MX336040B - Modulos de antena rfid y procedimientos de fabricacion. - Google Patents

Modulos de antena rfid y procedimientos de fabricacion.

Info

Publication number
MX336040B
MX336040B MX2014002897A MX2014002897A MX336040B MX 336040 B MX336040 B MX 336040B MX 2014002897 A MX2014002897 A MX 2014002897A MX 2014002897 A MX2014002897 A MX 2014002897A MX 336040 B MX336040 B MX 336040B
Authority
MX
Mexico
Prior art keywords
winding core
making
methods
rfid antenna
antenna modules
Prior art date
Application number
MX2014002897A
Other languages
English (en)
Other versions
MX2014002897A (es
Inventor
David Finn
Lionel Carré
Original Assignee
Feinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/294,578 external-priority patent/US20120055013A1/en
Priority claimed from US13/310,718 external-priority patent/US8366009B2/en
Application filed by Feinics Amatech Teoranta filed Critical Feinics Amatech Teoranta
Publication of MX2014002897A publication Critical patent/MX2014002897A/es
Publication of MX336040B publication Critical patent/MX336040B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Support Of Aerials (AREA)

Abstract

Un núcleo de arrollamiento NE) que tiene una parte de cuerpo tubular (C) y dos extremos se monta por uno de sus extremos en una cinta de módulos (CM), una antena modular se enrolla (AM) alrededor del núcleo de enrollamiento (NE), se dispone un chip (MC) en la cinta de módulos (CM) dentro del núcleo de enrollamiento (NE). Se realizan conexiones (wb), y se aplica encapsulado de gota de resina ("glob-top") (GT) sobre el chip (MC), rellenando sustancialmente el área interior del núcleo de arrollamiento (NE). La antena modular (AM), el núcleo de arrollamiento (NE) y el chip (MC) pueden ser sobremoldeados posteriormente con una masa de moldeo (MM). El núcleo de arrollamiento (NE) puede tener un reborde (R) en un extremo.
MX2014002897A 2011-09-11 2012-08-20 Modulos de antena rfid y procedimientos de fabricacion. MX336040B (es)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US201161533228P 2011-09-11 2011-09-11
US13/294,578 US20120055013A1 (en) 2010-07-13 2011-11-11 Forming microstructures and antennas for transponders
US201161561938P 2011-11-21 2011-11-21
US13/310,718 US8366009B2 (en) 2010-08-12 2011-12-03 Coupling in and to RFID smart cards
US201161569317P 2011-12-12 2011-12-12
US201261586781P 2012-01-14 2012-01-14
US201261595088P 2012-02-05 2012-02-05
US201261624384P 2012-04-15 2012-04-15
US201261624412P 2012-04-16 2012-04-16
US201261646369P 2012-05-14 2012-05-14
US201261660668P 2012-06-15 2012-06-15
PCT/EP2012/066183 WO2013034426A1 (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making

Publications (2)

Publication Number Publication Date
MX2014002897A MX2014002897A (es) 2014-10-14
MX336040B true MX336040B (es) 2016-01-07

Family

ID=46763058

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014002897A MX336040B (es) 2011-09-11 2012-08-20 Modulos de antena rfid y procedimientos de fabricacion.

Country Status (8)

Country Link
EP (1) EP2754204A1 (es)
KR (1) KR20140071423A (es)
CN (1) CN103891045B (es)
AU (1) AU2012306568A1 (es)
BR (1) BR112014005507A2 (es)
CA (1) CA2847968A1 (es)
MX (1) MX336040B (es)
WO (1) WO2013034426A1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
WO2014191123A1 (en) * 2013-05-28 2014-12-04 Féinics Amatech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
CN103730733B (zh) * 2013-09-09 2019-03-22 胜美达集团株式会社 电子模块
KR102085105B1 (ko) * 2019-05-20 2020-03-05 주식회사 엔에이블 박막화 가능한 전자 여권용 스마트 카드

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US5084699A (en) 1989-05-26 1992-01-28 Trovan Limited Impedance matching coil assembly for an inductively coupled transponder
DE69011292T2 (de) 1989-07-03 1995-03-16 Sokymat S A Verfahren zur herstellung von elektronischen komponenten mit einer spule aus dünndraht.
DE3935364C1 (es) 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De
JPH073808B2 (ja) 1990-04-19 1995-01-18 アキュ グスタフソ プリント回路上へのコイル組立て方法
CH684642A5 (fr) 1991-02-25 1994-11-15 Ake Gustafson Pince de maintien d'un corps de bobine dans une machine de bobinage.
JPH0817132B2 (ja) 1991-02-25 1996-02-21 アキュ グスタフソ 電子回路に巻線を固定する方法
NL9100347A (nl) 1991-02-26 1992-03-02 Nedap Nv Geintegreerde transformator voor een contactloze identificatiekaart.
DE4311493C2 (de) 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
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DE4443980C2 (de) 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
US5955723A (en) 1995-05-03 1999-09-21 Siemens Aktiengesellschaft Contactless chip card
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ATE193136T1 (de) 1996-02-12 2000-06-15 David Finn Verfahren und vorrichtung zur kontaktierung eines drahtleiters
DE59701709C5 (de) 1996-02-12 2014-01-09 Smartrac Ip B.V. Verfahren und vorrichtung zur kontaktierung eines drahtleiters
FR2744863B1 (fr) * 1996-02-13 1998-03-06 Schlumberger Ind Sa Procede de realisation d'un objet portatif a antenne bobinee
DE19654902C2 (de) 1996-03-15 2000-02-03 David Finn Chipkarte
DE19632813C2 (de) 1996-08-14 2000-11-02 Siemens Ag Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte
DE19634661A1 (de) 1996-08-28 1998-03-05 David Finn Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung
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US6424301B1 (en) * 2000-03-01 2002-07-23 Siemens Vdo Automotive Corporation Combination battery holder and antenna for keyfob
FR2838850B1 (fr) 2002-04-18 2005-08-05 Framatome Connectors Int Procede de conditionnement de microcircuits electroniques pour carte a puce et microcircuit electronique ainsi obtenu
FR2882174B1 (fr) 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
FR2890212B1 (fr) 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
FR2890502A1 (fr) 2005-09-02 2007-03-09 Gemplus Sa Ajustement de frequence de resonance par reglage de capacite repartie inter-spires
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DE102006024247A1 (de) * 2006-05-23 2007-11-29 Denso Corp., Kariya Drahtlose Kartentyp-Vorrichtung, Antennenspule und Verfahren zum Herstellen eines Kommunikationsmoduls
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
FR2915011B1 (fr) 2007-03-29 2009-06-05 Smart Packaging Solutions Sps Carte a puce a double interface de communication
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
FR2919409B1 (fr) 2007-07-26 2009-09-04 Smart Packaging Solutions Sps Document securise a puce sans contact avec protection des donnees contre les lectures non autorisees.
EP2045872B1 (en) 2007-10-03 2011-08-10 Assa Abloy Ab Coupling device for transponder and smart card with such device
FR2932910B1 (fr) 2008-06-20 2011-02-11 Smart Packaging Solutions Sps Carte sans contact avec logo securitaire
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling

Also Published As

Publication number Publication date
EP2754204A1 (en) 2014-07-16
AU2012306568A1 (en) 2014-03-20
KR20140071423A (ko) 2014-06-11
CN103891045B (zh) 2016-08-17
CN103891045A (zh) 2014-06-25
CA2847968A1 (en) 2013-03-14
BR112014005507A2 (pt) 2017-06-13
WO2013034426A1 (en) 2013-03-14
MX2014002897A (es) 2014-10-14

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