MX9200775A - Sistema para efectuar trabajo en piezas de trabajo. - Google Patents
Sistema para efectuar trabajo en piezas de trabajo.Info
- Publication number
- MX9200775A MX9200775A MX9200775A MX9200775A MX9200775A MX 9200775 A MX9200775 A MX 9200775A MX 9200775 A MX9200775 A MX 9200775A MX 9200775 A MX9200775 A MX 9200775A MX 9200775 A MX9200775 A MX 9200775A
- Authority
- MX
- Mexico
- Prior art keywords
- work
- pieces
- work pieces
- performing work
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q39/00—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation
- B23Q39/04—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps
- B23Q39/042—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps with circular arrangement of the sub-assemblies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Spray Control Apparatus (AREA)
- ing And Chemical Polishing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Multi-Process Working Machines And Systems (AREA)
- General Factory Administration (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66076191A | 1991-02-25 | 1991-02-25 | |
US07/810,820 US5271953A (en) | 1991-02-25 | 1991-12-19 | System for performing work on workpieces |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9200775A true MX9200775A (es) | 1992-08-01 |
Family
ID=27098174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9200775A MX9200775A (es) | 1991-02-25 | 1992-02-24 | Sistema para efectuar trabajo en piezas de trabajo. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5271953A (es) |
EP (1) | EP0501550B1 (es) |
JP (1) | JPH05186886A (es) |
CA (1) | CA2060941C (es) |
DE (1) | DE69214321D1 (es) |
MX (1) | MX9200775A (es) |
Families Citing this family (57)
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---|---|---|---|---|
US5482553A (en) * | 1994-06-02 | 1996-01-09 | Illinois Tool Works Inc. | System for pin-point application of a removable conformal coating |
US5807449A (en) * | 1997-01-08 | 1998-09-15 | Hooker; Jeffrey A. | Workpiece treating apparatus and method of treating same |
US6132809A (en) * | 1997-01-16 | 2000-10-17 | Precision Valve & Automation, Inc. | Conformal coating using multiple applications |
US5905651A (en) * | 1997-01-16 | 1999-05-18 | Nordson Corporation | Parts identification system for powder spray coating system |
US5796486A (en) * | 1997-03-31 | 1998-08-18 | Lam Research Corporation | Apparatus method for determining the presence or absence of a wafer on a wafer holder |
WO2000003072A1 (en) * | 1998-07-10 | 2000-01-20 | Semitool, Inc. | Method and apparatus for copper plating using electroless plating and electroplating |
US7048841B2 (en) | 1998-12-07 | 2006-05-23 | Semitool, Inc. | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
US6303010B1 (en) | 1999-07-12 | 2001-10-16 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
US6773560B2 (en) | 1998-07-10 | 2004-08-10 | Semitool, Inc. | Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
US6224936B1 (en) | 1998-10-07 | 2001-05-01 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6309520B1 (en) * | 1998-12-07 | 2001-10-30 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
US6645356B1 (en) | 1998-12-07 | 2003-11-11 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
TW483950B (en) | 1998-12-31 | 2002-04-21 | Semitool Inc | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
US6296707B1 (en) * | 1999-03-17 | 2001-10-02 | Gerber Coburn Optical, Inc. | Apparatus for coating a surface of one or more lenses |
US7645366B2 (en) * | 1999-07-12 | 2010-01-12 | Semitool, Inc. | Microelectronic workpiece holders and contact assemblies for use therewith |
US6259519B1 (en) | 1999-08-31 | 2001-07-10 | Intelligent Machine Concepts, L.L.C. | Method of determining the planar inclination of a surface |
US6327520B1 (en) | 1999-08-31 | 2001-12-04 | Intelligent Machine Concepts, L.L.C. | Planar normality sensor |
US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
US6554212B2 (en) * | 2001-02-08 | 2003-04-29 | Ipr Automation Lp | Robot spray head for cavity treatment |
US6711947B2 (en) * | 2001-06-13 | 2004-03-30 | Rem Scientific Enterprises, Inc. | Conductive fluid logging sensor and method |
US20030209517A1 (en) * | 2002-05-08 | 2003-11-13 | Mcgehee Brian | Post oxidation mass finishing techniques for prosthetic devices having textured diffusion-hardened surfaces |
US7118658B2 (en) * | 2002-05-21 | 2006-10-10 | Semitool, Inc. | Electroplating reactor |
US20040146461A1 (en) * | 2003-01-29 | 2004-07-29 | Vincenzo Giuliano | Oral contrast media composition for computerized axial tomographic examinations and method |
DE10340916A1 (de) * | 2003-09-05 | 2005-03-31 | Sig Technology Ltd. | Verfahren und Vorrichtung zur Handhabung von Werkstücken |
US7210556B2 (en) * | 2004-01-15 | 2007-05-01 | Saipem America Inc. | Method and apparatus for installing a sensor array |
NL1025302C2 (nl) * | 2004-01-22 | 2005-07-25 | Fico Bv | Omhulinrichting met verplaatsbare tafel en werkwijze voor omhullen. |
US8534959B2 (en) | 2005-01-17 | 2013-09-17 | Fairfield Industries Incorporated | Method and apparatus for deployment of ocean bottom seismometers |
FR2893320B1 (fr) * | 2005-11-17 | 2009-05-29 | Univ Paris Curie | Oxyfluorure poreux nanostructure |
US20070284350A1 (en) * | 2006-06-09 | 2007-12-13 | Gm Global Technology Operations, Inc. | System and Method for Reducing Weld Spatter |
US7748341B2 (en) * | 2006-08-10 | 2010-07-06 | Satisloh North America, Inc. | Lens coating apparatus |
GB0711697D0 (en) * | 2007-06-16 | 2007-07-25 | Rolls Royce Plc | Method of manufacture |
US7632043B2 (en) * | 2007-08-23 | 2009-12-15 | Fairfield Industries Incorporated | Seismic sensor transfer device |
US7767025B2 (en) * | 2007-09-30 | 2010-08-03 | Intel Corporation | Nozzle array configuration to facilitate deflux process improvement in chip attach process |
US8310899B2 (en) | 2008-12-23 | 2012-11-13 | Fairfield Industries Incorporated | Multiple receiver line deployment and recovery |
US10042068B2 (en) | 2008-12-23 | 2018-08-07 | Fairfield Industries Incorporated | Conveyance system and method for underwater seismic exploration |
WO2013106442A1 (en) | 2012-01-10 | 2013-07-18 | Hzo, Inc. | Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods |
JP2013143563A (ja) | 2012-01-10 | 2013-07-22 | Hzo Inc | 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム |
US11060183B2 (en) | 2012-03-23 | 2021-07-13 | Hzo, Inc. | Apparatuses, systems and methods for applying protective coatings to electronic device assemblies |
CN102689302B (zh) * | 2012-05-31 | 2015-08-19 | 上海发那科机器人有限公司 | 一种柔性机器人*** |
CN104364020A (zh) * | 2012-06-18 | 2015-02-18 | Hzo股份有限公司 | 对全装配电子设备的内部表面施加保护涂层的***和方法 |
EP2862428A4 (en) * | 2012-06-18 | 2016-06-22 | Hzo Inc | DEVICES, SYSTEMS AND METHOD FOR PROTECTING ARRANGEMENTS OF ELECTRONIC DEVICES |
DE102012212206A1 (de) * | 2012-07-12 | 2014-01-16 | Siemens Aktiengesellschaft | Drehteller, Kreisteiltisch, Montagesystem und Betriebsverfahren |
US9465078B2 (en) | 2012-11-02 | 2016-10-11 | Fairfield Industries, Inc. | Battery capacity and durability prediction method |
US10449568B2 (en) | 2013-01-08 | 2019-10-22 | Hzo, Inc. | Masking substrates for application of protective coatings |
EP2780935A4 (en) | 2013-01-08 | 2015-11-11 | Hzo Inc | REMOVAL OF SELECTED PARTS FROM SUBSTRATE PROTECTIVE COATINGS |
US9894776B2 (en) | 2013-01-08 | 2018-02-13 | Hzo, Inc. | System for refurbishing or remanufacturing an electronic device |
CN104190780B (zh) * | 2014-08-25 | 2016-05-18 | 华东泰克西汽车铸造有限公司 | 切削冲孔设备自动控制方法 |
US9674963B1 (en) * | 2015-06-03 | 2017-06-06 | Eric Sari | Multilevel machine to process coatings |
DE102015117558A1 (de) * | 2015-10-15 | 2017-04-20 | Lpkf Laser & Electronics Ag | Verfahren zum Herstellen von strukturierten Beschichtungen auf einem Formteil und Vorrichtung zur Durchführung des Verfahrens |
CN105289877B (zh) * | 2015-11-14 | 2018-05-29 | 东莞市新力光表面处理科技有限公司 | 一种胶条转台式自动喷涂生产线 |
US9841522B2 (en) | 2016-03-31 | 2017-12-12 | Fairfield Industries, Inc. | Loading a helical conveyor for underwater seismic exploration |
US10114137B2 (en) | 2016-03-31 | 2018-10-30 | Fairfield Industries, Inc. | Underwater seismic exploration with a helical conveyor and skid structure |
US10048397B2 (en) | 2016-03-31 | 2018-08-14 | Fairfield Industries, Inc. | Conveyance system and method for underwater seismic exploration |
US10151848B2 (en) | 2016-03-31 | 2018-12-11 | Fairfield Industries, Inc. | Helical conveyor for underwater seismic exploration |
US10018742B2 (en) | 2016-03-31 | 2018-07-10 | Fairfield Industries, Inc. | Skid structure for underwater seismic exploration |
JP6806638B2 (ja) * | 2017-07-03 | 2021-01-06 | 株式会社デンソーテン | はんだ付け装置およびはんだ付け方法 |
JP6972062B2 (ja) * | 2019-04-12 | 2021-11-24 | 株式会社安川電機 | 生産システム及び制御方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3049768A (en) * | 1959-04-30 | 1962-08-21 | Gen Motors Corp | Apparatus and process for casting pistons |
US3530571A (en) * | 1967-12-15 | 1970-09-29 | Cincinnati Milacron Inc | Manufacturing system |
US3836388A (en) * | 1972-10-18 | 1974-09-17 | Western Electric Co | Distributing a fluid evenly over the surface of an article |
JPS50154341A (es) * | 1974-06-03 | 1975-12-12 | ||
JPS51130866A (en) * | 1975-05-08 | 1976-11-13 | Seiko Instr & Electronics | Method of mounting electronic timekeeper circuits |
US4287226A (en) * | 1976-02-20 | 1981-09-01 | Bell Telephone Laboratories, Incorporated | Process for producing cover coated electronic circuits |
US4059708A (en) * | 1976-07-30 | 1977-11-22 | Bell Telephone Laboratories, Incorporated | Method for selective encapsulation |
US4254163A (en) * | 1979-04-13 | 1981-03-03 | Western Electric Company, Inc. | Strippable resists |
US4570782A (en) * | 1980-10-20 | 1986-02-18 | Cargill Detroit Corporation | Non-synchronous rotary manufacturing system |
JPS57205054A (en) * | 1981-06-12 | 1982-12-16 | Honda Motor Co Ltd | Transfer type machining system |
US4424252A (en) * | 1982-11-12 | 1984-01-03 | Loctite Corporation | Conformal coating systems |
US4508758A (en) * | 1982-12-27 | 1985-04-02 | At&T Technologies, Inc. | Encapsulated electronic circuit |
US4560584A (en) * | 1983-12-23 | 1985-12-24 | Universal Instruments Corporation | Method and apparatus for applying solder masking to a circuit board |
DE3442131A1 (de) * | 1984-11-17 | 1986-05-22 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen |
US4623559A (en) * | 1985-07-12 | 1986-11-18 | Westinghouse Electric Corp. | U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating |
US4661368A (en) * | 1985-09-18 | 1987-04-28 | Universal Instruments Corporation | Surface locating and dispensed dosage sensing method and apparatus |
JPS62154794A (ja) * | 1985-12-27 | 1987-07-09 | ノードソン株式会社 | 実装回路板への防湿絶縁剤の被覆方法 |
US4695482A (en) * | 1986-01-21 | 1987-09-22 | Weiswurm Klaus D | Method and apparatus for coating of circuit boards |
US4830922A (en) * | 1986-02-28 | 1989-05-16 | Sparrowhawk Bryan L | Removable controlled thickness conformal coating |
US4826705A (en) * | 1986-07-02 | 1989-05-02 | Loctite Corporation | Radiation curable temporary solder mask |
JPS63256155A (ja) * | 1987-04-14 | 1988-10-24 | Parker Aresutaa Kk | 自動塗装装置 |
US5052540A (en) * | 1988-07-26 | 1991-10-01 | Honda Giken Kogyo Kabushiki Kaisha | Rotary transfer system |
JPH0271958A (ja) * | 1988-09-02 | 1990-03-12 | Toshiba Seiki Kk | 多品種混合作業方法 |
-
1991
- 1991-12-19 US US07/810,820 patent/US5271953A/en not_active Expired - Lifetime
-
1992
- 1992-02-10 CA CA002060941A patent/CA2060941C/en not_active Expired - Fee Related
- 1992-02-11 DE DE69214321T patent/DE69214321D1/de not_active Expired - Lifetime
- 1992-02-11 EP EP92200377A patent/EP0501550B1/en not_active Expired - Lifetime
- 1992-02-24 MX MX9200775A patent/MX9200775A/es unknown
- 1992-02-25 JP JP4037861A patent/JPH05186886A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69214321D1 (de) | 1996-11-14 |
EP0501550A2 (en) | 1992-09-02 |
CA2060941A1 (en) | 1992-08-26 |
EP0501550B1 (en) | 1996-10-09 |
CA2060941C (en) | 1997-12-30 |
EP0501550A3 (en) | 1993-01-13 |
US5271953A (en) | 1993-12-21 |
JPH05186886A (ja) | 1993-07-27 |
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