MY144488A - Laser processing apparatus using laser beam splitting - Google Patents

Laser processing apparatus using laser beam splitting

Info

Publication number
MY144488A
MY144488A MYPI20064455A MYPI20064455A MY144488A MY 144488 A MY144488 A MY 144488A MY PI20064455 A MYPI20064455 A MY PI20064455A MY PI20064455 A MYPI20064455 A MY PI20064455A MY 144488 A MY144488 A MY 144488A
Authority
MY
Malaysia
Prior art keywords
laser
processing apparatus
beam splitting
beams
laser beam
Prior art date
Application number
MYPI20064455A
Inventor
Lee Jun Dong
Park Jung-Rae
Seo Gi-Hong
Hong Eun-Jeong
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Publication of MY144488A publication Critical patent/MY144488A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A LASER PROCESSING APPARATUS USING LASER BEAM SPLITTING, WHICH DIVIDES AN INCIDENT LASER BEAM INTO AT LEAST TWO BEAMS AND PROCESSES A WORKPIECE (14) USING AT LEAST TWO BEAMS, THEREBY IMPROVING PROCESSING QUALITY AND INCREASING PROCESSING EFFICIENCY. THE LASER PROCESSING APPARATUS INCLUDES A BEAM SPLITTING MEANS (130) FOR DIVIDING THE LASER BEAM EMITTED FROM THE LASER GENERATION MEANS (120) INTO AT LEAST TWO BEAMS AND CAUSING THE RESULTANT BEAMS TO BE INCIDENT ON THE MIRROR. THE BEAM SPLITTING MEANS (130)COMPRISES A PRISM, BEAM SPLITTER OR A COMBINATION OF A PRISM AND A BEAM SPLITTER.
MYPI20064455A 2005-11-08 2006-11-06 Laser processing apparatus using laser beam splitting MY144488A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050106475A KR100709171B1 (en) 2005-11-08 2005-11-08 Laser processing apparatus using beam split

Publications (1)

Publication Number Publication Date
MY144488A true MY144488A (en) 2011-09-30

Family

ID=38023424

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20064455A MY144488A (en) 2005-11-08 2006-11-06 Laser processing apparatus using laser beam splitting

Country Status (4)

Country Link
KR (1) KR100709171B1 (en)
MY (1) MY144488A (en)
TW (1) TWI327498B (en)
WO (1) WO2007055452A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100817825B1 (en) * 2007-05-02 2008-03-31 주식회사 이오테크닉스 Laser machining apparatus
KR100864863B1 (en) 2007-05-09 2008-10-23 주식회사 이오테크닉스 Multi laser system
KR101057457B1 (en) 2008-11-03 2011-08-17 주식회사 이오테크닉스 Drilling device and drilling method
KR101339637B1 (en) * 2010-01-18 2013-12-09 주식회사 이오테크닉스 Laser Processing Apparatus and Method Using Beam Split
KR101209064B1 (en) 2011-05-19 2012-12-06 주식회사 엘에스텍 Apparatus for forming pattern on light guide panel
KR101826739B1 (en) * 2016-11-21 2018-02-08 주식회사 신도리코 3D printer using linear laser source
KR102618163B1 (en) 2016-12-05 2023-12-27 삼성디스플레이 주식회사 Laser processing apparatus
CN110328452B (en) * 2019-07-15 2024-05-14 广东华奕激光技术有限公司 Double-station laser cutting equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63148342A (en) * 1986-12-12 1988-06-21 Nec Corp System for counting loop execution time
JPH01186293A (en) * 1988-01-22 1989-07-25 Nec Corp Laser welding method
JPH01316415A (en) * 1988-06-17 1989-12-21 Nippon Steel Corp Laser beam heat treating method using polygon mirror and apparatus thereof
JPH08108289A (en) * 1994-10-07 1996-04-30 Sumitomo Electric Ind Ltd Optical device for laser beam machining
JPH1195773A (en) * 1997-09-17 1999-04-09 Yamaha Corp Karaoke machine
JP3194250B2 (en) 1998-12-25 2001-07-30 住友重機械工業株式会社 2-axis laser processing machine
JP2000288765A (en) 1999-04-02 2000-10-17 Murata Mfg Co Ltd Method and device for machining ceramic green sheet
KR100347766B1 (en) * 2000-02-17 2002-08-09 주식회사 이오테크닉스 Dividing apparatus of laser beam

Also Published As

Publication number Publication date
KR100709171B1 (en) 2007-04-18
TW200726565A (en) 2007-07-16
TWI327498B (en) 2010-07-21
WO2007055452A1 (en) 2007-05-18

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