MXPA97004428A - Mounting back cover interface connector / cable integration - Google Patents

Abstract

A shielded connector assembly for interconnecting individual conductors in an electrical preformed cabling is provided with a grounding ring, which eliminates the conduit cable segments shielding after the shielding of the individual conductor has been removed. A filter ring assembly is included in the connector assembly to filter high frequency signals to eliminate cross talk between the high and low frequency signal conductors in the same preformed cabling. The leakage transmission is also eliminated at the junction between the individual conductors and a circuit board included in the mount

Description

MOUNTING BACK COVER INTERFACE CONNECTOR / WIRING INTEGRATION TECHNICAL FIELD This invention relates to an electrical connector assembly for the interconnection for preformed cabling for each other or for electrical instruments. More particularly, this invention relates to a connector assembly, which eliminates signal leakage and the interconductor interface between high frequency and low frequency signal conductors in the preformed cabling.

ANTECEDENTS OF THE TECHNIQUE The utility of wiring / back plate, compact and interface systems for replacing bulky preformed wiring connectors for the interconnection of individual conductor cables in the preformed cabling to other units, has been described in U.S. Patent Nos. 5,244,417; 5,308,264; and 5,342,203, all granted to F.A. Perretta, et al., And all assigned to United Technologies Corporation. These interface systems use one or more semi-flexible circuit boards, which are placed in an EMI shielding housing and are operable to provide the conductive wire connections of the EMI environment. -These references describe a conductive ring to ground, which provides a minimum inter-conductor of unshielded window inside the rear cover of the housing. Signal leakage from the individual conductors is minimized, but can still occur in unshielded conductor segments between the stripped shield and the ground ring. Signal leakage can also occur from the unlined ends of the conductor wires, which project from the circuit boards to the board / cable connections. From this fez-a, potentially undesirable amounts of leakage signals may occur within the shielding interface housing. The patents mentioned in the foregoing, particularly the patent 5,342,203, disclose the use of filter capacitors mounted on the circuit wiring and operable to filter the interconductor signal through the talk which must in any other way occur between wire conductor paths. High and low frequency signal inside the circuit board. The aforementioned structure minimizes the cross-talk interconducting signal path within the circuit board, but does not direct the entire interconductor through cross-talk, such as the wires of the stripped conductor between the cross talk of the board pre-circuit inside the armored interface housing. From the above, it will be noted that the increase, at an important potential, the signal leaks and / or the cross talk may occur within the interface housing. It would be advantageous to provide preformed wiring at the interface of the housing assembly, which could completely eliminate the signal leakage within the housing assembly, as well as eliminate the cross-talk interconducting cable signal within the mounting housing.

DESCRIPTION OF THE INVENTION This invention relates to a back cover interface of preformed cables and connector assembly, which is compact and lightweight in the manner described in the patents mentioned above and which eliminates all signal leakage and conductive cross-talk between high frequency and low frequency signal conductors, whose leakage and cross talk may occur within the rear cover / interface connector assembly. The interface assembly of this invention includes a first ground ring for the individual conductor wires, which have been stripped from their woven armor, whose ground ring provides a zero-flush window for the conductor wires, since they are threaded in the interface housing. In this way, signal leakage can not occur when the lead wires are inserted into the interface assembly. The interface assembly of this invention also includes a second ground ring, which connects the bare ends of the insulation of each of the conductor cables on one side of the circuit board to earth. The second ground ring eliminates signal leakage from the unlined, uninsulated ends of the individual conductor cables. Still further, the interface assembly of this invention includes a signal filtering sub-assembly, comprising a ring which includes an array of openings through which each of the lead wires are threaded. The openings through which the high-frequency conductive cables pass are provided with signal filtration inserts, whose inserts are operative to filter high-frequency signal emissions from the shield-unlined conductors to selectively remove the cross talk of high frequency signal transmission conductors to low frequency signal transmission conductors within the interface assembly.

Therefore, an object of the invention is to provide an improved preformed to wiring back cover interface assembly which eliminates significant leakage within the housing of the back cover. It is another object of this invention to provide a pre-formed wiring back cover interface assembly of the described character, which eliminates cross-talk from the high frequency signal conductor to low frequency signal drivers within the back cover housing. It is a further object of this invention to provide a preformed wiring back cover interface assembly of the described character which is easily assembled. These and other objects and advantages of the invention will become more readily apparent from the following detailed description of a preferred embodiment thereof, when taken together with the accompanying drawings, in which: BRIEF DESCRIPTION OF THE DRAWINGS FIGURE 1 is a fragmentary side elevational view, taken partially in section of an outer shell interface assembly with preformed wiring, formed in accordance with this invention; and FIGURE 2 is an exploded, perspective view of the components of the ground ring of the assembly of FIGURE 1.

BEST MODE FOR CARRYING OUT THE INVENTION Now with reference to the drawings, there is shown in FIGURE 1, a rear cover interface assembly of preformed cabling, generally represented by the number 2, which is formed in accordance with this invention. The preformed wiring 4 has an outer twisted wire liner 6, which shields the individual conductor wires, which are placed inside the liner 6, from the EMI environment. The outer liner 6 of the individual, inner conductor cables 8 inside a reinforcement 10 formed on a cover plate 12, which forms a part of the housing of the rear cover 14. A connecting sleeve 16 is placed inside the reinforcement 10 and under the unlined end 5 of the outer skin 6. A fastener ring 18 encompasses the outer skin 6 and is fastened on the liner 6 within the reinforcement 10. A member 20 which releases the threaded tension on the external threaded surface 22 on the reinforcement 10, to secure the preformed wiring 4 to the plate 12 of the housing cover of the back cover. The rear cover housing 14 is formed of a pair of halves 24 and 26 of complementary grooves, which engage with each other to form the closed, annular side wall of the housing. The two halves 24 and 26 are secured together by a plurality of screws 28, which are screwed into threaded holes 30 in the halves 24 and 26 to hold the cover plate 12 to both halves of the housing 24 and 26. The individual conductor cables 8 pass through an opening 32 in the cover plate 12. The housing halves 24 and 26 are provided with a scaled hole 34 in which a cup-shaped filter ring member 36 sits. The filter ring 36 has an enlarged, central opening 38 through which the lower frequency signal conducting wires 8 pass. The filter ring 36 also has a plurality of restricted, outwardly spaced, high frequency openings. The restricted openings 40 contain annular capacitor filters 42, which surround the signal cables 8 'of higher frequency and serve to filter the cross-talk interference of high frequency. This protects the lower frequency lines 8 that are exposed to high frequency interference noise, commonly referred to as "cross talk". All cables 8 and 8 'individual conductors are stripped from their individual protective shells 9 and the unlined wires are fed into a ground ring 44, which is secured to the halves 24 and 26 of the housing and connected to ground by the reason that halves 24 and 26 of the housing that are connected to ground for any vehicle or site of assembly 2 is used. The details of the grounding ring 44 are shown in FIGURE 2. The grounding ring 44 includes an annular projection 46 having a plurality of holes 48 for receiving fastening screws. (not shown) which are used to hold the ring 44 of ground connection to halves 24 and 26 of the housing. The projection 46 abuts the housing 14 in such a manner as to provide the desired electrical ground connection for the ring 44. The ring 44 includes a hub 50, which projects into the housing 14. The hub 50 includes an arrangement of fingers 52 projecting annularly through which the unlined lead wires pass. The liners 9 of the unlined individual conductor are oscillated on the outside of each of the fingers 52. The use of a grounding ring 44, which has a projection or projections extending to and receiving the conductive wires. unlined, while also providing direct contact with the liners 9 of the conductor cable, ensuring that there is no unprotected increase of the conductor wires between the individual conductor shells 9 and the grounding ring 44. The grounding ring 44 in this manner does not allow any signal leakage from the individual unlined lead wires as the lead wires enter the circuit board while maintaining the component 54 of the assembly 2 (shown in FIGURE 1). Referring again to FIGURE 1, the housing component 54 contains one or more semiflexible circuit boards 56. The housing 54 is operable to provide the components, which are contained in the EMI environment. The housing component 54 is connected to ground when it is secured to the housing 14 connected to ground by means of the same screws securing the grounding ring 44 to the housing 14. The housing 54 includes a removable cover plate 58, which it allows access to the interior of the housing 54. The semiflexible circuit board 56 includes opposite rigid end portions 60 and an intermediate flexible portion 62. The lead wire or tip connections are made with circuit board 56 at the rigid ends 60 and the flexible portion 62 contains conductive paths, which extend between the end portions 60.

FIGURE 2 shows details of a semiflexible circuit board 56, typical. The rigid end 60 of the board 56 includes an annular ring metal ring 64 with an opening arrangement 66. The openings 66 receive the screws, which are secured to the ring 44 for ground connection to the housing 14, in that the board 56 is secured to the rest of the assembly with the metal ring 64 which is placed face to face in contact with the projection 46 of the ring 44 for ground connection. The metal ring 64 in this manner serves as a ground transfer through the board 56. The end 60 of the board 56 also includes a plurality of embedded, conductive metal rings 68, to which the unlined metal conducting wires are located. soldiers, or connected in any other way. The rings 68 are electrically connected to the conductive paths (not shown) which extend through the flexible path 62 of the board 56. When the unlined lead wires are soldered to the circuit board rings 68, the unlined ends of the cables can project beyond the distal side of the rigid end 60 of circuit board 56. When this occurs, exposed unlined conductor leads produce potential signal leakage paths. When more than one circuit board 56 is included in the assembly, an intermediate ground transfer disk 70 has holes 74 through which the individual unlined conductors can pass to the subsequent circuit boards 56. The disc 70 also includes openings 72 for the passage of the securing screws mentioned in the above. Any of the unlined cables that may extend beyond the last circuit board 56 in assembly 2, will be projected into a grounding cap 76, which includes an exterior projection 78 (shown in FIGURE 2), which includes screw securing holes 80. The grounding cap 76 makes butt contact with the components 60 or 70 described in the above, as included, to be electrically connected to the housing 14 for the purposes of grounding. The grounding cap 76 includes an arrangement of blind holes 82, which are aligned with respect to the rings 68 of the circuit board. In this way, each of the rings 68 of the circuit board has a respective blind hole 82, aligned in the cover 76 for ground connection. Some ends of the unlined conductive cables may project beyond the rings 68 of the circuit board or the earthing ring openings 74 in the event that a grounding ring 70 is included in the assembly. Any such projection of the ends of the conductor cable will be placed at a respective end of the blind holes 82 in the grounding cap 76. In this way, any leakage of signal emitted by such ends of the unlined conductor, will go to ground through the grounding cover 76. The noise of the interconductor cable caused by signal leakage from unlined cables in this way it is eliminated from the connector assembly 2. It will be noted that the inclusion of the filter ring and the filters in the connector assembly eliminates the cross talk of the high frequency signal of the conductor at low frequency. The use of the grounding ring eliminates the interconducting noise caused by the signal leakage from unlined conductors that enter the connector assembly from the preformed wiring. Finally, the use of the unlined conductor cable of the grounding cap eliminates the interconducting noise caused by the signal leakage from the ends of the unlined conductor cable projecting from the current boards. The assembly of this invention in this way is capable of eliminating the interconducting noise caused by leakage of the unlined wire signal and is also capable of eliminating cross-talk interference of high frequency at low frequency. The connector assembly of this invention will thus eliminate all interference from the interconductor, which may occur within the assemblies of the back cover connector, which were described in the patents identified first in the foregoing. Since many changes and variations of the described embodiments of the invention can be made without departing from the inventive concept, it is not intended to limit the invention in any other way than that required by the appended claims.

Claims (8)

1. An interface system for the interconnection of individual signal cables to at least one multiconductor path circuit board in earthing environments, comprising an EMI environment shield housing, which is connected to the ground at ambient to ground and in which the circuit board is placed and a preformed wiring with shielding for EMI environment, containing the individual signal conducting wires, each of the signal conducting wires having their own shielding lining, characterized by a grounding ring secured to the housing and electrically grounded by the housing, the grounding ring having a first surface in abutting contact with the plurality of conduits through which the individual unlined conductors are extend before being connected to the circuit board and the grounding ring that includes a second s The distal surface of the first surface, the second surface of which is projected towards the preformed wiring and extends below the individual shielding shells, so that the second surface serves to electrically connect to the ground the unlined conductor wires internally of their sheaths. individual shielding.

2. The interface system according to claim 1, characterized in that the second surfaces on the grounding ring include a hub and a plurality of tubular projections on the hub through which the unlined individual lead wires pass and the The tubular projection extends below the unlined lining, to separate the unlined wires from their respective shield linings.

3. The interface system according to claim 1, characterized in that the system includes a # housing mounted on the hub of the ring connected to earth, the housing is also connected to the EMI shield housing and also the housing covers and protects the second surface on the ground connection ring.

4. The interface system according to claim 3, characterized in that the housing is also a split ring housing formed by a pair of complementary split halves.

5. The interface system according to claim 3, characterized in that the system includes a filter ring placed in another housing, the filter ring includes restricted conduits through which the high frequency signal transmission conductor cables extend, the restricted ducts containing the filters which are operable to avoid cross-talk of the cable and the low frequency high frequency interconductor within the interface system.

6. The interface system according to claim 5, characterized in that the filter ring includes at least one additional conduit through which the low frequency signal transmission conductor cables extend.

7. The interface system according to claim 1, characterized in that the system includes a grounding cap placed on one side of the distal circuit board of the grounding ring, whose grounding cover is electrically grounded To the grounding ring, the grounding cap has a plurality of blind conduits in which each blind conduit are positioned in such a way that they receive individual increments of the unlined conductor wire, which can be projected beyond the circuit board , so that the ground connection cover is operable to eliminate the interference of the interconnecting cable of the post-circuit board, caused by signal emissions from the projection of the unlined conductor cable increments.

8. The interface system according to claim 6, characterized in that the system includes a grounding cap placed on one side of the circuit board, distal of the grounding ring, to which the grounding cover is electrically grounded to the grounding ring, the The grounding cap has a plurality of blind conduits in it, these blind conduits are placed in such a way that they receive individual increment of unlined conductor wires, which can be projected beyond the circuit board, so the connection cover to ground is operable to eliminate the post-circuit board in the interconnected cable interference, by signal emissions from the increments of the conductor cable without projecting lining.