MX9708604A - Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos. - Google Patents
Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos.Info
- Publication number
- MX9708604A MX9708604A MX9708604A MX9708604A MX9708604A MX 9708604 A MX9708604 A MX 9708604A MX 9708604 A MX9708604 A MX 9708604A MX 9708604 A MX9708604 A MX 9708604A MX 9708604 A MX9708604 A MX 9708604A
- Authority
- MX
- Mexico
- Prior art keywords
- dielectric layer
- polyimidebenzoxazole
- wiring board
- printed wiring
- pibo
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/18—Polybenzimidazoles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Una película de poliimidabenzoxazol (PIBO) que tiene una capa eléctricamente conductiva adherida a cuando menos una superficie a la misma, en donde la película de poliimida-benzoxazol tiene una resistencia a la traccion mayor de 200 MPa. Un tablero de circuitos impresos que tiene cuando menos una capa dieléctrica y cuando menos una capa de circuitos en donde cuando menos una capa dieléctrica es una película de poliimidabenzoxazol. Un tablero de circuitos impresos (PWB) que tiene cuando menos una capa de poliimidabenzoxazol (PIBO) en donde un tablero de circuitos impresos tiene cuando menos una capa delgada de material de base dieléctrico, cuando menos un conductor delgado, y cuando menos una anchura de conductor estrecha y cuando menos una vía de diámetro pequeño.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/437,710 US5670262A (en) | 1995-05-09 | 1995-05-09 | Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
PCT/US1996/006202 WO1996036204A1 (en) | 1995-05-09 | 1996-05-02 | Printed wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9708604A true MX9708604A (es) | 1998-02-28 |
Family
ID=23737561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9708604A MX9708604A (es) | 1995-05-09 | 1996-05-02 | Tablero(s) de circuitos impresos que tiene capa(s) dielectricas de poliimidabenzoxazol y la fabricacion de los mismos. |
Country Status (8)
Country | Link |
---|---|
US (1) | US5670262A (es) |
EP (1) | EP0826294A1 (es) |
JP (2) | JP3979607B2 (es) |
KR (1) | KR100448296B1 (es) |
CN (1) | CN1093366C (es) |
CA (1) | CA2219124C (es) |
MX (1) | MX9708604A (es) |
WO (1) | WO1996036204A1 (es) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
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US6099939A (en) * | 1995-04-13 | 2000-08-08 | International Business Machines Corporation | Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US6207595B1 (en) * | 1998-03-02 | 2001-03-27 | International Business Machines Corporation | Laminate and method of manufacture thereof |
US6174405B1 (en) | 1998-09-11 | 2001-01-16 | Northrop Grumman Corporation | Liquid crystal polymer in situ coating for co-cured composite structure |
IL132834A (en) * | 1998-11-23 | 2006-06-11 | Micro Coating Technologies | Production of capacitors with a thin layer |
US6207522B1 (en) * | 1998-11-23 | 2001-03-27 | Microcoating Technologies | Formation of thin film capacitors |
US6488198B1 (en) * | 1999-07-01 | 2002-12-03 | International Business Machines Corporation | Wire bonding method and apparatus |
US20020152955A1 (en) * | 1999-12-30 | 2002-10-24 | Yezdi Dordi | Apparatus and method for depositing an electroless solution |
US7061084B2 (en) * | 2000-02-29 | 2006-06-13 | Advanced Semiconductor Engineering, Inc. | Lead-bond type chip package and manufacturing method thereof |
US6528145B1 (en) * | 2000-06-29 | 2003-03-04 | International Business Machines Corporation | Polymer and ceramic composite electronic substrates |
US6923919B2 (en) * | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
US20040247921A1 (en) * | 2000-07-18 | 2004-12-09 | Dodsworth Robert S. | Etched dielectric film in hard disk drives |
KR20030053466A (ko) * | 2001-01-24 | 2003-06-28 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 기판 위에 트랙을 제조하는 방법 |
TW555787B (en) * | 2001-10-25 | 2003-10-01 | Ind Tech Res Inst | Synthesis of poly(imide-benzoxazole) copolymer |
US6819373B2 (en) * | 2002-10-03 | 2004-11-16 | International Business Machines Corporation | Lamination of liquid crystal polymer dielectric films |
JP2005112891A (ja) * | 2003-10-03 | 2005-04-28 | Toyobo Co Ltd | 半導体実装用フィルムサブストレート |
ATE417073T1 (de) * | 2003-12-26 | 2008-12-15 | Toyo Boseki | Polyimidfolie |
US7145221B2 (en) * | 2004-03-31 | 2006-12-05 | Endicott Interconnect Technologies, Inc. | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
US7078816B2 (en) * | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
US7270845B2 (en) * | 2004-03-31 | 2007-09-18 | Endicott Interconnect Technologies, Inc. | Dielectric composition for forming dielectric layer for use in circuitized substrates |
JP4590982B2 (ja) * | 2004-04-21 | 2010-12-01 | 日立化成工業株式会社 | 樹脂付き金属箔 |
JP2007106836A (ja) * | 2005-10-12 | 2007-04-26 | Toyobo Co Ltd | シラン変性ポリアミド酸樹脂組成物 |
US20070120089A1 (en) * | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
CN100355810C (zh) * | 2006-07-14 | 2007-12-19 | 哈尔滨工业大学 | 一种含噁唑环聚酰亚胺及其合成方法 |
TWI304719B (en) * | 2006-10-25 | 2008-12-21 | Phoenix Prec Technology Corp | Circuit board structure having embedded compacitor and fabrication method thereof |
TWI334747B (en) * | 2006-12-22 | 2010-12-11 | Unimicron Technology Corp | Circuit board structure having embedded electronic components |
US20100012354A1 (en) * | 2008-07-14 | 2010-01-21 | Logan Brook Hedin | Thermally conductive polymer based printed circuit board |
JP5126555B2 (ja) | 2008-12-19 | 2013-01-23 | 東洋紡株式会社 | 積層体およびその製造方法、積層体回路板 |
JP5152104B2 (ja) * | 2009-06-08 | 2013-02-27 | 東洋紡株式会社 | 積層体およびその製造方法 |
US8051560B2 (en) * | 2009-10-16 | 2011-11-08 | Unimicron Technology Corp. | Method of fabricating a solder pad structure |
JP5486020B2 (ja) * | 2010-01-13 | 2014-05-07 | 三菱電機株式会社 | 回路基板およびその製造方法 |
WO2012141293A2 (ja) | 2011-04-15 | 2012-10-18 | 東洋紡績株式会社 | 積層体とその製造方法および、この積層体を用いたデバイス構造体の作成方法 |
CN103502005B (zh) | 2011-04-15 | 2015-05-06 | 东洋纺株式会社 | 层叠体、其制造方法及使用其的器件结构体的制造方法 |
KR101531737B1 (ko) * | 2011-06-30 | 2015-06-25 | 코오롱인더스트리 주식회사 | 폴리아믹산,폴리아믹산 용액,폴리이미드 보호층 및 폴리이미드 필름 |
TWI460211B (zh) * | 2012-04-20 | 2014-11-11 | Taimide Technology Inc | 芳香族聚醯亞胺膜、其製備方法、及其應用 |
EP2865523B1 (en) | 2012-06-20 | 2018-06-06 | Toyobo Co., Ltd. | Process for producing layered product and layered product |
KR20140083233A (ko) * | 2012-12-26 | 2014-07-04 | 코오롱인더스트리 주식회사 | 폴리아믹산 용액, 이미드화막 및 표시소자 |
JP5610018B2 (ja) * | 2013-03-28 | 2014-10-22 | 東洋紡株式会社 | 多層フッ素樹脂基板 |
JP6293457B2 (ja) * | 2013-11-12 | 2018-03-14 | 学校法人東邦大学 | ポリイミドおよび耐熱性フィルム |
DE102014118464A1 (de) * | 2014-12-11 | 2016-06-16 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Leiterplatte mit einem asymmetrischen Schichtenaufbau |
CN106827693B (zh) * | 2016-12-06 | 2018-12-04 | 太仓大唐化纤厂 | 一种耐用型导电纤维板材 |
CN108314782A (zh) * | 2017-01-16 | 2018-07-24 | 臻鼎科技股份有限公司 | 树脂组合物及应用该树脂组合物的聚酰亚胺膜及电路板 |
US11342256B2 (en) * | 2019-01-24 | 2022-05-24 | Applied Materials, Inc. | Method of fine redistribution interconnect formation for advanced packaging applications |
JP7370145B2 (ja) * | 2019-03-06 | 2023-10-27 | 太陽ホールディングス株式会社 | 感光性樹脂組成物 |
IT201900006740A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di strutturazione di substrati |
IT201900006736A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
US11931855B2 (en) | 2019-06-17 | 2024-03-19 | Applied Materials, Inc. | Planarization methods for packaging substrates |
US11862546B2 (en) | 2019-11-27 | 2024-01-02 | Applied Materials, Inc. | Package core assembly and fabrication methods |
US11257790B2 (en) | 2020-03-10 | 2022-02-22 | Applied Materials, Inc. | High connectivity device stacking |
US11454884B2 (en) | 2020-04-15 | 2022-09-27 | Applied Materials, Inc. | Fluoropolymer stamp fabrication method |
US11400545B2 (en) | 2020-05-11 | 2022-08-02 | Applied Materials, Inc. | Laser ablation for package fabrication |
US11232951B1 (en) | 2020-07-14 | 2022-01-25 | Applied Materials, Inc. | Method and apparatus for laser drilling blind vias |
US11676832B2 (en) | 2020-07-24 | 2023-06-13 | Applied Materials, Inc. | Laser ablation system for package fabrication |
US11521937B2 (en) | 2020-11-16 | 2022-12-06 | Applied Materials, Inc. | Package structures with built-in EMI shielding |
US11404318B2 (en) | 2020-11-20 | 2022-08-02 | Applied Materials, Inc. | Methods of forming through-silicon vias in substrates for advanced packaging |
US11705365B2 (en) | 2021-05-18 | 2023-07-18 | Applied Materials, Inc. | Methods of micro-via formation for advanced packaging |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4487911A (en) * | 1979-07-23 | 1984-12-11 | The P. D. George Company | Stable polyamic acids |
US4376195A (en) * | 1982-01-07 | 1983-03-08 | E. I. Du Pont De Nemours And Company | Method of preparing high purity polyamic acids for use in electronic circuitry |
DE3506524A1 (de) * | 1985-02-25 | 1986-08-28 | Akzo Gmbh, 5600 Wuppertal | Flexible polyimid-mehrschichtlaminate |
US4943471A (en) * | 1986-05-20 | 1990-07-24 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Patterned thin film and process for preparing the same |
US4871595A (en) * | 1986-12-16 | 1989-10-03 | Foster Miller, Inc. | Lyotropic liquid crystalline oriented polymer substrate for printed wire board |
US5098985A (en) * | 1988-10-11 | 1992-03-24 | The Dow Chemical Company | Copolymers containing polybenzoxazole, polybenzothiazole and polybenzimidazole moieties |
US5071948A (en) * | 1989-03-09 | 1991-12-10 | Hoechst Celanese Corporation | Polyamide-polyimide and polybenzoxazole-polyimide polymer |
US4980447A (en) * | 1989-03-09 | 1990-12-25 | Hoechst Celanese Corp. | Polyamide-polyimide and polybenzoxazole-polyimide polymer |
FI105605B (fi) * | 1989-04-27 | 2000-09-15 | Siemens Ag | Planarisoiva eriste |
US5112462A (en) * | 1990-09-13 | 1992-05-12 | Sheldahl Inc. | Method of making metal-film laminate resistant to delamination |
US5248760A (en) * | 1991-01-25 | 1993-09-28 | Unc At Charlotte | Chemically cured low temperature polyimides |
JPH0656992A (ja) * | 1992-08-05 | 1994-03-01 | Unitika Ltd | ポリイミドフィルム |
US5290909A (en) * | 1993-05-28 | 1994-03-01 | Industrial Technology Research Institute | Polyimide composition for polyimide/copper foil laminate |
-
1995
- 1995-05-09 US US08/437,710 patent/US5670262A/en not_active Expired - Lifetime
-
1996
- 1996-05-02 CA CA002219124A patent/CA2219124C/en not_active Expired - Lifetime
- 1996-05-02 EP EP96913328A patent/EP0826294A1/en not_active Ceased
- 1996-05-02 MX MX9708604A patent/MX9708604A/es unknown
- 1996-05-02 KR KR1019970707910A patent/KR100448296B1/ko not_active IP Right Cessation
- 1996-05-02 JP JP53413496A patent/JP3979607B2/ja not_active Expired - Fee Related
- 1996-05-02 CN CN96193784A patent/CN1093366C/zh not_active Expired - Lifetime
- 1996-05-02 WO PCT/US1996/006202 patent/WO1996036204A1/en active IP Right Grant
-
2006
- 2006-05-31 JP JP2006152915A patent/JP2006297942A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2006297942A (ja) | 2006-11-02 |
CA2219124A1 (en) | 1996-11-14 |
CA2219124C (en) | 2007-04-17 |
JP3979607B2 (ja) | 2007-09-19 |
WO1996036204A1 (en) | 1996-11-14 |
JPH11505184A (ja) | 1999-05-18 |
CN1093366C (zh) | 2002-10-23 |
KR100448296B1 (ko) | 2004-12-14 |
KR19990008383A (ko) | 1999-01-25 |
CN1183887A (zh) | 1998-06-03 |
US5670262A (en) | 1997-09-23 |
EP0826294A1 (en) | 1998-03-04 |
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