MX2017003170A - Montaje de disipador de calor y metodo para utilizar un montaje de disipador de calor. - Google Patents

Montaje de disipador de calor y metodo para utilizar un montaje de disipador de calor.

Info

Publication number
MX2017003170A
MX2017003170A MX2017003170A MX2017003170A MX2017003170A MX 2017003170 A MX2017003170 A MX 2017003170A MX 2017003170 A MX2017003170 A MX 2017003170A MX 2017003170 A MX2017003170 A MX 2017003170A MX 2017003170 A MX2017003170 A MX 2017003170A
Authority
MX
Mexico
Prior art keywords
heat sink
sink assembly
utilizing
assembly
vents
Prior art date
Application number
MX2017003170A
Other languages
English (en)
Inventor
Park Jihyun
LEE Junseo
Lee Kiyoung
Lee Haejoo
Park Joonyoung
Original Assignee
Opentv Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opentv Inc filed Critical Opentv Inc
Publication of MX2017003170A publication Critical patent/MX2017003170A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un montaje de disipador de calor y un metodo para utilizar un montaje de disipador de calor donde el montaje de disipador de calor esta configurado para disipar el aire de la parte inferior del montaje de disipador de calor a la parte superior del montaje de disipador de calor que utiliza una pluralidad de respiraderos para enfriar un componente electrico deseado.
MX2017003170A 2014-09-10 2015-09-09 Montaje de disipador de calor y metodo para utilizar un montaje de disipador de calor. MX2017003170A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/482,533 US9326424B2 (en) 2014-09-10 2014-09-10 Heat sink assembly and method of utilizing a heat sink assembly
PCT/US2015/049194 WO2016040486A1 (en) 2014-09-10 2015-09-09 Heat sink assembly and method of utilizing a heat sink assembly

Publications (1)

Publication Number Publication Date
MX2017003170A true MX2017003170A (es) 2017-10-12

Family

ID=54186303

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017003170A MX2017003170A (es) 2014-09-10 2015-09-09 Montaje de disipador de calor y metodo para utilizar un montaje de disipador de calor.

Country Status (9)

Country Link
US (1) US9326424B2 (es)
EP (1) EP3192340A1 (es)
CN (1) CN106716628A (es)
AU (1) AU2015315155A1 (es)
BR (1) BR112017004588A2 (es)
CA (1) CA2960272A1 (es)
MX (1) MX2017003170A (es)
SG (1) SG11201701656XA (es)
WO (1) WO2016040486A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3254334B1 (en) * 2015-02-26 2023-11-22 Huawei Technologies Co., Ltd. A radio unit housing and a base station antenna module
MX2019003204A (es) * 2016-09-21 2019-06-10 Tti Macao Commercial Offshore Ltd Estructura mejorada de disipador de calor y disipacion de calor.
US10615514B2 (en) 2017-07-14 2020-04-07 Amazon Technologies, Inc. Antenna structures of a multi-radio, multi-channel (MRMC) mesh network device
US10291698B2 (en) 2017-07-14 2019-05-14 Amazon Technologies, Inc. Antenna structures and isolation chambers of a multi-radio, multi-channel (MRMC) mesh network device
CN108963408A (zh) * 2018-07-02 2018-12-07 四川莱源科技有限公司 球面数字阵列天线的散热设计方法
US11678465B2 (en) 2018-11-08 2023-06-13 Hewlett Packard Enterprise Development Lp Thermal interface apparatus for PCI express M.2 printed circuit assemblies

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5218516A (en) 1991-10-31 1993-06-08 Northern Telecom Limited Electronic module
EP0948248A1 (en) 1998-03-24 1999-10-06 Lucent Technologies Inc. Electronic apparatus having an environmentally sealed enclosure
EP0946085A1 (en) 1998-03-24 1999-09-29 Lucent Technologies Inc. Electronic apparatus having an environmentally sealed external enclosure
US6851467B1 (en) * 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
FI20021027A0 (fi) * 2002-05-31 2002-05-31 Outokumpu Oy Jäähdytinelementti elektroniikkalaitteeseen
JP3854920B2 (ja) 2002-10-10 2006-12-06 株式会社ソニー・コンピュータエンタテインメント 電子機器の放熱構造
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
CN100482060C (zh) 2006-02-22 2009-04-22 富准精密工业(深圳)有限公司 散热装置
KR101403901B1 (ko) 2007-11-05 2014-06-27 삼성전자주식회사 열방사를 위한 방열체
US8109321B2 (en) * 2008-03-05 2012-02-07 Alcatel Lucent Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
WO2011068259A1 (ko) * 2009-12-02 2011-06-09 한국과학기술원 히트싱크
TW201204227A (en) * 2010-07-05 2012-01-16 Hon Hai Prec Ind Co Ltd Heat dissipation apparatus

Also Published As

Publication number Publication date
US9326424B2 (en) 2016-04-26
CN106716628A (zh) 2017-05-24
AU2015315155A1 (en) 2017-04-27
CA2960272A1 (en) 2016-03-17
BR112017004588A2 (pt) 2018-01-23
WO2016040486A1 (en) 2016-03-17
US20160073551A1 (en) 2016-03-10
EP3192340A1 (en) 2017-07-19
SG11201701656XA (en) 2017-04-27

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