MXPA04010290A - Sistema calentador/enfriador controlado por microprocesador. - Google Patents

Sistema calentador/enfriador controlado por microprocesador.

Info

Publication number
MXPA04010290A
MXPA04010290A MXPA04010290A MXPA04010290A MXPA04010290A MX PA04010290 A MXPA04010290 A MX PA04010290A MX PA04010290 A MXPA04010290 A MX PA04010290A MX PA04010290 A MXPA04010290 A MX PA04010290A MX PA04010290 A MXPA04010290 A MX PA04010290A
Authority
MX
Mexico
Prior art keywords
thermal electric
cavity
electric module
module
heater
Prior art date
Application number
MXPA04010290A
Other languages
English (en)
Inventor
Randolph Bruce
Original Assignee
Vector Prod Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vector Prod Inc filed Critical Vector Prod Inc
Publication of MXPA04010290A publication Critical patent/MXPA04010290A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0211—Control thereof of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2400/00—General features of, or devices for refrigerators, cold rooms, ice-boxes, or for cooling or freezing apparatus not covered by any other subclass
    • F25D2400/12—Portable refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D99/00—Subject matter not provided for in other groups of this subclass
    • F27D99/0001—Heating elements or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un sistema calentador/refrigerante portatil que comprende un modulo electrico termico que conduce una corriente a traves del modulo; una cavidad calentadora/refrigerante acoplada al modulo electrico termico; un ventilador de velocidad variable para impulsar aire sobre el modulo electrico termico al interior de la cavidad; un primer detector de temperatura acoplado al modulo electrico termico para medir la temperatura del modulo; un segundo detector de temperatura acoplado a la cavidad calentadora/refrigerante para medir la temperatura en la cavidad; y un microprocesador para ajustar la velocidad de ventilador y el flujo de corriente a traves del modulo electrico termico como una funcion de las temperaturas medidas del modulo electrico termico y de la cavidad.
MXPA04010290A 2002-04-17 2003-04-17 Sistema calentador/enfriador controlado por microprocesador. MXPA04010290A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37273402P 2002-04-17 2002-04-17
US10/280,036 US6744021B2 (en) 2002-04-17 2002-10-25 Microprocessor controlled heater/cooler system
PCT/US2003/012092 WO2003090497A2 (en) 2002-04-17 2003-04-17 Microprocessor controlled heater/cooler system

Publications (1)

Publication Number Publication Date
MXPA04010290A true MXPA04010290A (es) 2005-02-17

Family

ID=29218657

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA04010290A MXPA04010290A (es) 2002-04-17 2003-04-17 Sistema calentador/enfriador controlado por microprocesador.

Country Status (6)

Country Link
US (1) US6744021B2 (es)
EP (1) EP1576853A2 (es)
AU (1) AU2003225067A1 (es)
CA (1) CA2482668A1 (es)
MX (1) MXPA04010290A (es)
WO (1) WO2003090497A2 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM286410U (en) * 2005-07-22 2006-01-21 Channel Well Technology Co Ltd Power supply with a cooling function
US9151679B2 (en) * 2008-06-30 2015-10-06 Intel Corporation Temperature measurement in electronic devices
WO2010085691A1 (en) * 2009-01-22 2010-07-29 Hoffman Enclosures Inc. Thermoelectric management unit
US9739512B2 (en) * 2010-08-09 2017-08-22 Empire Technology Development Llc Control system for thermoelectric devices
KR101181096B1 (ko) * 2010-08-30 2012-09-07 기아자동차주식회사 차량의 공조 시스템
US10485146B2 (en) 2016-05-27 2019-11-19 Toshiba International Corporation Environmental control for medium-voltage drive

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5683294A (en) * 1992-11-27 1994-06-22 Pneumo Abex Corporation Thermoelectric device for heating and cooling air for human use
US5871526A (en) 1993-10-13 1999-02-16 Gibbs; Roselle Portable temperature control system
US5666742A (en) 1993-12-10 1997-09-16 The Laitram Corporation Temperature modification assemblies
US5653741A (en) 1995-08-22 1997-08-05 Grant; Edward F. Heating and cooling pad
US5613364A (en) 1995-10-06 1997-03-25 Pou, Inc. Compact replaceable temperature control module
US5640852A (en) * 1995-10-06 1997-06-24 Atlas; Boris Compact thermal electric heat exchanger
JP3866059B2 (ja) * 2001-07-09 2007-01-10 富士通株式会社 温度制御装置、温度制御方法及びデバイス

Also Published As

Publication number Publication date
AU2003225067A8 (en) 2003-11-03
EP1576853A2 (en) 2005-09-21
CA2482668A1 (en) 2003-10-30
US6744021B2 (en) 2004-06-01
AU2003225067A1 (en) 2003-11-03
WO2003090497A2 (en) 2003-10-30
WO2003090497A3 (en) 2006-01-05
US20030197004A1 (en) 2003-10-23

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