MX2023008244A - Metodo para la fabricacion de matrices no planares con una unica tarjeta de circuito hibrido flexible. - Google Patents

Metodo para la fabricacion de matrices no planares con una unica tarjeta de circuito hibrido flexible.

Info

Publication number
MX2023008244A
MX2023008244A MX2023008244A MX2023008244A MX2023008244A MX 2023008244 A MX2023008244 A MX 2023008244A MX 2023008244 A MX2023008244 A MX 2023008244A MX 2023008244 A MX2023008244 A MX 2023008244A MX 2023008244 A MX2023008244 A MX 2023008244A
Authority
MX
Mexico
Prior art keywords
hybrid circuit
flexible
circuit card
side panel
planar arrays
Prior art date
Application number
MX2023008244A
Other languages
English (en)
Inventor
Channing Paige Favreau
James E Benedict
Mikhail Pevzner
Thomas V Sikina
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of MX2023008244A publication Critical patent/MX2023008244A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09985—Hollow waveguide combined with printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Structure Of Printed Boards (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Un método para fabricar un conjunto de circuito impreso incluye proporcionar un circuito híbrido flexible (18) que tiene una base (20) y al menos un panel lateral (24a-c). El al menos un panel lateral (24a-c) está conectado de manera articulada a la base (20). El método incluye además disponer una estructura de soporte (12) en el circuito híbrido flexible (18). La estructura de soporte (12) incluye una base, que se dispone sobre la base (20) del circuito híbrido flexible (18), y al menos un lado que corresponde al al menos un panel lateral (24a-c) del circuito híbrido flexible (18). El método incluye además plegar el al menos un panel lateral (24a-c) del circuito híbrido flexible (18) de manera que el al menos un panel lateral (24a-c) quede dispuesto en el mismo plano que el al menos un lado de la estructura de soporte (12) para crear un conjunto de circuito impreso.
MX2023008244A 2021-02-12 2021-12-10 Metodo para la fabricacion de matrices no planares con una unica tarjeta de circuito hibrido flexible. MX2023008244A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/174,904 US11497118B2 (en) 2021-02-12 2021-02-12 Method for manufacturing non-planar arrays with a single flex-hybrid circuit card
PCT/US2021/062919 WO2022173500A1 (en) 2021-02-12 2021-12-10 Method for manufacturing non-planar arrays with a single flex-hybrid circuit card

Publications (1)

Publication Number Publication Date
MX2023008244A true MX2023008244A (es) 2023-07-26

Family

ID=80112090

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023008244A MX2023008244A (es) 2021-02-12 2021-12-10 Metodo para la fabricacion de matrices no planares con una unica tarjeta de circuito hibrido flexible.

Country Status (8)

Country Link
US (1) US11497118B2 (es)
EP (1) EP4292405A1 (es)
JP (1) JP2024505554A (es)
KR (1) KR20230136662A (es)
AU (1) AU2021427204A1 (es)
IL (1) IL304132B2 (es)
MX (1) MX2023008244A (es)
WO (1) WO2022173500A1 (es)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927344B1 (en) 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
US7338332B2 (en) 2006-05-15 2008-03-04 Sony Ericsson Mobile Communications Ab Flexible circuit to board connector
DE102009060777A1 (de) * 2009-12-22 2011-06-30 Automotive Lighting Reutlingen GmbH, 72762 Elektronisches Steuergerät und Verfahren zur Herstellung einer Einheit aus einem Grundkörper und einer Leiterplatte zum Einsatz in einem solchen Steuergerät
US8368154B2 (en) 2010-02-17 2013-02-05 The Regents Of The University Of California Three dimensional folded MEMS technology for multi-axis sensor systems
US20120151758A1 (en) 2010-12-20 2012-06-21 Biotronik Se & Co. Kg In-Situ Fold-Assisting Frame for Flexible Substrates
JP2016515714A (ja) 2013-03-15 2016-05-30 デジタルオプティクス コーポレーション エムイーエムエス 小型ｍｅｍｓアクチュエータアセンブリ
CA3200701A1 (en) 2019-04-26 2020-10-29 Raphael Joseph Welsh Systems and methods for signal communication with scalable, modular network nodes

Also Published As

Publication number Publication date
WO2022173500A1 (en) 2022-08-18
IL304132B2 (en) 2024-05-01
EP4292405A1 (en) 2023-12-20
US11497118B2 (en) 2022-11-08
IL304132B1 (en) 2024-01-01
AU2021427204A1 (en) 2023-06-29
KR20230136662A (ko) 2023-09-26
US20220264745A1 (en) 2022-08-18
IL304132A (en) 2023-09-01
JP2024505554A (ja) 2024-02-06

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