MY154043A - Taping unit and electronic component inspection apparatus - Google Patents

Taping unit and electronic component inspection apparatus

Info

Publication number
MY154043A
MY154043A MYPI2013701576A MYPI2013701576A MY154043A MY 154043 A MY154043 A MY 154043A MY PI2013701576 A MYPI2013701576 A MY PI2013701576A MY PI2013701576 A MYPI2013701576 A MY PI2013701576A MY 154043 A MY154043 A MY 154043A
Authority
MY
Malaysia
Prior art keywords
unit
electronic component
inspection
pocket
inspection apparatus
Prior art date
Application number
MYPI2013701576A
Inventor
Masato Miyata
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY154043A publication Critical patent/MY154043A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A TAPING UNIT (1) INCLUDES A CARRIER UNIT (10) AND A VISUAL INSPECTION UNIT (20), AND A HOLDER UNIT (30). THE CARRIER UNIT (10) FEEDS AN ELECTRONIC COMPONENT (D) RETAINED IN A POCKET (U) AT A RETAINING POSITION (P1) ALONG A CARRYING PATH (L). THE VISUAL INSPECTION UNIT (20) IS DISPOSED AT AN INSPECTION POSITION (P1) AT A DOWNSTREAM SIDE IN THE CARRYING DIRECTION WITH RESPECT TO THE RETAINING POSITION (P1), AND PERFORMS AN INSPECTION ON THE FED ELECTRONIC COMPONENT (D). THE HOLDER UNIT (30) MOVES LINEARLY BETWEEN THE RETAINING POSITION (P1) AND THE INSPECTION POSITION (P2) AND ABOVE THE CARRYING PATH (L). THE HOLDER UNIT (30) REMOVES THE ELECTRONIC COMPONENT (D) FROM THE POCKET (U) LOCATED AT THE INSPECTION POSITION (P2) IN ACCORDANCE WITH AN INSPECTION RESULT BY THE VISUAL INSPECTION UNIT (20). THE HOLDER UNIT (30) TAKES OUT AND HOLDS ANOTHER ELECTRONIC COMPONENT (D) FROM A POCKET (U) LOCATED AT THE RETAINING POSITION (P1), AND RETAINS THE TAKEN-OUT ELECTRONIC COMPONENT (D) IN THE POCKET (U) LOCATED AT THE INSPECTION POSITION (P2). (FIG. 1)
MYPI2013701576A 2012-09-06 2013-09-04 Taping unit and electronic component inspection apparatus MY154043A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012196593A JP5219056B1 (en) 2012-09-06 2012-09-06 Taping unit and electronic component inspection device

Publications (1)

Publication Number Publication Date
MY154043A true MY154043A (en) 2015-04-27

Family

ID=48778711

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701576A MY154043A (en) 2012-09-06 2013-09-04 Taping unit and electronic component inspection apparatus

Country Status (5)

Country Link
JP (1) JP5219056B1 (en)
KR (1) KR20140032323A (en)
CN (1) CN103476236B (en)
MY (1) MY154043A (en)
TW (1) TWI571188B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104890923A (en) * 2014-03-07 2015-09-09 深圳市三一联光智能设备股份有限公司 Automatic material taking and replacing device of braiding machine
TWI541169B (en) * 2014-06-30 2016-07-11 All Ring Tech Co Ltd Method and device for conveying material
JP5835825B1 (en) * 2014-11-19 2015-12-24 上野精機株式会社 Carrier tape traveling device and electronic component conveying device
CN104459511B (en) * 2014-12-30 2017-03-22 常州银河电器有限公司 Braid diode screening and detecting device
JP2016156715A (en) * 2015-02-25 2016-09-01 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
CN105957819B (en) * 2016-06-30 2018-11-16 南通康比电子有限公司 Diode braid appearance test tooling and its method
DE202016004428U1 (en) * 2016-07-20 2017-10-23 Barry-Wehmiller Papersystems, Inc. Device for applying data carriers to a carrier web
CN107719738A (en) * 2016-08-11 2018-02-23 深圳安博电子有限公司 One kind carrier band heat-sealing device
US11317551B2 (en) * 2016-10-05 2022-04-26 Fuji Corporation Component mounter
JP6926579B2 (en) * 2017-03-27 2021-08-25 Tdk株式会社 Parts packing device
US11217465B2 (en) * 2017-04-11 2022-01-04 Muehlbauer GmbH & Co. KG Component receiving device with optical sensor
CN108169608A (en) * 2017-12-13 2018-06-15 格力电器（武汉）有限公司 Braid component detection equipment
CN108033050B (en) * 2017-12-27 2019-10-22 福建省将乐县长兴电子有限公司 A kind of crystal oscillator packing machine
CN110435957A (en) * 2019-08-22 2019-11-12 广东利扬芯片测试股份有限公司 Integrated circuit surveys volume all-in-one machine from carrier band is moved
CN114563352B (en) * 2022-04-27 2022-07-19 深圳市标谱半导体科技有限公司 Light source installation component and braid detection device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04267711A (en) * 1991-02-23 1992-09-24 Dainippon Printing Co Ltd Electronic component taping device
JP3561279B2 (en) * 1992-07-21 2004-09-02 ローム株式会社 Refilling device for taping electronic components
JPH085454B2 (en) * 1993-04-28 1996-01-24 株式会社コオエイ Transfer device for small parts
JPH07329915A (en) * 1994-06-10 1995-12-19 Rohm Co Ltd Continuous taping apparatus for electronic parts
JPH1159615A (en) * 1997-08-26 1999-03-02 Seiwa Sangyo Kk Taping equipment for electronic parts
JP4050425B2 (en) * 1999-07-08 2008-02-20 ローム株式会社 Continuous taping device for electronic parts
EP1073325A3 (en) * 1999-07-27 2002-04-03 Lucent Technologies Inc. Testing and transporting semiconductor chips
US6634159B1 (en) * 1999-09-20 2003-10-21 Sanyo Electric Co., Ltd. Taping apparatus for electronic components
JP2001228098A (en) * 2000-02-14 2001-08-24 Sony Corp Inspection/taping device
JP4154652B2 (en) * 2002-08-30 2008-09-24 澁谷工業株式会社 Taping device
JP2004315000A (en) * 2003-04-14 2004-11-11 Ueno Seiki Kk Taping apparatus for electronic component and taping method
JP4297350B2 (en) * 2003-04-28 2009-07-15 Ｔｄｋ株式会社 Chip component conveying method and apparatus, and appearance inspection method and apparatus
JP4443871B2 (en) * 2003-07-15 2010-03-31 新日本無線株式会社 Semiconductor device storage device
JP2005035553A (en) * 2003-07-16 2005-02-10 Sumitomo Bakelite Co Ltd Manufacturing method for carrier tape
CN1968876B (en) * 2004-04-13 2012-10-31 Tdk株式会社 Chip part conveyance device, appearance inspection device
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
JP4798757B2 (en) * 2005-07-14 2011-10-19 上野精機株式会社 Semiconductor device taping apparatus and method
JP4676879B2 (en) * 2005-12-29 2011-04-27 ヤマハ発動機株式会社 Transport machine, mounting machine, printing machine and inspection machine
ATE540568T1 (en) * 2009-02-03 2012-01-15 Ismeca Semiconductor Holding METHOD AND DEVICE FOR FILLING CARRIER TAPES WITH ELECTRONIC COMPONENTS
JP5371598B2 (en) * 2009-07-14 2013-12-18 株式会社テセック Electronic component storage device
CN101989535B (en) * 2009-08-05 2013-09-18 深圳市远望工业自动化设备有限公司 All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method
JP5685420B2 (en) * 2010-11-16 2015-03-18 ラピスセミコンダクタ株式会社 Chip part packaging apparatus, chip part packaging method and cover tape
JP2012184029A (en) * 2011-03-07 2012-09-27 Hitachi High-Tech Instruments Co Ltd Taping apparatus

Also Published As

Publication number Publication date
JP2014052269A (en) 2014-03-20
TW201412207A (en) 2014-03-16
CN103476236A (en) 2013-12-25
KR20140032323A (en) 2014-03-14
TWI571188B (en) 2017-02-11
JP5219056B1 (en) 2013-06-26
CN103476236B (en) 2017-11-14

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