MX2013002898A - Metodo mejorado para co-pulverizacion ionica aleaciones y compuestos utilizando una ordenacion de catodo doble de tipo c-mag y aparato correspondiente. - Google Patents
Metodo mejorado para co-pulverizacion ionica aleaciones y compuestos utilizando una ordenacion de catodo doble de tipo c-mag y aparato correspondiente.Info
- Publication number
- MX2013002898A MX2013002898A MX2013002898A MX2013002898A MX2013002898A MX 2013002898 A MX2013002898 A MX 2013002898A MX 2013002898 A MX2013002898 A MX 2013002898A MX 2013002898 A MX2013002898 A MX 2013002898A MX 2013002898 A MX2013002898 A MX 2013002898A
- Authority
- MX
- Mexico
- Prior art keywords
- sputtering
- targets
- mag
- dual
- compounds
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Ciertas modalidades ejemplares de esta invención se refieren a técnicas para la deposición por pulverización iónica de una(s) película(s) delgada(s) que incluye(n) dos o más materiales utilizando objetivos tales como los objetivos de pulverización iónica, cilíndricos, rotatorios, incluyendo un método y aparato. Los ensamblajes de barras magnéticas en el primer y segundo objetivos adyacentes de pulverización iónica están orientados de diferente manera. Las diferentes orientaciones de los ensamblajes de barras magnéticas permiten que el material del segundo objetivo sea pulverizado iónicamente sobre el primer objetivo, o viceversa. La mezcla de material en el primer objetivo, que incluye el material de pulverización iónica de tanto el primer objetivo como el segundo objetivo, entonces se pulveriza iónicamente sobre un substrato para formar una película delgada depositada por pulverización iónica que incluye una mezcla de materiales de pulverización iónica de los objetivos. La figura más representativa de la invención es la número 1.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/923,389 US20120067717A1 (en) | 2010-09-17 | 2010-09-17 | Method of co-sputtering alloys and compounds using a dual C-MAG cathode arrangement and corresponding apparatus |
PCT/US2011/000982 WO2012036718A1 (en) | 2010-09-17 | 2011-06-01 | Improved method of co-sputtering alloys and compounds using a dual c-mag cathode arrangement and corresponding apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2013002898A true MX2013002898A (es) | 2013-04-11 |
MX351707B MX351707B (es) | 2017-10-26 |
Family
ID=44627283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2013002898A MX351707B (es) | 2010-09-17 | 2011-06-01 | Metodo mejorado para co-pulverizacion ionica aleaciones y compuestos utilizando una ordenacion de catodo doble de tipo c-mag y aparato correspondiente. |
Country Status (9)
Country | Link |
---|---|
US (1) | US20120067717A1 (es) |
EP (1) | EP2616566B1 (es) |
BR (1) | BR112013006338A2 (es) |
ES (1) | ES2673272T3 (es) |
MX (1) | MX351707B (es) |
PL (1) | PL2616566T3 (es) |
RU (1) | RU2578336C2 (es) |
TR (1) | TR201809669T4 (es) |
WO (1) | WO2012036718A1 (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105006501A (zh) * | 2015-08-14 | 2015-10-28 | 厦门神科太阳能有限公司 | Cigs基薄膜太阳能电池的制备方法及制备装置 |
RU2623944C1 (ru) * | 2016-02-08 | 2017-06-29 | Федеральное государственное бюджетное учреждение науки Институт металлургии и материаловедения им. А.А. Байкова Российской академии наук (ИМЕТ РАН) | Способ получения композиционного пористого биоактивного покрытия |
CN108018533A (zh) * | 2017-11-24 | 2018-05-11 | 中国电子科技集团公司第四十八研究所 | 一种多层异靶材膜镀膜***及其镀膜方法 |
CN108977787B (zh) * | 2018-09-17 | 2019-10-18 | 重庆大学 | 一种磁控溅射镀膜阴极结构 |
DE102020120424A1 (de) | 2020-08-03 | 2022-02-03 | VON ARDENNE Asset GmbH & Co. KG | Sputtervorrichtung, Verfahren, Steuervorrichtung und Halbleiterbauelement |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5317006A (en) | 1989-06-15 | 1994-05-31 | Microelectronics And Computer Technology Corporation | Cylindrical magnetron sputtering system |
AU8320491A (en) * | 1990-07-06 | 1992-02-04 | Boc Group, Inc., The | Method and apparatus for co-sputtering and cross-sputtering homogeneous films |
US5262032A (en) | 1991-05-28 | 1993-11-16 | Leybold Aktiengesellschaft | Sputtering apparatus with rotating target and target cooling |
DE4125110C2 (de) | 1991-07-30 | 1999-09-09 | Leybold Ag | Magnetron-Zerstäubungskathode für Vakuumbeschichtungsanlagen |
US5403458A (en) | 1993-08-05 | 1995-04-04 | Guardian Industries Corp. | Sputter-coating target and method of use |
US5405517A (en) * | 1993-12-06 | 1995-04-11 | Curtis M. Lampkin | Magnetron sputtering method and apparatus for compound thin films |
US5527439A (en) | 1995-01-23 | 1996-06-18 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
US5591314A (en) | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
ES2257047T3 (es) * | 1998-04-16 | 2006-07-16 | Bekaert Advanced Coatings Nv. | Medios para controlar la erosion y la pulverizacion del objetivo en un magnetron. |
US6488824B1 (en) * | 1998-11-06 | 2002-12-03 | Raycom Technologies, Inc. | Sputtering apparatus and process for high rate coatings |
WO2002084702A2 (en) * | 2001-01-16 | 2002-10-24 | Lampkin Curtis M | Sputtering deposition apparatus and method for depositing surface films |
RU2242821C2 (ru) * | 2002-10-17 | 2004-12-20 | Институт сильноточной электроники СО РАН | Магнетронная распылительная система |
JP2006083408A (ja) * | 2004-09-14 | 2006-03-30 | Shin Meiwa Ind Co Ltd | 真空成膜装置 |
EP1856712A2 (en) * | 2005-01-13 | 2007-11-21 | Cardinal CG Company | Reduced maintenance sputtering chambers |
DE102008034960A1 (de) * | 2008-07-25 | 2010-01-28 | Von Ardenne Anlagentechnik Gmbh | Verfahren und Beschichtungskammer zur Beschichtung eines Substrats mit einer transparenten Metalloxid-Schicht |
-
2010
- 2010-09-17 US US12/923,389 patent/US20120067717A1/en not_active Abandoned
-
2011
- 2011-06-01 ES ES11726528.0T patent/ES2673272T3/es active Active
- 2011-06-01 RU RU2013117115/02A patent/RU2578336C2/ru not_active IP Right Cessation
- 2011-06-01 PL PL11726528T patent/PL2616566T3/pl unknown
- 2011-06-01 BR BR112013006338A patent/BR112013006338A2/pt active Search and Examination
- 2011-06-01 EP EP11726528.0A patent/EP2616566B1/en not_active Not-in-force
- 2011-06-01 WO PCT/US2011/000982 patent/WO2012036718A1/en active Application Filing
- 2011-06-01 TR TR2018/09669T patent/TR201809669T4/tr unknown
- 2011-06-01 MX MX2013002898A patent/MX351707B/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
RU2578336C2 (ru) | 2016-03-27 |
US20120067717A1 (en) | 2012-03-22 |
PL2616566T3 (pl) | 2018-09-28 |
RU2013117115A (ru) | 2014-10-27 |
TR201809669T4 (tr) | 2018-07-23 |
ES2673272T3 (es) | 2018-06-21 |
EP2616566B1 (en) | 2018-04-11 |
WO2012036718A1 (en) | 2012-03-22 |
BR112013006338A2 (pt) | 2016-06-21 |
EP2616566A1 (en) | 2013-07-24 |
MX351707B (es) | 2017-10-26 |
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Legal Events
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FG | Grant or registration |