MX355685B - Convertidor de frecuencia ajustable, de voltaje medio, híbrido, enfriado por aire/líquido. - Google Patents

Convertidor de frecuencia ajustable, de voltaje medio, híbrido, enfriado por aire/líquido.

Info

Publication number
MX355685B
MX355685B MX2016001997A MX2016001997A MX355685B MX 355685 B MX355685 B MX 355685B MX 2016001997 A MX2016001997 A MX 2016001997A MX 2016001997 A MX2016001997 A MX 2016001997A MX 355685 B MX355685 B MX 355685B
Authority
MX
Mexico
Prior art keywords
heat management
frequency drive
adjustable frequency
medium voltage
assembly
Prior art date
Application number
MX2016001997A
Other languages
English (en)
Other versions
MX2016001997A (es
Inventor
Broussard Harry
Arthur Farr Thomas
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of MX2016001997A publication Critical patent/MX2016001997A/es
Publication of MX355685B publication Critical patent/MX355685B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14325—Housings specially adapted for power drive units or power converters for cabinets or racks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)

Abstract

Se provee un convertidor de frecuencia ajustable (10) que incluye varios módulos de potencia (14) y un sistema de gestión de calor (16). Cada uno de los varios módulos de potencia (14) incluye varios inversores (30). Cada inversor (30) incluye varios polos de potencia (32). El sistema de gestión de calor (16) incluye un ensamblaje de alojamiento (129define un envolvente de módulo de potencia (26ª) y un envolvente de ensamblaje de enfriamiento liquido (26B). El primer ensamblaje de gestión de calor (42) está dispuesto de manera sustancial en el envolvente de módulo de potencia (26ª). El segundo ensamblaje de gestión de calor (44) no está dispuesto sustancialmente en el envolvente de módulo de potencia (26A).
MX2016001997A 2013-08-15 2014-08-05 Convertidor de frecuencia ajustable, de voltaje medio, híbrido, enfriado por aire/líquido. MX355685B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/967,382 US9485889B2 (en) 2013-08-15 2013-08-15 Medium voltage hybrid air/liquid cooled adjustable frequency drive
PCT/US2014/049656 WO2015023467A2 (en) 2013-08-15 2014-08-05 Medium voltage hybrid air/liquid cooled adjustable frequency drive

Publications (2)

Publication Number Publication Date
MX2016001997A MX2016001997A (es) 2016-12-14
MX355685B true MX355685B (es) 2018-04-26

Family

ID=51392391

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016001997A MX355685B (es) 2013-08-15 2014-08-05 Convertidor de frecuencia ajustable, de voltaje medio, híbrido, enfriado por aire/líquido.

Country Status (5)

Country Link
US (1) US9485889B2 (es)
EP (1) EP3033932B1 (es)
CA (1) CA2916753C (es)
MX (1) MX355685B (es)
WO (1) WO2015023467A2 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10143116B2 (en) * 2016-05-13 2018-11-27 Toshiba International Corporation Outdoor UPS unit system and method
DE112019003690T5 (de) * 2018-08-21 2021-04-08 Eaton Intelligent Power Limited Integrierter direkt montierter abzweigschutz für antrieb mit variabler frequenz
CN113906836A (zh) * 2019-03-18 2022-01-07 迪西贝尔公司 用于功率转换器的冷却***
US11503746B2 (en) * 2019-06-14 2022-11-15 Dmytro KHACHATUROV Variable frequency drive and method of its air cooling

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3327317B2 (ja) 1995-10-09 2002-09-24 株式会社荏原製作所 インバータの水冷方法
JPH11346480A (ja) 1998-06-02 1999-12-14 Hitachi Ltd インバータ装置
US6038156A (en) 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
JP2005274120A (ja) * 2004-02-24 2005-10-06 Showa Denko Kk 液冷式冷却板
ATE539481T1 (de) 2004-06-24 2012-01-15 Sma Solar Technology Ag Wechselrichter mit einem gehäuse mit kühlkörper aufweisenden elektrischen und/oder elektronischen komponenten
US7210304B2 (en) * 2005-02-09 2007-05-01 General Motors Corporation Cooling arrangements for integrated electric motor-inverters
EP1853098A3 (en) * 2006-05-03 2013-07-10 Parker-Hannifin Corporation Modular high-power drive stack system and method
US7746020B2 (en) * 2007-01-22 2010-06-29 Johnson Controls Technology Company Common mode & differential mode filter for variable speed drive
US8149579B2 (en) * 2008-03-28 2012-04-03 Johnson Controls Technology Company Cooling member
JP4697475B2 (ja) * 2007-05-21 2011-06-08 トヨタ自動車株式会社 パワーモジュールの冷却器及びパワーモジュール
JP4819071B2 (ja) * 2008-02-06 2011-11-16 本田技研工業株式会社 電気車両及び車両用ｄｃ／ｄｃコンバータの冷却方法
WO2009140672A1 (en) * 2008-05-16 2009-11-19 Parker Hannifin Corporation Modular high-power drive stack cooled with vaporizable dielectric fluid
JP5408136B2 (ja) 2008-09-11 2014-02-05 株式会社安川電機 インバータ装置、インバータコントロールシステム、モータ制御システム、インバータ装置の制御方法
TWI394524B (zh) * 2010-02-10 2013-04-21 Delta Electronics Inc 模組化散熱裝置
US8335081B2 (en) 2010-07-16 2012-12-18 Rockwell Automation Technologies, Inc. Heat sink cooling arrangement for multiple power electronic circuits
US8325478B2 (en) 2010-07-16 2012-12-04 Rockwell Automation Technologies, Inc. Cooling duct attachment and sealing for a motor drive
DE102011100543A1 (de) 2011-05-05 2012-11-08 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit Flüssigkeitskühlung
EP2709431A1 (en) 2011-05-12 2014-03-19 Toyota Jidosha Kabushiki Kaisha Cooler and manufacturing method for cooler
WO2013033601A2 (en) 2011-09-02 2013-03-07 Wolverine Tube, Inc. Enhanced clad metal base plate

Also Published As

Publication number Publication date
MX2016001997A (es) 2016-12-14
WO2015023467A3 (en) 2015-08-13
EP3033932A2 (en) 2016-06-22
US20150049437A1 (en) 2015-02-19
US9485889B2 (en) 2016-11-01
WO2015023467A2 (en) 2015-02-19
CA2916753C (en) 2021-04-27
EP3033932B1 (en) 2021-09-29
CA2916753A1 (en) 2015-02-19

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