MY135343A - Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass - Google Patents

Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass

Info

Publication number
MY135343A
MY135343A MYPI20030326A MY135343A MY 135343 A MY135343 A MY 135343A MY PI20030326 A MYPI20030326 A MY PI20030326A MY 135343 A MY135343 A MY 135343A
Authority
MY
Malaysia
Prior art keywords
grinding
silicon
novel
glass
grinding wheel
Prior art date
Application number
Inventor
V C Venkatesh
Izman Sudin
E J Oles
Original Assignee
Univ Malaysia Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Malaysia Tech filed Critical Univ Malaysia Tech
Priority to MYPI20030326 priority Critical patent/MY135343A/en
Publication of MY135343A publication Critical patent/MY135343A/en

Links

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

THE GRINDING FACE OF A GRINDING COMPONENT IS A CONTINUOUS LAYER OF ABRAISE GRAINS ADHERING TO THE SUBSTRATE OF THE GRIDING COMPONENT. SAID ABRAISE GRAINS, PREFERABLY DIAMOND GRAINS ADHERES TO EACH OTHER AND THE SUBSTRATE IN ABSENCE OF BONDS AS FOUND IN BONDED GRINDING WHEELS. THE ABRASIVE LAYER HAS FINE GRIT, PREFERABLY 10 UM AND 5 UM AND ALMOST NON-EXISTENT POROSITY. THE EDGE OF THE DEPOSITED ABRASIVE LAYER HAS FACETTED GRAINS WHICH ACTS AS CUTTING EDGE IN DEFINE DELAYERING WORK. SAID GRINDING COMPONENT MAY BE EMBODIED AS ROTATING GRINDING COMPONENTS OR STATIONARY GRINDING COMPONENTS.FIG.1
MYPI20030326 2003-01-30 2003-01-30 Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass MY135343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI20030326 MY135343A (en) 2003-01-30 2003-01-30 Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20030326 MY135343A (en) 2003-01-30 2003-01-30 Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass

Publications (1)

Publication Number Publication Date
MY135343A true MY135343A (en) 2008-03-31

Family

ID=45891131

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20030326 MY135343A (en) 2003-01-30 2003-01-30 Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass

Country Status (1)

Country Link
MY (1) MY135343A (en)

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