MX349742B - Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo. - Google Patents

Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo.

Info

Publication number
MX349742B
MX349742B MX2015001324A MX2015001324A MX349742B MX 349742 B MX349742 B MX 349742B MX 2015001324 A MX2015001324 A MX 2015001324A MX 2015001324 A MX2015001324 A MX 2015001324A MX 349742 B MX349742 B MX 349742B
Authority
MX
Mexico
Prior art keywords
chp1
semiconductor chip
flow sensor
production method
method therefor
Prior art date
Application number
MX2015001324A
Other languages
English (en)
Inventor
Kono Tsutomu
Hanzawa Keiji
Okamoto Yuki
Tokuyasu Noboru
Tashiro Shinobu
Morino Takeshi
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of MX349742B publication Critical patent/MX349742B/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/34—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
    • G01F1/36—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction
    • G01F1/38—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction the pressure or differential pressure being measured by means of a movable element, e.g. diaphragm, piston, Bourdon tube or flexible capsule
    • G01F1/383—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction the pressure or differential pressure being measured by means of a movable element, e.g. diaphragm, piston, Bourdon tube or flexible capsule with electrical or electro-mechanical indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/696—Circuits therefor, e.g. constant-current flow meters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/34—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/696—Circuits therefor, e.g. constant-current flow meters
    • G01F1/698—Feedback or rebalancing circuits, e.g. self heated constant temperature flowmeters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F5/00—Measuring a proportion of the volume flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Pressure Sensors (AREA)

Abstract

Se proporciona una técnica para suprimir las variaciones de funcionamiento para cada sensor de flujo. En un sensor de flujo FS1 de la presente invención, se configura una parte de un chip semiconductor CH1I para cubrirse con resina (MR) en un estado en donde se expone una unidad de detección de flujo (FDU) formada sobre un chip semiconductor CHP1. Debido a que una superficie superior SUR(MR) de la resina (MR) es más alta que una superficie superior SUR(CHP) del chip semiconductor (CHP1) por el sellado de la resina (MR) sobre una parte de la superficie superior SUR(CHP) del chip semiconductor CHP1 en una dirección paralela a una dirección del flujo de aire, y se puede estabilizar el flujo de aire alrededor de la unidad de detección de flujo (FDU). Además, se puede prevenir el desprendimiento de la interfase entre el chip semiconductor (CHP1) y la resina (MR), mediante un aumento del área de contacto entre el chip semiconductor (CHP1) y la resina (MR).
MX2015001324A 2010-10-13 2011-09-13 Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo. MX349742B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2010/067946 WO2012049742A1 (ja) 2010-10-13 2010-10-13 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法
PCT/JP2011/070900 WO2012049934A1 (ja) 2010-10-13 2011-09-13 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法

Publications (1)

Publication Number Publication Date
MX349742B true MX349742B (es) 2017-08-10

Family

ID=45937992

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2015001324A MX349742B (es) 2010-10-13 2011-09-13 Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo.
MX2012003145A MX2012003145A (es) 2010-10-13 2011-09-13 Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2012003145A MX2012003145A (es) 2010-10-13 2011-09-13 Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo.

Country Status (7)

Country Link
US (3) US8640538B2 (es)
EP (2) EP3421949B1 (es)
JP (3) JP5456816B2 (es)
KR (3) KR101414755B1 (es)
CN (5) CN103994794B (es)
MX (2) MX349742B (es)
WO (2) WO2012049742A1 (es)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5175974B2 (ja) * 2009-03-31 2013-04-03 アルプス電気株式会社 容量型湿度センサ及びその製造方法
WO2012049742A1 (ja) * 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法
JP5703390B2 (ja) * 2011-12-07 2015-04-15 日立オートモティブシステムズ株式会社 空気流量測定装置
JP5743871B2 (ja) 2011-12-07 2015-07-01 日立オートモティブシステムズ株式会社 熱式流量計
JP5759943B2 (ja) * 2012-06-15 2015-08-05 日立オートモティブシステムズ株式会社 熱式流量計
JP5813584B2 (ja) * 2012-06-15 2015-11-17 日立オートモティブシステムズ株式会社 熱式流量計
JP5758850B2 (ja) 2012-06-15 2015-08-05 日立オートモティブシステムズ株式会社 熱式流量計
JP2014001983A (ja) * 2012-06-15 2014-01-09 Hitachi Automotive Systems Ltd 熱式流量計
JP2014001969A (ja) * 2012-06-15 2014-01-09 Hitachi Automotive Systems Ltd 熱式流量計
CN107063368B (zh) * 2012-06-15 2020-06-16 日立汽车***株式会社 热式流量计
JP5675706B2 (ja) 2012-06-15 2015-02-25 日立オートモティブシステムズ株式会社 熱式流量計
TWI512930B (zh) * 2012-09-25 2015-12-11 Xintex Inc 晶片封裝體及其形成方法
JP5949461B2 (ja) * 2012-11-02 2016-07-06 株式会社デンソー 流量測定装置
JP5916637B2 (ja) * 2013-01-11 2016-05-11 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
JP5973371B2 (ja) 2013-03-21 2016-08-23 日立オートモティブシステムズ株式会社 熱式流量計
JP5980155B2 (ja) * 2013-03-21 2016-08-31 日立オートモティブシステムズ株式会社 熱式流量計
JP6032096B2 (ja) * 2013-03-28 2016-11-24 株式会社デンソー 電子制御ユニット及びその製造方法
JP6096070B2 (ja) 2013-06-20 2017-03-15 日立オートモティブシステムズ株式会社 熱式流量計の製造方法
JP6099094B2 (ja) * 2013-06-21 2017-03-22 日立オートモティブシステムズ株式会社 ガスセンサ装置およびガスセンサ装置の取付け構造
JP6067498B2 (ja) * 2013-07-08 2017-01-25 日立オートモティブシステムズ株式会社 流量センサ
WO2015033589A1 (ja) * 2013-09-05 2015-03-12 日立オートモティブシステムズ株式会社 流量センサおよび流量センサ装置
JP6372097B2 (ja) * 2014-03-07 2018-08-15 株式会社リコー 検出装置、検出回路、センサモジュール及び画像形成装置
WO2015151273A1 (ja) * 2014-04-04 2015-10-08 三菱電機株式会社 半導体装置
US10655991B2 (en) 2014-07-30 2020-05-19 Hitachi Automotive Systems, Ltd. Physical-quantity detection device for intake air in an internal combustion engine
US10031006B2 (en) * 2014-07-30 2018-07-24 Hitachi Automotive Systems, Ltd. Sensor including a printed circuit board with semiconductor parts having a first and second resin
JP6158156B2 (ja) * 2014-09-30 2017-07-05 日立オートモティブシステムズ株式会社 熱式流体センサの製造方法
JP2016090413A (ja) * 2014-11-06 2016-05-23 日立オートモティブシステムズ株式会社 熱式空気流量計
JP6154966B2 (ja) 2014-12-08 2017-06-28 日立オートモティブシステムズ株式会社 物理量検出装置
US20180313681A1 (en) * 2015-03-05 2018-11-01 Hitachi Automotive Systems, Ltd. Air Flow Rate Detecting Device
JP2017015420A (ja) * 2015-06-29 2017-01-19 日立オートモティブシステムズ株式会社 物理量検出装置
JP5961731B2 (ja) * 2015-06-29 2016-08-02 日立オートモティブシステムズ株式会社 熱式流量計
KR102346643B1 (ko) * 2015-06-30 2022-01-03 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈
EP3358314B1 (en) * 2015-09-30 2021-05-12 Hitachi Automotive Systems, Ltd. Physical quantity detection device
US10217684B2 (en) * 2015-09-30 2019-02-26 Hitachi Automotive Systems, Ltd. Resin molding and sensor device
JP6520636B2 (ja) * 2015-10-16 2019-05-29 株式会社デンソー 物理量センササブアセンブリおよび物理量測定装置
JP6272399B2 (ja) * 2016-06-27 2018-01-31 日立オートモティブシステムズ株式会社 熱式流量計
JP6553587B2 (ja) * 2016-12-20 2019-07-31 Ｎｉｓｓｈａ株式会社 ガスセンサモジュール及びその製造方法
JP2019027881A (ja) * 2017-07-28 2019-02-21 アズビル株式会社 測定装置
EP3680630B1 (en) * 2017-09-05 2022-10-05 Hitachi Astemo, Ltd. Thermal-type flowmeter
JP6416357B1 (ja) * 2017-10-05 2018-10-31 三菱電機株式会社 流量測定装置
JP6838227B2 (ja) * 2018-03-09 2021-03-03 日立Astemo株式会社 物理量測定装置
JP6915160B2 (ja) * 2018-05-22 2021-08-04 日立Astemo株式会社 物理量検出装置
JP2020016465A (ja) * 2018-07-23 2020-01-30 ミネベアミツミ株式会社 流体センサ
KR102189311B1 (ko) * 2018-08-21 2020-12-09 두산중공업 주식회사 학습된 모델을 이용한 해석 장치 및 이를 위한 방법
KR102138227B1 (ko) * 2018-08-21 2020-07-27 두산중공업 주식회사 유동 해석을 최적화하기 위한 장치 및 이를 위한 방법
CN112912699B (zh) * 2018-11-05 2024-03-19 日立安斯泰莫株式会社 芯片封装件的定位固定结构
JP2020094933A (ja) * 2018-12-13 2020-06-18 日立オートモティブシステムズ株式会社 熱式流量計
JP7162961B2 (ja) * 2019-03-04 2022-10-31 日立Astemo株式会社 流量測定装置
JP7164280B2 (ja) * 2019-03-04 2022-11-01 日立Astemo株式会社 物理量検出装置
US11499854B2 (en) 2019-03-29 2022-11-15 Hitachi Astemo, Ltd. Physical-quantity detection device
JP2020201093A (ja) * 2019-06-07 2020-12-17 株式会社デンソー 流量センサ
JP7261689B2 (ja) * 2019-08-07 2023-04-20 ナブテスコ株式会社 圧力センサ取付け用アダプタおよびセンサ
JP7390254B2 (ja) 2020-05-14 2023-12-01 日立Astemo株式会社 熱式流量計
EP3944304A1 (en) * 2020-07-20 2022-01-26 Nexperia B.V. A semiconductor device and a method of manufacture

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01301120A (ja) * 1988-05-30 1989-12-05 Mitsubishi Electric Corp 半導体流速センサ
JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
JP2784286B2 (ja) 1991-12-09 1998-08-06 三菱電機株式会社 半導体センサー装置の製造方法
JPH06265384A (ja) * 1993-03-15 1994-09-20 Hitachi Ltd 熱式空気流量計
JP3019784B2 (ja) * 1996-09-04 2000-03-13 サンケン電気株式会社 流体の流れ検出装置
JP3328547B2 (ja) * 1997-06-16 2002-09-24 株式会社日立製作所 熱式空気流量センサ
DE19741031A1 (de) * 1997-09-18 1999-03-25 Bosch Gmbh Robert Vorrichtung zur Messung der Masse eines strömenden Mediums
KR100265566B1 (ko) 1998-05-12 2000-09-15 김영환 칩 스택 패키지
JP2000002572A (ja) * 1998-06-15 2000-01-07 Unisia Jecs Corp 気体流量計測装置
JP3610484B2 (ja) * 1999-08-10 2005-01-12 株式会社日立製作所 熱式空気流量計
DE10002435A1 (de) * 2000-01-21 2001-07-26 Bosch Gmbh Robert Sensorvorrichtung
JP3577269B2 (ja) * 2000-08-30 2004-10-13 株式会社日立製作所 熱式空気流量センサおよびその形成方法
JP3709339B2 (ja) * 2000-12-05 2005-10-26 株式会社日立製作所 流量計測装置
JP3785319B2 (ja) * 2000-12-11 2006-06-14 株式会社日立製作所 流量計測装置
JP2003090750A (ja) * 2001-09-19 2003-03-28 Ngk Spark Plug Co Ltd 流量及び流速測定装置
JP2003240614A (ja) * 2002-02-21 2003-08-27 Denso Corp 流量測定装置
JP2003254805A (ja) 2002-03-07 2003-09-10 Hitachi Ltd 熱式流量センサおよび光供給方法
JP3845615B2 (ja) 2002-03-12 2006-11-15 アドバンス電気工業株式会社 流量センサー
JP2004074713A (ja) 2002-08-21 2004-03-11 Hitachi Chem Co Ltd 半導体モールド用離型シート
JPWO2004023126A1 (ja) * 2002-09-03 2005-12-22 日本特殊陶業株式会社 シリコン製マイクロセンサの実装方法、製造方法およびシリコン製マイクロセンサ
JP2004361271A (ja) * 2003-06-05 2004-12-24 Hitachi Ltd 熱式空気流量計
JP2005172526A (ja) * 2003-12-09 2005-06-30 Denso Corp 流量測定装置およびその製造方法
JP4609019B2 (ja) * 2004-09-24 2011-01-12 株式会社デンソー 熱式流量センサ及びその製造方法
US7198981B2 (en) * 2004-10-21 2007-04-03 Honeywell International Inc. Vacuum sealed surface acoustic wave pressure sensor
US7546772B2 (en) * 2004-12-30 2009-06-16 Honeywell International Inc. Piezoresistive pressure sensor
JP5067648B2 (ja) 2005-03-10 2012-11-07 光照 木村 加熱ダイオード温度測定装置とこれを用いた赤外線温度測定装置および流量測定装置ならびに流量センシング部の製作方法
JP4975972B2 (ja) * 2005-03-15 2012-07-11 日立オートモティブシステムズ株式会社 物理量センサ
KR20070116097A (ko) * 2005-03-16 2007-12-06 야마하 가부시키가이샤 반도체 장치, 반도체 장치의 제조 방법, 및 덮개 프레임
DE102005016449A1 (de) * 2005-04-11 2006-10-12 Robert Bosch Gmbh Beheizter Heißfilmluftmassenmesser
DE102005038598A1 (de) * 2005-08-16 2007-02-22 Robert Bosch Gmbh Heißfilmluftmassenmesser mit Strömungsablösungselement
JP4674529B2 (ja) * 2005-11-07 2011-04-20 株式会社デンソー 湿度センサ装置及びその製造方法
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations
JP2008020193A (ja) * 2006-07-10 2008-01-31 Mitsubishi Electric Corp 熱式流量センサ
JP4317556B2 (ja) * 2006-07-21 2009-08-19 株式会社日立製作所 熱式流量センサ
DE112006004083T5 (de) * 2006-10-18 2009-11-26 Sensirion Holding Ag Verfahren zum Verpacken integrierter Sensoren
JP4882732B2 (ja) 2006-12-22 2012-02-22 株式会社デンソー 半導体装置
JP4894531B2 (ja) * 2007-01-22 2012-03-14 株式会社デンソー 熱式流量センサ
JP2008224358A (ja) * 2007-03-12 2008-09-25 Konica Minolta Holdings Inc 熱式流量センサ及び流量計測装置
US7472608B2 (en) * 2007-04-04 2009-01-06 Rosemount Inc. Flangeless differential pressure transmitter for industrial process control systems
JP2009025098A (ja) * 2007-07-18 2009-02-05 Star Micronics Co Ltd 熱式流量センサ
JP2009031067A (ja) 2007-07-25 2009-02-12 Denso Corp センサ装置
JP4952428B2 (ja) * 2007-08-01 2012-06-13 株式会社デンソー センサ装置
US8256285B2 (en) * 2007-08-21 2012-09-04 BELIMO Holding, AG Flow sensor including a base member with a resilient region forming a flow channel and a cover member covering the flow channel
JP4450031B2 (ja) * 2007-08-22 2010-04-14 株式会社デンソー 半導体部品
JP5012330B2 (ja) * 2007-08-29 2012-08-29 株式会社デンソー センサ装置の製造方法及びセンサ装置
JP5183164B2 (ja) * 2007-11-19 2013-04-17 日立オートモティブシステムズ株式会社 流量測定装置
DE102008011943B4 (de) * 2008-02-29 2012-04-26 Robert Bosch Gmbh Sensoranordnung zur Differenzdruckmessung
JP5168091B2 (ja) 2008-11-05 2013-03-21 株式会社デンソー 熱式フローセンサの製造方法及び熱式フローセンサ
JP2010197144A (ja) * 2009-02-24 2010-09-09 Denso Corp エアフローメータ
JP5293278B2 (ja) * 2009-03-05 2013-09-18 株式会社デンソー 熱式流量計
WO2012049742A1 (ja) * 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法

Also Published As

Publication number Publication date
US9222814B2 (en) 2015-12-29
KR101444867B1 (ko) 2014-09-26
EP3421949A1 (en) 2019-01-02
EP3421949B1 (en) 2024-04-17
WO2012049934A1 (ja) 2012-04-19
CN103994794B (zh) 2017-04-12
CN105333913B (zh) 2018-11-02
US20130192388A1 (en) 2013-08-01
CN103994795B (zh) 2017-07-21
JP6220914B2 (ja) 2017-10-25
KR20120053022A (ko) 2012-05-24
EP2629065A4 (en) 2017-12-13
KR20140022965A (ko) 2014-02-25
JP5909250B2 (ja) 2016-04-26
CN105333913A (zh) 2016-02-17
JP2014059327A (ja) 2014-04-03
KR101414755B1 (ko) 2014-07-04
JP2012112979A (ja) 2012-06-14
US8640538B2 (en) 2014-02-04
KR20140022964A (ko) 2014-02-25
CN105486364B (zh) 2020-08-18
CN103994794A (zh) 2014-08-20
CN105486364A (zh) 2016-04-13
JP5456816B2 (ja) 2014-04-02
CN102575955B (zh) 2015-12-02
KR101411440B1 (ko) 2014-07-02
EP2629065A1 (en) 2013-08-21
WO2012049742A1 (ja) 2012-04-19
US9222813B2 (en) 2015-12-29
JP2016106235A (ja) 2016-06-16
MX2012003145A (es) 2012-09-27
US20140109691A1 (en) 2014-04-24
CN102575955A (zh) 2012-07-11
CN103994795A (zh) 2014-08-20
US20140190273A1 (en) 2014-07-10

Similar Documents

Publication Publication Date Title
MX349742B (es) Sensor de flujo y metodo de fabricacion del mismo, y modulo de sensor de flujo y metodo de fabricacion del mismo.
TW201613044A (en) Fingerprint recognition chip packaging structure and packaging method
PL2029428T3 (pl) Sposób i układ wykrywania ryzyka oblodzenia na powierzchniach areodynamicznych
TW200739829A (en) Semiconductor device
WO2015028885A3 (en) Device for thermally denaturing biomolecule and method for producing device
EP2040045A3 (en) Flow sensor and manufacturing method therefor
EP2339302A3 (en) Flow sensor, method for manufacturing flow sensor and flow sensor module
WO2007079454A3 (en) Pressure sensor with silicon frit bonded cap
WO2009142391A3 (ko) 발광소자 패키지 및 그 제조방법
TW200743235A (en) Detecting plasmons using a metallurgical junction
EP4047647A3 (en) Semiconductor device
TW200707598A (en) A method of manufacturing a semiconductor device
WO2009034697A1 (ja) シリコン構造体およびその製造方法並びにセンサチップ
WO2013144126A3 (fr) Procede de determination d'un etat de credibilite de mesures de capteurs d'un aeronef et systeme correspondant
EP2857349A3 (en) Gas sensor package
WO2014037257A3 (de) Temperaturmessvorrichtung zur bestimmung der temperatur an der oberfläche einer rohrleitung
MX2014006661A (es) Aparatos de medición de flujo.
WO2013167466A3 (en) Integrated circuit with directional light sensor, device including such an ic and method of manufacturing such an ic
WO2011050886A3 (de) Solarkonzentrator und dessen herstellungsverfahren
WO2013061312A8 (en) Method and device for optical analysis of particles at low temperatures
EP2430648A4 (en) PHOTOVOLTAIC DEVICE
WO2011004161A3 (en) Flow restrictor device
JP2011023595A5 (es)
WO2008057911A3 (en) Microelectronic flow sensor packaging method and system
BRPI1105712A2 (pt) disco de freio de material heterogÊneo do tipo unitÁrio e processo para sua fabricaÇço