US4463218A
(en)
*
|
1977-08-24 |
1984-07-31 |
Seiko Instruments & Electronics Ltd. |
Switching electrode portion of a circuit board for an electronic watch
|
US5861670A
(en)
*
|
1979-10-04 |
1999-01-19 |
Fujitsu Limited |
Semiconductor device package
|
US4302625A
(en)
*
|
1980-06-30 |
1981-11-24 |
International Business Machines Corp. |
Multi-layer ceramic substrate
|
US4423468A
(en)
*
|
1980-10-01 |
1983-12-27 |
Motorola, Inc. |
Dual electronic component assembly
|
US4371912A
(en)
*
|
1980-10-01 |
1983-02-01 |
Motorola, Inc. |
Method of mounting interrelated components
|
US4484215A
(en)
*
|
1981-05-18 |
1984-11-20 |
Burroughs Corporation |
Flexible mounting support for wafer scale integrated circuits
|
JPS58446U
(ja)
*
|
1981-06-25 |
1983-01-05 |
富士通株式会社 |
混成集積回路装置
|
DE3270106D1
(en)
*
|
1981-08-14 |
1986-04-30 |
Amp Inc |
Semiconductor chip carrier
|
US4437141A
(en)
|
1981-09-14 |
1984-03-13 |
Texas Instruments Incorporated |
High terminal count integrated circuit device package
|
JPS6038868B2
(ja)
*
|
1981-11-06 |
1985-09-03 |
富士通株式会社 |
半導体パツケ−ジ
|
US4453176A
(en)
*
|
1981-12-31 |
1984-06-05 |
International Business Machines Corporation |
LSI Chip carrier with buried repairable capacitor with low inductance leads
|
US4504821A
(en)
*
|
1982-01-15 |
1985-03-12 |
General Electric Company |
Integrated circuit board system and an integrated circuit board assembly for application thereto
|
FR2521350B1
(fr)
*
|
1982-02-05 |
1986-01-24 |
Hitachi Ltd |
Boitier porteur de puce semi-conductrice
|
US4549200A
(en)
*
|
1982-07-08 |
1985-10-22 |
International Business Machines Corporation |
Repairable multi-level overlay system for semiconductor device
|
JPS5921047A
(ja)
*
|
1982-07-27 |
1984-02-02 |
Fuji Xerox Co Ltd |
リ−ドレスチツプキヤリア
|
US4551746A
(en)
*
|
1982-10-05 |
1985-11-05 |
Mayo Foundation |
Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
|
US4551747A
(en)
*
|
1982-10-05 |
1985-11-05 |
Mayo Foundation |
Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
|
US4547795A
(en)
*
|
1983-03-24 |
1985-10-15 |
Bourns, Inc. |
Leadless chip carrier with frangible shorting bars
|
US4641140A
(en)
*
|
1983-09-26 |
1987-02-03 |
Harris Corporation |
Miniaturized microwave transmission link
|
US4631572A
(en)
*
|
1983-09-27 |
1986-12-23 |
Trw Inc. |
Multiple path signal distribution to large scale integration chips
|
US4560826A
(en)
*
|
1983-12-29 |
1985-12-24 |
Amp Incorporated |
Hermetically sealed chip carrier
|
US4614194A
(en)
*
|
1984-01-20 |
1986-09-30 |
Cordis Corporation |
Implantable pulse generator having a single printed circuit board for carrying integrated circuit chips thereon with chip carrier means
|
US4616655A
(en)
*
|
1984-01-20 |
1986-10-14 |
Cordis Corporation |
Implantable pulse generator having a single printed circuit board and a chip carrier
|
US4572757A
(en)
*
|
1984-01-23 |
1986-02-25 |
The Jade Corporation |
Method of making a microcircuit substrate
|
US4672421A
(en)
*
|
1984-04-02 |
1987-06-09 |
Motorola, Inc. |
Semiconductor packaging and method
|
GB8412674D0
(en)
*
|
1984-05-18 |
1984-06-27 |
British Telecomm |
Integrated circuit chip carrier
|
US4609241A
(en)
*
|
1984-05-25 |
1986-09-02 |
4C Electronics, Inc. |
Programmable programmed socket
|
US4727246A
(en)
*
|
1984-08-31 |
1988-02-23 |
Casio Computer Co., Ltd. |
IC card
|
US4695810A
(en)
*
|
1984-10-22 |
1987-09-22 |
Harris Corporation |
Waffleline-configured microwave transmission link
|
US4763007A
(en)
*
|
1984-12-25 |
1988-08-09 |
Ricoh Company, Ltd. |
Image sensor driving circuit
|
US4659931A
(en)
*
|
1985-05-08 |
1987-04-21 |
Grumman Aerospace Corporation |
High density multi-layered integrated circuit package
|
US4705917A
(en)
*
|
1985-08-27 |
1987-11-10 |
Hughes Aircraft Company |
Microelectronic package
|
CN1003524B
(zh)
*
|
1985-10-14 |
1989-03-08 |
株式会社日立制作所 |
无电浸镀金溶液
|
FR2591801B1
(fr)
*
|
1985-12-17 |
1988-10-14 |
Inf Milit Spatiale Aeronaut |
Boitier d'encapsulation d'un circuit electronique
|
US4754317A
(en)
*
|
1986-04-28 |
1988-06-28 |
Monolithic Memories, Inc. |
Integrated circuit die-to-lead frame interconnection assembly and method
|
EP0257119B1
(en)
*
|
1986-08-22 |
1991-02-20 |
Ibm Deutschland Gmbh |
Integrated wiring system for vlsi
|
US4754370A
(en)
*
|
1986-08-26 |
1988-06-28 |
American Telephone And Telegraph Company, At&T Bell Laboratories |
Electrical component with added connecting conducting paths
|
GB2197540B
(en)
*
|
1986-11-12 |
1991-04-17 |
Murata Manufacturing Co |
A circuit structure.
|
US4839717A
(en)
*
|
1986-12-19 |
1989-06-13 |
Fairchild Semiconductor Corporation |
Ceramic package for high frequency semiconductor devices
|
US4868712A
(en)
*
|
1987-02-04 |
1989-09-19 |
Woodman John K |
Three dimensional integrated circuit package
|
US4953005A
(en)
*
|
1987-04-17 |
1990-08-28 |
Xoc Devices, Inc. |
Packaging system for stacking integrated circuits
|
US4862249A
(en)
*
|
1987-04-17 |
1989-08-29 |
Xoc Devices, Inc. |
Packaging system for stacking integrated circuits
|
US4801999A
(en)
*
|
1987-07-15 |
1989-01-31 |
Advanced Micro Devices, Inc. |
Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers
|
US5138437A
(en)
*
|
1987-07-27 |
1992-08-11 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor integrated circuit device in which integrated circuit units having different functions are stacked in three dimensional manner
|
US5016138A
(en)
*
|
1987-10-27 |
1991-05-14 |
Woodman John K |
Three dimensional integrated circuit package
|
US4833568A
(en)
*
|
1988-01-29 |
1989-05-23 |
Berhold G Mark |
Three-dimensional circuit component assembly and method corresponding thereto
|
US5016085A
(en)
*
|
1988-03-04 |
1991-05-14 |
Hughes Aircraft Company |
Hermetic package for integrated circuit chips
|
US4862322A
(en)
*
|
1988-05-02 |
1989-08-29 |
Bickford Harry R |
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
|
US5408190A
(en)
*
|
1991-06-04 |
1995-04-18 |
Micron Technology, Inc. |
Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die
|
US5089881A
(en)
*
|
1988-11-03 |
1992-02-18 |
Micro Substrates, Inc. |
Fine-pitch chip carrier
|
FR2638894A1
(fr)
*
|
1988-11-04 |
1990-05-11 |
Thomson Csf |
Dispositif et procede de connexion et de fixation de composants
|
US4907128A
(en)
*
|
1988-12-15 |
1990-03-06 |
Grumman Aerospace Corporation |
Chip to multilevel circuit board bonding
|
US4928061A
(en)
*
|
1989-03-29 |
1990-05-22 |
International Business Machines Corporation |
Multi-layer printed circuit board
|
US5063432A
(en)
*
|
1989-05-22 |
1991-11-05 |
Advanced Micro Devices, Inc. |
Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
|
US5166773A
(en)
*
|
1989-07-03 |
1992-11-24 |
General Electric Company |
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
|
US5150196A
(en)
*
|
1989-07-17 |
1992-09-22 |
Hughes Aircraft Company |
Hermetic sealing of wafer scale integrated wafer
|
US4975761A
(en)
*
|
1989-09-05 |
1990-12-04 |
Advanced Micro Devices, Inc. |
High performance plastic encapsulated package for integrated circuit die
|
JP2746693B2
(ja)
*
|
1989-10-18 |
1998-05-06 |
新光電気工業株式会社 |
セラミックパッケージ
|
US5060369A
(en)
*
|
1990-01-31 |
1991-10-29 |
Ford Motor Company |
Printed wiring board construction
|
US4989117A
(en)
*
|
1990-02-12 |
1991-01-29 |
Rogers Corporation |
Molded integrated circuit package incorporating thin decoupling capacitor
|
US4994936A
(en)
*
|
1990-02-12 |
1991-02-19 |
Rogers Corporation |
Molded integrated circuit package incorporating decoupling capacitor
|
US5214498A
(en)
*
|
1990-02-26 |
1993-05-25 |
Raytheon Company |
MMIC package and connector
|
WO1991016740A1
(en)
*
|
1990-04-16 |
1991-10-31 |
Mckenzie Socket Technology, Inc. |
Intermediary adapter-connector
|
US5058265A
(en)
*
|
1990-05-10 |
1991-10-22 |
Rockwell International Corporation |
Method for packaging a board of electronic components
|
US5051869A
(en)
*
|
1990-05-10 |
1991-09-24 |
Rockwell International Corporation |
Advanced co-fired multichip/hybrid package
|
US5049979A
(en)
*
|
1990-06-18 |
1991-09-17 |
Microelectronics And Computer Technology Corporation |
Combined flat capacitor and tab integrated circuit chip and method
|
US5140745A
(en)
*
|
1990-07-23 |
1992-08-25 |
Mckenzie Jr Joseph A |
Method for forming traces on side edges of printed circuit boards and devices formed thereby
|
WO1992003035A1
(en)
*
|
1990-08-01 |
1992-02-20 |
Staktek Corporation |
Ultra high density integrated circuit packages, method and apparatus
|
US5446620A
(en)
*
|
1990-08-01 |
1995-08-29 |
Staktek Corporation |
Ultra high density integrated circuit packages
|
US5367766A
(en)
*
|
1990-08-01 |
1994-11-29 |
Staktek Corporation |
Ultra high density integrated circuit packages method
|
US5377077A
(en)
*
|
1990-08-01 |
1994-12-27 |
Staktek Corporation |
Ultra high density integrated circuit packages method and apparatus
|
US5475920A
(en)
*
|
1990-08-01 |
1995-12-19 |
Burns; Carmen D. |
Method of assembling ultra high density integrated circuit packages
|
US7198969B1
(en)
|
1990-09-24 |
2007-04-03 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
US20010030370A1
(en)
*
|
1990-09-24 |
2001-10-18 |
Khandros Igor Y. |
Microelectronic assembly having encapsulated wire bonding leads
|
US5138115A
(en)
*
|
1990-10-12 |
1992-08-11 |
Atmel Corporation |
Carrierles surface mounted integrated circuit die
|
US5079835A
(en)
*
|
1990-10-12 |
1992-01-14 |
Atmel Corporation |
Method of forming a carrierless surface mounted integrated circuit die
|
US5172303A
(en)
*
|
1990-11-23 |
1992-12-15 |
Motorola, Inc. |
Electronic component assembly
|
US5132613A
(en)
*
|
1990-11-30 |
1992-07-21 |
International Business Machines Corporation |
Low inductance side mount decoupling test structure
|
EP0496491A1
(en)
*
|
1991-01-22 |
1992-07-29 |
National Semiconductor Corporation |
Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same
|
US5342807A
(en)
*
|
1991-06-04 |
1994-08-30 |
Micron Technology, Inc. |
Soft bond for semiconductor dies
|
US6340894B1
(en)
|
1991-06-04 |
2002-01-22 |
Micron Technology, Inc. |
Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect
|
US5336649A
(en)
*
|
1991-06-04 |
1994-08-09 |
Micron Technology, Inc. |
Removable adhesives for attachment of semiconductor dies
|
US5448450A
(en)
*
|
1991-08-15 |
1995-09-05 |
Staktek Corporation |
Lead-on-chip integrated circuit apparatus
|
US5528466A
(en)
*
|
1991-11-12 |
1996-06-18 |
Sunright Limited |
Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid
|
US5350945A
(en)
*
|
1991-12-18 |
1994-09-27 |
Casio Computer Co., Ltd. |
Coin-shaped integrated circuit memory device
|
US5177863A
(en)
*
|
1992-03-27 |
1993-01-12 |
Atmel Corporation |
Method of forming integrated leadouts for a chip carrier
|
EP0567255B1
(en)
*
|
1992-04-24 |
1999-01-20 |
Altera Corporation |
Surface mount chip carrier
|
US5301416A
(en)
*
|
1992-04-24 |
1994-04-12 |
Altera Corporation |
Surface mount chip carrier
|
US5804870A
(en)
*
|
1992-06-26 |
1998-09-08 |
Staktek Corporation |
Hermetically sealed integrated circuit lead-on package configuration
|
US5702985A
(en)
*
|
1992-06-26 |
1997-12-30 |
Staktek Corporation |
Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
|
US5371321A
(en)
*
|
1992-07-22 |
1994-12-06 |
Vlsi Technology, Inc. |
Package structure and method for reducing bond wire inductance
|
US5484959A
(en)
*
|
1992-12-11 |
1996-01-16 |
Staktek Corporation |
High density lead-on-package fabrication method and apparatus
|
US6205654B1
(en)
|
1992-12-11 |
2001-03-27 |
Staktek Group L.P. |
Method of manufacturing a surface mount package
|
US5369056A
(en)
*
|
1993-03-29 |
1994-11-29 |
Staktek Corporation |
Warp-resistent ultra-thin integrated circuit package fabrication method
|
US5644161A
(en)
*
|
1993-03-29 |
1997-07-01 |
Staktek Corporation |
Ultra-high density warp-resistant memory module
|
US5418688A
(en)
*
|
1993-03-29 |
1995-05-23 |
Motorola, Inc. |
Cardlike electronic device
|
US5801437A
(en)
*
|
1993-03-29 |
1998-09-01 |
Staktek Corporation |
Three-dimensional warp-resistant integrated circuit module method and apparatus
|
US5455385A
(en)
*
|
1993-06-28 |
1995-10-03 |
Harris Corporation |
Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
|
US5543725A
(en)
*
|
1993-08-25 |
1996-08-06 |
Sunright Limited |
Reusable carrier for burn-in/testing on non packaged die
|
US5572140A
(en)
*
|
1993-08-25 |
1996-11-05 |
Sunright Limited |
Reusable carrier for burn-in/testing on non packaged die
|
US5530376A
(en)
*
|
1993-08-25 |
1996-06-25 |
Sunright Limited |
Reusable carrier for burn-in/testing of non packaged die
|
US5324890A
(en)
*
|
1993-09-09 |
1994-06-28 |
Delco Electronics Corporation |
Direct bond copper-output footprint
|
US5384689A
(en)
*
|
1993-12-20 |
1995-01-24 |
Shen; Ming-Tung |
Integrated circuit chip including superimposed upper and lower printed circuit boards
|
US6064217A
(en)
*
|
1993-12-23 |
2000-05-16 |
Epi Technologies, Inc. |
Fine pitch contact device employing a compliant conductive polymer bump
|
FI1499U1
(fi)
*
|
1994-05-19 |
1994-09-15 |
Picopak Oy |
Kopplingsanordning foer styrkretsen till en planskaerm eller en matrisskrivare
|
US5782891A
(en)
*
|
1994-06-16 |
1998-07-21 |
Medtronic, Inc. |
Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body
|
US5470345A
(en)
*
|
1994-06-16 |
1995-11-28 |
Medtronic, Inc. |
Implantable medical device with multi-layered ceramic enclosure
|
US5434745A
(en)
*
|
1994-07-26 |
1995-07-18 |
White Microelectronics Div. Of Bowmar Instrument Corp. |
Stacked silicon die carrier assembly
|
US5615475A
(en)
*
|
1995-01-30 |
1997-04-01 |
Staktek Corporation |
Method of manufacturing an integrated package having a pair of die on a common lead frame
|
US5514907A
(en)
*
|
1995-03-21 |
1996-05-07 |
Simple Technology Incorporated |
Apparatus for stacking semiconductor chips
|
US6025642A
(en)
*
|
1995-08-17 |
2000-02-15 |
Staktek Corporation |
Ultra high density integrated circuit packages
|
JPH09270325A
(ja)
*
|
1996-03-29 |
1997-10-14 |
Tokin Corp |
電子部品
|
US6667560B2
(en)
|
1996-05-29 |
2003-12-23 |
Texas Instruments Incorporated |
Board on chip ball grid array
|
US5945732A
(en)
|
1997-03-12 |
1999-08-31 |
Staktek Corporation |
Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
|
SG67384A1
(en)
|
1997-04-10 |
1999-09-21 |
Texas Instr Singapore Pte Ltd |
Integrated circuit package and flat plate molding process for integrated circuit package
|
US6040702A
(en)
*
|
1997-07-03 |
2000-03-21 |
Micron Technology, Inc. |
Carrier and system for testing bumped semiconductor components
|
US5956233A
(en)
*
|
1997-12-19 |
1999-09-21 |
Texas Instruments Incorporated |
High density single inline memory module
|
US6087203A
(en)
*
|
1997-12-19 |
2000-07-11 |
Texas Instruments Incorporated |
Method for adhering and sealing a silicon chip in an integrated circuit package
|
US5952611A
(en)
*
|
1997-12-19 |
1999-09-14 |
Texas Instruments Incorporated |
Flexible pin location integrated circuit package
|
US6049129A
(en)
*
|
1997-12-19 |
2000-04-11 |
Texas Instruments Incorporated |
Chip size integrated circuit package
|
US5998860A
(en)
*
|
1997-12-19 |
1999-12-07 |
Texas Instruments Incorporated |
Double sided single inline memory module
|
US6089095A
(en)
*
|
1997-12-19 |
2000-07-18 |
Texas Instruments Incorporated |
Method and apparatus for nondestructive inspection and defect detection in packaged integrated circuits
|
US6121678A
(en)
*
|
1997-12-19 |
2000-09-19 |
Stmicroelectronics, Inc. |
Wrap-around interconnect for fine pitch ball grid array
|
US5954751A
(en)
*
|
1998-01-15 |
1999-09-21 |
Intermedics Inc. |
Implantable defibrillator with stacked transistor subassemblies
|
SG73490A1
(en)
|
1998-01-23 |
2000-06-20 |
Texas Instr Singapore Pte Ltd |
High density internal ball grid array integrated circuit package
|
US6274929B1
(en)
|
1998-09-01 |
2001-08-14 |
Texas Instruments Incorporated |
Stacked double sided integrated circuit package
|
US6552264B2
(en)
|
1998-03-11 |
2003-04-22 |
International Business Machines Corporation |
High performance chip packaging and method
|
US6084306A
(en)
*
|
1998-05-29 |
2000-07-04 |
Texas Instruments Incorporated |
Bridging method of interconnects for integrated circuit packages
|
JPH11354705A
(ja)
|
1998-06-04 |
1999-12-24 |
Toshiba Corp |
半導体装置及び半導体装置の製造方法
|
US6320126B1
(en)
|
1998-07-14 |
2001-11-20 |
Texas Instruments Incorporated |
Vertical ball grid array integrated circuit package
|
US6323060B1
(en)
|
1999-05-05 |
2001-11-27 |
Dense-Pac Microsystems, Inc. |
Stackable flex circuit IC package and method of making same
|
US6105246A
(en)
*
|
1999-05-20 |
2000-08-22 |
International Business Machines Corporation |
Method of making a circuit board having burr free castellated plated through holes
|
US6572387B2
(en)
|
1999-09-24 |
2003-06-03 |
Staktek Group, L.P. |
Flexible circuit connector for stacked chip module
|
US6262895B1
(en)
|
2000-01-13 |
2001-07-17 |
John A. Forthun |
Stackable chip package with flex carrier
|
US7102892B2
(en)
*
|
2000-03-13 |
2006-09-05 |
Legacy Electronics, Inc. |
Modular integrated circuit chip carrier
|
US6713854B1
(en)
|
2000-10-16 |
2004-03-30 |
Legacy Electronics, Inc |
Electronic circuit module with a carrier having a mounting pad array
|
US6608763B1
(en)
|
2000-09-15 |
2003-08-19 |
Staktek Group L.P. |
Stacking system and method
|
US7103970B2
(en)
*
|
2001-03-14 |
2006-09-12 |
Legacy Electronics, Inc. |
Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
|
US7337522B2
(en)
*
|
2000-10-16 |
2008-03-04 |
Legacy Electronics, Inc. |
Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
|
US6782616B2
(en)
*
|
2001-01-12 |
2004-08-31 |
Hewlett-Packard Development Company, L.P. |
Connection arrangements for electrical devices
|
US6462408B1
(en)
|
2001-03-27 |
2002-10-08 |
Staktek Group, L.P. |
Contact member stacking system and method
|
US6914324B2
(en)
|
2001-10-26 |
2005-07-05 |
Staktek Group L.P. |
Memory expansion and chip scale stacking system and method
|
US6940729B2
(en)
|
2001-10-26 |
2005-09-06 |
Staktek Group L.P. |
Integrated circuit stacking system and method
|
US20030234443A1
(en)
|
2001-10-26 |
2003-12-25 |
Staktek Group, L.P. |
Low profile stacking system and method
|
US7485951B2
(en)
|
2001-10-26 |
2009-02-03 |
Entorian Technologies, Lp |
Modularized die stacking system and method
|
US6956284B2
(en)
*
|
2001-10-26 |
2005-10-18 |
Staktek Group L.P. |
Integrated circuit stacking system and method
|
US7202555B2
(en)
|
2001-10-26 |
2007-04-10 |
Staktek Group L.P. |
Pitch change and chip scale stacking system and method
|
US7371609B2
(en)
|
2001-10-26 |
2008-05-13 |
Staktek Group L.P. |
Stacked module systems and methods
|
US7656678B2
(en)
|
2001-10-26 |
2010-02-02 |
Entorian Technologies, Lp |
Stacked module systems
|
US7310458B2
(en)
|
2001-10-26 |
2007-12-18 |
Staktek Group L.P. |
Stacked module systems and methods
|
US20060255446A1
(en)
|
2001-10-26 |
2006-11-16 |
Staktek Group, L.P. |
Stacked modules and method
|
US6576992B1
(en)
|
2001-10-26 |
2003-06-10 |
Staktek Group L.P. |
Chip scale stacking system and method
|
US7026708B2
(en)
*
|
2001-10-26 |
2006-04-11 |
Staktek Group L.P. |
Low profile chip scale stacking system and method
|
US7053478B2
(en)
|
2001-10-26 |
2006-05-30 |
Staktek Group L.P. |
Pitch change and chip scale stacking system
|
JP3716783B2
(ja)
*
|
2001-11-22 |
2005-11-16 |
株式会社村田製作所 |
セラミック多層基板の製造方法及び半導体装置
|
US7081373B2
(en)
|
2001-12-14 |
2006-07-25 |
Staktek Group, L.P. |
CSP chip stack with flex circuit
|
US20030131472A1
(en)
*
|
2002-01-15 |
2003-07-17 |
Mitac International Corp. |
Method of fabricating a multi-layer circuit board assembly
|
US7211884B1
(en)
|
2002-01-28 |
2007-05-01 |
Pacesetter, Inc. |
Implantable medical device construction using a flexible substrate
|
US6806559B2
(en)
*
|
2002-04-22 |
2004-10-19 |
Irvine Sensors Corporation |
Method and apparatus for connecting vertically stacked integrated circuit chips
|
US7777321B2
(en)
*
|
2002-04-22 |
2010-08-17 |
Gann Keith D |
Stacked microelectronic layer and module with three-axis channel T-connects
|
JP2004221372A
(ja)
*
|
2003-01-16 |
2004-08-05 |
Seiko Epson Corp |
半導体装置、半導体モジュール、電子機器、半導体装置の製造方法および半導体モジュールの製造方法
|
US6841029B2
(en)
*
|
2003-03-27 |
2005-01-11 |
Advanced Cardiovascular Systems, Inc. |
Surface modification of expanded ultra high molecular weight polyethylene (eUHMWPE) for improved bondability
|
US7542304B2
(en)
|
2003-09-15 |
2009-06-02 |
Entorian Technologies, Lp |
Memory expansion and integrated circuit stacking system and method
|
JP2005108625A
(ja)
*
|
2003-09-30 |
2005-04-21 |
Jst Mfg Co Ltd |
多層異方導電シート
|
KR100558443B1
(ko)
*
|
2003-10-29 |
2006-03-10 |
삼성전기주식회사 |
저온 소성 세라믹 기판의 외부 단자 구조 및 그 형성방법
|
US20060050492A1
(en)
|
2004-09-03 |
2006-03-09 |
Staktek Group, L.P. |
Thin module system and method
|
US7606049B2
(en)
|
2004-09-03 |
2009-10-20 |
Entorian Technologies, Lp |
Module thermal management system and method
|
US7522421B2
(en)
|
2004-09-03 |
2009-04-21 |
Entorian Technologies, Lp |
Split core circuit module
|
US7760513B2
(en)
|
2004-09-03 |
2010-07-20 |
Entorian Technologies Lp |
Modified core for circuit module system and method
|
US7324352B2
(en)
|
2004-09-03 |
2008-01-29 |
Staktek Group L.P. |
High capacity thin module system and method
|
US7423885B2
(en)
|
2004-09-03 |
2008-09-09 |
Entorian Technologies, Lp |
Die module system
|
US7606050B2
(en)
|
2004-09-03 |
2009-10-20 |
Entorian Technologies, Lp |
Compact module system and method
|
US7443023B2
(en)
|
2004-09-03 |
2008-10-28 |
Entorian Technologies, Lp |
High capacity thin module system
|
US7542297B2
(en)
|
2004-09-03 |
2009-06-02 |
Entorian Technologies, Lp |
Optimized mounting area circuit module system and method
|
US7446410B2
(en)
|
2004-09-03 |
2008-11-04 |
Entorian Technologies, Lp |
Circuit module with thermal casing systems
|
US7511968B2
(en)
|
2004-09-03 |
2009-03-31 |
Entorian Technologies, Lp |
Buffered thin module system and method
|
US7289327B2
(en)
|
2006-02-27 |
2007-10-30 |
Stakick Group L.P. |
Active cooling methods and apparatus for modules
|
US7468893B2
(en)
|
2004-09-03 |
2008-12-23 |
Entorian Technologies, Lp |
Thin module system and method
|
US7616452B2
(en)
|
2004-09-03 |
2009-11-10 |
Entorian Technologies, Lp |
Flex circuit constructions for high capacity circuit module systems and methods
|
US7579687B2
(en)
|
2004-09-03 |
2009-08-25 |
Entorian Technologies, Lp |
Circuit module turbulence enhancement systems and methods
|
US7606040B2
(en)
|
2004-09-03 |
2009-10-20 |
Entorian Technologies, Lp |
Memory module system and method
|
TWI254605B
(en)
*
|
2004-10-26 |
2006-05-01 |
Delta Electronics Inc |
Communication module
|
US7435097B2
(en)
*
|
2005-01-12 |
2008-10-14 |
Legacy Electronics, Inc. |
Radial circuit board, system, and methods
|
US7309914B2
(en)
|
2005-01-20 |
2007-12-18 |
Staktek Group L.P. |
Inverted CSP stacking system and method
|
JP4506990B2
(ja)
*
|
2005-05-12 |
2010-07-21 |
株式会社村田製作所 |
セラミック多層基板
|
US7033861B1
(en)
|
2005-05-18 |
2006-04-25 |
Staktek Group L.P. |
Stacked module systems and method
|
CN100547821C
(zh)
*
|
2005-05-30 |
2009-10-07 |
奥斯兰姆奥普托半导体有限责任公司 |
壳体及其制造方法
|
US7352058B2
(en)
*
|
2005-11-01 |
2008-04-01 |
Sandisk Corporation |
Methods for a multiple die integrated circuit package
|
US7511371B2
(en)
*
|
2005-11-01 |
2009-03-31 |
Sandisk Corporation |
Multiple die integrated circuit package
|
KR100996982B1
(ko)
|
2005-11-01 |
2010-11-26 |
샌디스크 코포레이션 |
다중 다이 집적회로 패키지
|
US7576995B2
(en)
|
2005-11-04 |
2009-08-18 |
Entorian Technologies, Lp |
Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
|
US7508069B2
(en)
|
2006-01-11 |
2009-03-24 |
Entorian Technologies, Lp |
Managed memory component
|
US7508058B2
(en)
|
2006-01-11 |
2009-03-24 |
Entorian Technologies, Lp |
Stacked integrated circuit module
|
US7605454B2
(en)
|
2006-01-11 |
2009-10-20 |
Entorian Technologies, Lp |
Memory card and method for devising
|
US7304382B2
(en)
|
2006-01-11 |
2007-12-04 |
Staktek Group L.P. |
Managed memory component
|
US7608920B2
(en)
|
2006-01-11 |
2009-10-27 |
Entorian Technologies, Lp |
Memory card and method for devising
|
US7511969B2
(en)
|
2006-02-02 |
2009-03-31 |
Entorian Technologies, Lp |
Composite core circuit module system and method
|
KR100836663B1
(ko)
*
|
2006-02-16 |
2008-06-10 |
삼성전기주식회사 |
캐비티가 형성된 패키지 온 패키지 및 그 제조 방법
|
WO2008014633A1
(en)
|
2006-06-29 |
2008-02-07 |
Intel Corporation |
Apparatus, system, and method for wireless connection in integrated circuit packages
|
US7468553B2
(en)
|
2006-10-20 |
2008-12-23 |
Entorian Technologies, Lp |
Stackable micropackages and stacked modules
|
US7417310B2
(en)
|
2006-11-02 |
2008-08-26 |
Entorian Technologies, Lp |
Circuit module having force resistant construction
|
US7834448B2
(en)
*
|
2007-09-05 |
2010-11-16 |
Delphi Technologies, Inc. |
Fluid cooled semiconductor power module having double-sided cooling
|
DE102009048838B3
(de)
*
|
2009-10-09 |
2011-01-20 |
Eads Deutschland Gmbh |
Hermetisches dichtes Hochfrequenz-Frontend
|
US9947465B2
(en)
*
|
2014-06-23 |
2018-04-17 |
Mag. Layers Scientific-Technics Co., Ltd. |
Magnetic assembly packaging process
|
US10098241B2
(en)
*
|
2015-10-23 |
2018-10-09 |
International Business Machines Corporation |
Printed circuit board with edge soldering for high-density packages and assemblies
|
JP7180619B2
(ja)
*
|
2020-01-10 |
2022-11-30 |
Tdk株式会社 |
電子部品及びその製造方法
|