MX2021015355A - Composiciones de polisiloxano térmicamente conductoras. - Google Patents

Composiciones de polisiloxano térmicamente conductoras.

Info

Publication number
MX2021015355A
MX2021015355A MX2021015355A MX2021015355A MX2021015355A MX 2021015355 A MX2021015355 A MX 2021015355A MX 2021015355 A MX2021015355 A MX 2021015355A MX 2021015355 A MX2021015355 A MX 2021015355A MX 2021015355 A MX2021015355 A MX 2021015355A
Authority
MX
Mexico
Prior art keywords
thermally conductive
î1⁄4m
component
polysiloxane composition
conductive polysiloxane
Prior art date
Application number
MX2021015355A
Other languages
English (en)
Inventor
Atsushi Sakamoto
Sean Conte
Original Assignee
Momentive Performance Mat Jp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Momentive Performance Mat Jp filed Critical Momentive Performance Mat Jp
Publication of MX2021015355A publication Critical patent/MX2021015355A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
    • B01J23/42—Platinum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La presente invención proporciona una composición de polisiloxano térmicamente conductora que tiene una alta conductividad térmica, mientras que tiene una excelente eficiencia de trabajo debido a sus altas propiedades de eyección; una composición de polisiloxano térmicamente conductora que contiene (A) una relleno térmicamente conductor y (B) uno o más compuestos seleccionados del grupo que consiste en un compuesto que contiene un grupo alcoxisililo y un dimetilpolisiloxano, en donde: el componente (A) comprende (A-1) partículas redondas, de forma indefinida o poliédrica de nitruro de aluminio que tienen un diámetro medio de partícula de 50 m a 150 m y (A-2) partículas redondas, de forma indefinida o poliédrica de nitruro de aluminio que tienen un diámetro promedio de partícula de 10 m o más pero menos de 50 m en una cantidad del 20% en masa al 100% en masa con respecto a la cantidad total de componente (A); y la relación de contenido de componente (A-1) a componente (A-2) es de 50:50 a 95:5 en masa.
MX2021015355A 2019-06-26 2020-06-24 Composiciones de polisiloxano térmicamente conductoras. MX2021015355A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019119025 2019-06-26
PCT/JP2020/024767 WO2020262449A1 (ja) 2019-06-26 2020-06-24 熱伝導性ポリシロキサン組成物

Publications (1)

Publication Number Publication Date
MX2021015355A true MX2021015355A (es) 2022-04-06

Family

ID=74060192

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021015355A MX2021015355A (es) 2019-06-26 2020-06-24 Composiciones de polisiloxano térmicamente conductoras.

Country Status (7)

Country Link
US (1) US20220267533A1 (es)
EP (1) EP3992250A4 (es)
JP (1) JP7039157B2 (es)
CN (1) CN114008141B (es)
MX (1) MX2021015355A (es)
TW (1) TW202108676A (es)
WO (1) WO2020262449A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023062399A (ja) 2021-10-21 2023-05-08 信越化学工業株式会社 熱伝導性シリコーン組成物
EP4276151A1 (en) * 2021-12-23 2023-11-15 Resonac Corporation Thermally conductive composition and cured product thereof
WO2023243707A1 (ja) * 2022-06-17 2023-12-21 積水化学工業株式会社 シリコーン組成物、放熱部材、及び電子機器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4144998B2 (ja) 2000-06-26 2008-09-03 信越化学工業株式会社 放熱用部材
JP4907998B2 (ja) * 2006-01-18 2012-04-04 住友大阪セメント株式会社 樹脂組成物
JP2009096961A (ja) 2007-10-19 2009-05-07 Shin Etsu Chem Co Ltd リワーク性に優れた熱伝導性シリコーングリース組成物
JP5664563B2 (ja) 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP6223590B2 (ja) * 2015-05-22 2017-11-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
KR102544366B1 (ko) * 2015-05-22 2023-06-19 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 열전도성 조성물
US11739245B2 (en) * 2016-07-22 2023-08-29 Momentive Performance Materials Japan Llc Thermally conductive polyorganosiloxane composition
TWI744361B (zh) 2016-07-22 2021-11-01 日商邁圖高新材料日本合同公司 熱傳導性聚矽氧烷組成物
US20200157350A1 (en) * 2017-05-31 2020-05-21 Momentive Performance Materials Japan Llc Thermally conductive polyorganosiloxane composition

Also Published As

Publication number Publication date
WO2020262449A1 (ja) 2020-12-30
CN114008141A (zh) 2022-02-01
JPWO2020262449A1 (es) 2020-12-30
US20220267533A1 (en) 2022-08-25
CN114008141B (zh) 2023-09-22
EP3992250A4 (en) 2023-07-19
EP3992250A1 (en) 2022-05-04
JP7039157B2 (ja) 2022-03-22
TW202108676A (zh) 2021-03-01

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