * | 2019-10-24 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor material attaching method |
CN112308919B (en) * | 2020-10-28 | 2024-04-09 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Correction method and device for clamping position of chip in clamp |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0923111B1 (en) | 1997-12-07 | 2007-05-02 | Oerlikon Assembly Equipment AG, Steinhausen | Semiconductor mounting apparatus with a reciprocating chip gripper |
JP2001015992A (en) * | 1999-06-29 | 2001-01-19 | Sony Corp | Calibration method in component mounting device |
JP4046030B2 (en) * | 2002-08-30 | 2008-02-13 | 株式会社村田製作所 | Component mounting method and component mounting apparatus |
DE10300518B4 (en) * | 2003-01-09 | 2005-06-23 | Siemens Ag | Device for loading substrates with components and method for calibrating such a device |
EP1480507B1 (en) | 2003-05-21 | 2006-07-19 | Unaxis International Trading Ltd. | Semiconductor mounting apparatus |
CH696103A5 (en) | 2003-06-06 | 2006-12-15 | Esec Trading Sa | Semiconductor assembly equipment. |
JP4343710B2 (en) * | 2004-01-09 | 2009-10-14 | ヤマハ発動機株式会社 | Surface mount machine |
JP4029855B2 (en) * | 2004-03-26 | 2008-01-09 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
JP4111160B2 (en) * | 2004-03-26 | 2008-07-02 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
EP1612843A1 (en) | 2004-07-02 | 2006-01-04 | Unaxis International Trading Ltd | Method and apparatus for mounting semiconductors |
DE102004036990A1 (en) * | 2004-07-30 | 2006-03-23 | Siemens Ag | Calibration method for assembling machine, involves recording component and marker by camera, and determining actual position of component relative to marker by camera |
WO2006079617A1 (en) * | 2005-01-26 | 2006-08-03 | Abb Ab | Device and method for calibrating the center point of a tool mounted on a robot by means of a camera |
JP2007173801A (en) * | 2005-12-22 | 2007-07-05 | Unaxis Internatl Trading Ltd | Method of fitting flip chip to substrate |
CH698357B1 (en) * | 2006-12-22 | 2013-09-13 | Kulicke & Soffa Die Bonding Gmbh | A method for calibrating the xy positioning of a positioning tool, and apparatus having such a positioning tool. |
-
2008
- 2008-07-17 CH CH11362008A patent/CH698334B1/en not_active IP Right Cessation
- 2008-10-03 DE DE112008002467T patent/DE112008002467B4/en active Active
- 2008-10-03 KR KR1020107007665A patent/KR101503556B1/en active IP Right Grant
- 2008-10-03 JP JP2010528368A patent/JP5258068B2/en active Active
- 2008-10-03 MY MYPI2010001142A patent/MY155097A/en unknown
- 2008-10-03 CN CN2008801103578A patent/CN101861637B/en active Active
- 2008-10-07 TW TW097138530A patent/TWI464820B/en active
-
2010
- 2010-11-19 HK HK10110796.3A patent/HK1144235A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE112008002467B4 (en) | 2013-08-22 |
CN101861637B (en) | 2012-07-18 |
CH698334B1 (en) | 2011-07-29 |
CN101861637A (en) | 2010-10-13 |
JP2010541293A (en) | 2010-12-24 |
KR101503556B1 (en) | 2015-03-17 |
KR20100085027A (en) | 2010-07-28 |
DE112008002467T5 (en) | 2010-08-26 |
TWI464820B (en) | 2014-12-11 |
JP5258068B2 (en) | 2013-08-07 |
HK1144235A1 (en) | 2011-02-02 |
TW200929425A (en) | 2009-07-01 |
CH698334A1 (en) | 2009-07-15 |
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