MY140455A - Process for producing electronic components - Google Patents
Process for producing electronic componentsInfo
- Publication number
- MY140455A MY140455A MYPI20031841A MYPI20031841A MY140455A MY 140455 A MY140455 A MY 140455A MY PI20031841 A MYPI20031841 A MY PI20031841A MY PI20031841 A MYPI20031841 A MY PI20031841A MY 140455 A MY140455 A MY 140455A
- Authority
- MY
- Malaysia
- Prior art keywords
- electronic components
- die
- support
- active
- producing
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 230000010354 integration Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Micromachines (AREA)
- Wire Bonding (AREA)
- Packaging Frangible Articles (AREA)
Abstract
TO ACHIEVE AN INTEGRATION OF FUNCTIONAL STRUCTURES INTO THE PACKAGING OF ELECTRONIC COMPONENTS (1), A PROCESS IS PROVIDED FOR PRODUCING AN ELECTRONIC COMPONENT (1) WHICH COMPRISES AT LEAST ON SEMICONDUCTOR ELEMENT (3) WHICH HAS AT LEAST ON SENSORILLY ACTIVE AND/OR EMITTING DEVICES (7) ON AT LEAST ON SIDE, THE PROCESS COMPRISING THE STEPS OF: -PROVIDING AT LEAST ON DIE ON A WATER (35), -PRODUCING AT LEAST ON STRUCTURED (11) SUPPORT WHICH HAS AT LEAST ONE FUNCTIONAL STRUCTURE FOR THE SENSORILY ACTIVE AND/OR EMITTING DEVICES (7), -JOINING THE WAFER (35) TOGETHER WITH THE AT LEAST ON SUPPORT (19), SO THAT THE SIDE OF THE DIE WHICH HAS THE SENORILY ACTIVE AND/OR EMITTING DEVICE (7) IS FACING THE SUPPORT, AND -SEPARATING THE DIE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10222960A DE10222960A1 (en) | 2002-05-23 | 2002-05-23 | Making electronic component comprising semiconductor elements with device for sensing or emitting |
Publications (1)
Publication Number | Publication Date |
---|---|
MY140455A true MY140455A (en) | 2009-12-31 |
Family
ID=29432251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20031841A MY140455A (en) | 2002-05-23 | 2003-05-19 | Process for producing electronic components |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE10222960A1 (en) |
MY (1) | MY140455A (en) |
TW (1) | TWI230424B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100940943B1 (en) | 2001-08-24 | 2010-02-08 | 쇼오트 아게 | Method for producing electronics components |
DE102004049233A1 (en) | 2004-10-09 | 2006-04-20 | Schott Ag | Process for the microstructuring of substrates made of flat glass |
TWI463860B (en) * | 2010-08-04 | 2014-12-01 | Asia Tech Image Inc | Method for fixing lens set |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862231A (en) * | 1983-11-18 | 1989-08-29 | Harris Corporation | Non-contact I/O signal transmission in integrated circuit packaging |
US4875750A (en) * | 1987-02-25 | 1989-10-24 | Siemens Aktiengesellschaft | Optoelectronic coupling element and method for its manufacture |
GB9116307D0 (en) * | 1991-07-29 | 1991-11-06 | Philips Electronic Associated | Infrared detectors |
US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
DE19620940A1 (en) * | 1995-11-17 | 1997-05-22 | Werner Prof Dr Buff | Electronic component for e.g. high frequency resonator based on surface acoustic wave |
-
2002
- 2002-05-23 DE DE10222960A patent/DE10222960A1/en not_active Ceased
-
2003
- 2003-05-15 TW TW092113206A patent/TWI230424B/en not_active IP Right Cessation
- 2003-05-19 MY MYPI20031841A patent/MY140455A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE10222960A1 (en) | 2003-12-11 |
TWI230424B (en) | 2005-04-01 |
TW200408016A (en) | 2004-05-16 |
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