MXPA00007317A - Chip card module for biometric sensors - Google Patents

Chip card module for biometric sensors

Info

Publication number
MXPA00007317A
MXPA00007317A MXPA/A/2000/007317A MXPA00007317A MXPA00007317A MX PA00007317 A MXPA00007317 A MX PA00007317A MX PA00007317 A MXPA00007317 A MX PA00007317A MX PA00007317 A MXPA00007317 A MX PA00007317A
Authority
MX
Mexico
Prior art keywords
integrated circuit
sensor
carrier
card module
circuit card
Prior art date
Application number
MXPA/A/2000/007317A
Other languages
Spanish (es)
Inventor
Jurgen Fischer
Manfred Fries
Detlef Houdeau
Original Assignee
Fischer Juergen
Manfred Fries
Detlef Houdeau
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fischer Juergen, Manfred Fries, Detlef Houdeau, Siemens Aktiengesellschaft filed Critical Fischer Juergen
Publication of MXPA00007317A publication Critical patent/MXPA00007317A/en

Links

Abstract

The invention relates to a chip card module (4) for biometric sensors for installing in chip cards (1). A support (5) has at least one continuous window (9) in the area of a sensor chip (10). Said sensor chip (10) is fixed to the support (5) in such a way that the active surface (11) of the sensor chip (10) is oriented towards the support (5) and is situated in the area of the window (9) of the support (5) so that it can be accessed through said window (9).

Description

INTEGRATED CIRCUIT BOARD MODULE FOR BIOMETRIC SENSORS FIELD OF THE INVENTION The invention relates to a module of integrated circuit cards for biometric sensors that are used in integrated circuit cards. BACKGROUND OF THE INVENTION In areas where individual identification of people is reached, multiple sensors are used, which work with the help of biometric procedures and can recognize biological characteristics of a person, for example, a digital impression. The digital printing sensors can be used to verify the right of access of a person in security zones of banks, research work, military installations, etc., where depending on the result of the verification is allowed or not the passage to the spaces , computers, etc. It is known to use, as digital printing sensors, sensor integrated circuits, which are so arranged in apparatuses or walls that a finger can be applied. In addition, integrated circuit cards are known in the form of right of entry letters or bank ATM cards, which in connection with a secret number provided open a door or allow access to a bank account. Such integrated circuit cards, however, do not work with biometric sensors and do not meet high safety requirements against illegal use. The use of a digital printing sensor is proposed in a body in the form of a card in EP-A-0789 334. SUMMARY OF THE INVENTION The invention proposes the basic task of creating an integrated circuit card module for biometric sensors , which is usable to be put on integrated circuit cards. This task is solved according to the invention by the features of claim 1. Advantageous embodiments of the invention are described in the other claims. In the integrated circuit card module according to the invention, the sensor integrated circuit is fixed to a carrier in the form of a plate or sheet having an electrically conductive area that is on the one hand connected to the sensor integrated circuit, and another with electrical connections of the integrated circuit card. The carrier has at least one transparent advantage in the region of the integrated circuit, in addition there is the sensor integrated circuit so fixed to the carrier that the active structure of the sensor integrated circuit is directed towards the carrier and remains in the area of the window , so that it is reachable through the carrier window. The integrated circuit card module according to the invention allows to install biometric sensors integrated circuits in integrated circuit cards, with this the security of conventional integrated circuit cards can be increased several times. The integrated circuit card is inserted in both a reading device that the window with the sensor integrated circuit is still freely accessible. From the reading device, the integrated circuit board module then obtains the energy needed for capturing the digital print, where the data of the sensor integrated circuit and, where appropriate, can be provided to a semiconductor integrated circuit integrated in the integrated circuit card. It serves as an evaluation device. Such integrated circuit cards can be realized as contactless or contactless integrated circuit cards. On contactless integrated circuit cards, power and data are supplied via inductive / capacitive coupling. It is particularly advantageous if the integrated circuit card module according to the invention can be mounted in a band in the same way as is usual in the integrated circuit card technology and can be checked and then checked in a frame. Subsequent processing process can be put on the pre-made integrated circuit board. To put on the integrated circuit card, the usual mounting technique can be used as it is used in the so-called combined integrated circuit modules, that is, in integrated circuit modules simultaneously without contact as well as adhered to the contact. The electrical function of the sensor integrated circuit or of the entire integrated circuit module can be tested before being placed on the integrated circuit board. In this way the integration in the manufacturing process, is easy and economical. According to an advantageous embodiment, the sensor integrated circuit is subdivided into multiple individual segments, each time remaining in the area of a window specific to the carrier. The division of the integrated circuit sensor into several individual segments, has the advantage that the danger of breaking the integrated circuit sensor relatively large and thus sensitive to breakage, which in case of a digital printing sensor is necessary, can be significantly reduced. Advantageously, the integrated circuit card module is addable in the edge region of the carrier with a flexible adhesive with the material of the integrated circuit card. With this, the harmful influence of the bending stresses of the integrated circuit card in the integrated circuit card module can be reduced. According to one embodiment suitable for the intended purpose, the electrically conductive zones of the integrated circuit card module between the electrical connections of the integrated circuit card and the integrated circuit sensor consist of at least one conductive tracks driven at least in meandering part. Such conductive tracks conducted in the form of meanders offer a corresponding flexibility to take the bending stresses in large-area sensor integrated circuits, without damaging the electrical functions. BRIEF DESCRIPTION OF THE DRAWINGS The invention is explained below by way of example by means of the drawings. In these shows: FIGURE 1, a cross section of the integrated circuit card module according to the invention that is placed in a corresponding collapse in an integrated circuit card. FIGURE 2, a schematic perspective view of the integrated circuit card module inclined from above.
FIGURE 3, a plan view on the conductive track conducted in a meander shape extending from the outer connection of the integrated circuit card module to the sensor integrated circuit, and FIGURE 4, a schematic plan view in a module integrated circuit card with an integrated sensor circuit divided into four individual segments and a carrier that has four corresponding windows. DETAILED DESCRIPTION OF THE INVENTION FIG. 1 shows a section of an integrated circuit card 1 with a depression 3 applied to its surface 2, in which an integrated circuit card module 4 is placed. integrated circuits 4 presents a carrier in the form of plate or sheet 5, consisting of a layer of epoxide resin 6, an upper conductive layer 7, and regions or lower conductive areas 8, in the center of the carrier 5, a notch has been provided through which forms a rectangular window 9. On the underside of the carrier 5, an integrated circuit sensor 10 is provided, which has an upper active surface 11, this surface 11, is constructed as a sensor surface, which is in a position to recognize the digital impression of a finger placed on the active surface 11, and provide the structure of the digital impression in the form of electrical impulses to an evaluating unit that is not represented exactly. The sensor integrated circuit 10 is somewhat larger than the window 9, and is arranged directly below the window 9, so that the active surface 11 can be directed to the window 9 and the sensor integrated circuit 10 can be fixed in the edge area of the carrier 5 next to the window 9. The electrical connections of the sensor integrated circuit 10 are connected by means of the integrated circuit contact points 12 to the coordinated conductive areas 8 of the carrier 5, where these contact positions integrated circuit 12, are located in the edge area next to the window 9. The electrical connection between the integrated circuit card module 4 and the conductive tracks 13 of the integrated circuit card 1, are made by means of external connections 14 , which are between the conductive tracks 13 of the integrated circuit card 1 and the conductive zones 8 of the integrated circuit card module. Between the external connections 14 and the contact positions of integrated circuits 12, there is also a stiffening element 15 in the form of a rigid ring which is applied from below on the carrier 5. All the integrated circuit card module 14, it adheres by means of a flexible adherent 16 in a raised edge region of the recess 3. This flexible adherent 16 has a flexibility and sufficient thicknesses, so that it is in a position to provide a flexing of the integrated circuit card 1. With this the relatively rigid integrated circuit card module 4, and especially the integrated circuit sensor 10, is prevented from being damaged. In order to prevent corresponding bending voltages from being transmitted from the external connections 14, by the conductive zones 8 to the integrated circuit contact positions 12 and from there to the integrated circuit sensor 10, it is possible to construct the conductive zones 8 as conducting tracks which they run in a meander shape of which an example is shown as a plan view in Fig. 3. Fig. 2 shows a schematic perspective view of the integrated circuit card module 4 of Fig. 1. The conductive layer upper 7, forms a measuring frame that circulates around the window 9. In this embodiment, a single window 9 is provided on the carrier 4, which is large enough to cover a complete digital print. In Fig. 4, a schematic plan view of an alternative embodiment of the invention is shown, in which the integrated sensor circuit 10 is divided into four segments 10a, 10b, 10c, 10d. These segments 10a, 10b, 10c, 10d are quadratic in the example of embodiment shown and of the same size, where their outer contours are indicated by points. In the use of an integrated circuit sensor of this type divided into four parts, the window 9 of the carrier 5 can also be divided into four, that is, the window 9 has four individual windows 9a, 9b, 9c, 9d, which are also quadratic and arranged in such a way that in together they produce a larger square. The windows 9a, 9b, 9c, 9d are separated from each other by rods 17 of the carrier 5 which together form a central cross. The rods 17 serve to fix the segments 10a, 10b, 10c, 10d of the sensor integrated circuit 10. By segmenting the integrated circuit sensor 10, a certain flexibility of the sensor 10 is guaranteed, so that the danger of rupture it decreases in a flexion of the integrated circuit card 1. If a finger is placed in the window segments 9a, 9b, 9c, 9d, the digital printing lines, which by reason of the rods 17, can only be picked up interrupted they increase electronically, so that a digital print can be valued in the same way as if the rods 17 were not present.

Claims (4)

  1. NOVELTY OF THE INVENTION Having described the invention as above, property is claimed as contained in the following: REVIVAL ICS 1.- Integrated circuit card module for biometric sensors to be installed on integrated circuit cards, with at least one integrated circuit sensor as a sensor, a carrier in the form of a plate or sheet on which the sensor integrated circuit is fixed, and which has electrical conductive areas that are connected on the one hand by the sensor integrated circuit and on the other hand with electrical connections of the card of integrated circuits, where the carrier in the sensor integrated circuit area has at least one transparent window and the sensor integrated circuit is fixed in such a way in the carrier that the active surface of the integrated sensor circuit is directed to the carrier and remains in the area of the window, so that through the window of the carrier is achievable.
  2. 2. Integrated circuit card module according to claim 1, characterized in that the sensor integrated circuit is sub-divided into several individual segments that are each time in the region of a window segment of the carrier itself.
  3. 3. Integrated circuit card module according to claim 1, characterized in that the integrated circuit card module is adhered to the edge areas of the carrier 5 with a flexible adhesive with the integrated circuit card material. .
  4. 4. Integrated circuit card module according to one of the preceding claims, characterized in that the electrically conductive areas of the integrated circuit card module between the electrical connections of the integrated circuit card and the sensor integrated circuit consist of conductive tracks. made at least partly in the form of a meander.
MXPA/A/2000/007317A 1998-01-27 2000-07-26 Chip card module for biometric sensors MXPA00007317A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803020.7 1998-01-27

Publications (1)

Publication Number Publication Date
MXPA00007317A true MXPA00007317A (en) 2002-07-25

Family

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