MX2013001838A - Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos - Google Patents
Proceso para el revestimiento no electrolitico de cobre de sustratos metalicosInfo
- Publication number
- MX2013001838A MX2013001838A MX2013001838A MX2013001838A MX2013001838A MX 2013001838 A MX2013001838 A MX 2013001838A MX 2013001838 A MX2013001838 A MX 2013001838A MX 2013001838 A MX2013001838 A MX 2013001838A MX 2013001838 A MX2013001838 A MX 2013001838A
- Authority
- MX
- Mexico
- Prior art keywords
- copper
- copper plating
- electroless copper
- metallic substrates
- layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49885—Assembling or joining with coating before or during assembling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12785—Group IIB metal-base component
- Y10T428/12792—Zn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Abstract
La invención se relaciona con un proceso para tratar una superficie metálica de un objeto con una solución acuosa de revestimiento de cobre, con la cual una primera solución de revestimiento de cobre, que está libre de cianuro y libre de un agente reductor fuerte, se aplica de manera no electrolítica a las superficies metálicas limpias del objeto, o después del pretratamiento a las superficies metálicas limpias, para formar una primera capa de cobre o una capa de aleación de cobre como una capa de barrera y/o como una capa conductora, y también con el uso de los objetos producidos mediante el proceso de acuerdo con la invención
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010039383 | 2010-08-17 | ||
PCT/EP2011/063752 WO2012022660A1 (de) | 2010-08-17 | 2011-08-10 | Verfahren zum stromlosen verkupfern von metallischen substraten |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2013001838A true MX2013001838A (es) | 2013-05-17 |
MX344173B MX344173B (es) | 2016-12-07 |
Family
ID=44630359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2013001838A MX344173B (es) | 2010-08-17 | 2011-08-10 | Proceso para el revestimiento no electrolitico de cobre de sustratos metalicos. |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130143071A1 (es) |
EP (1) | EP2606162A1 (es) |
BR (1) | BR112013003430A2 (es) |
DE (1) | DE102011080745A1 (es) |
MX (1) | MX344173B (es) |
WO (1) | WO2012022660A1 (es) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9455139B2 (en) | 2009-06-17 | 2016-09-27 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
US8962085B2 (en) | 2009-06-17 | 2015-02-24 | Novellus Systems, Inc. | Wetting pretreatment for enhanced damascene metal filling |
US9677188B2 (en) | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
US9613833B2 (en) | 2013-02-20 | 2017-04-04 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
US9435049B2 (en) * | 2013-11-20 | 2016-09-06 | Lam Research Corporation | Alkaline pretreatment for electroplating |
JP6270681B2 (ja) * | 2014-09-29 | 2018-01-31 | 学校法人 関西大学 | 配線構造体の製造方法、銅置換めっき液および配線構造体 |
US20180040751A1 (en) | 2015-02-26 | 2018-02-08 | Dynamic Solar Systems Ag | Obtaining a pv film structure by means of a room temperature method and room temperature method for producing a pv film structure |
CN107534085B (zh) * | 2015-02-26 | 2021-05-11 | 动态太阳能***公司 | 电工薄层的室温生产方法、其用途、以及以这种方式获得的薄层加热*** |
DE112016000930A5 (de) | 2015-02-26 | 2017-11-02 | Dynamic Solar Systems Ag | Raumtemperatur-Verfahren zur Herstellung elektrotechnischer Dünnschichten und elektrotechnische Dünnschicht |
US9617648B2 (en) | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
CN105543831B (zh) * | 2015-12-14 | 2018-10-09 | 华南理工大学 | 一种碱性钨酸盐钝化液及钝化化学镀Ni-P层的方法 |
WO2017112880A1 (en) * | 2015-12-22 | 2017-06-29 | William Marsh Rice University | Formation of porous silicon materials with copper-containing pores |
CN105525282B (zh) * | 2016-01-15 | 2018-04-13 | 华南理工大学 | 一种碱性无铬钝化液及其常温钝化化学镀Ni‑P层的方法 |
CN107447237B (zh) * | 2016-05-30 | 2021-04-20 | 史莱福灵有限公司 | 具有降低的接触噪声的滑环 |
CN106245042A (zh) * | 2016-08-01 | 2016-12-21 | 安徽贝莱电子科技有限公司 | 一种雷达用薄壁零件的表面处理工艺 |
KR101809985B1 (ko) * | 2017-03-30 | 2017-12-18 | 와이엠티 주식회사 | 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박 |
DE102017007488B4 (de) | 2017-08-09 | 2021-05-12 | Carolin John | Verfahren zum Veredeln zumindest einer Oberfläche sowie Gegenstand mit zumindest einer Oberfläche |
JP7472770B2 (ja) * | 2020-12-15 | 2024-04-23 | トヨタ自動車株式会社 | 金属めっき皮膜の成膜装置及び成膜方法 |
US11890997B2 (en) * | 2021-03-22 | 2024-02-06 | GM Global Technology Operations LLC | Antimicrobial metallic touch surfaces and methods for making the same |
US20220364239A1 (en) * | 2021-05-12 | 2022-11-17 | Global Tungsten & Powders Corp | Electroless copper coating process for chromium metal powders |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2217921A (en) * | 1938-03-23 | 1940-10-15 | American Chem Paint Co | Art of drawing ferrous metal |
GB927576A (en) * | 1961-04-18 | 1963-05-29 | Pyrene Co Ltd | Improvements relating to the coating of metals |
US3535129A (en) * | 1967-08-05 | 1970-10-20 | Hooker Chemical Corp | Metal treating process |
US3664933A (en) | 1969-06-19 | 1972-05-23 | Udylite Corp | Process for acid copper plating of zinc |
US3615737A (en) * | 1969-08-04 | 1971-10-26 | Photocircuits Corp | Electroless copper deposition |
DE1965641C3 (de) * | 1969-12-31 | 1979-02-08 | Gerhard Collardin Gmbh, 5000 Koeln | Verfahren zum stromlosen Abscheiden von Kupfer enthaltenden Metallschichten auf Edelstahl und Lösungen zur Durchführung des Verfahrens |
US3715793A (en) | 1970-05-04 | 1973-02-13 | Honeywell Inc | Plated super-coat and electrolyte |
US3649343A (en) * | 1970-10-08 | 1972-03-14 | Amchem Prod | Chloride concentration control in immersion copper coating |
BE793376A (fr) * | 1972-03-13 | 1973-04-16 | Parker Ste Continentale | Composition et procede de cuivrage de surfaces metalliques |
US3870526A (en) * | 1973-09-20 | 1975-03-11 | Us Army | Electroless deposition of copper and copper-tin alloys |
US4169171A (en) * | 1977-11-07 | 1979-09-25 | Harold Narcus | Bright electroless plating process and plated articles produced thereby |
US4563216A (en) * | 1984-06-15 | 1986-01-07 | Amchem Products, Inc. | Compositions and processes for coating ferrous surfaces with copper |
US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
AU3304389A (en) | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
DE4440299A1 (de) * | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen |
GB0031806D0 (en) * | 2000-12-29 | 2001-02-07 | Chemetall Plc | Electroless copper plating of ferrous metal substrates |
DE10214859B4 (de) | 2002-04-04 | 2004-04-08 | Chemetall Gmbh | Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür |
US7981508B1 (en) * | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
KR100847985B1 (ko) * | 2007-06-25 | 2008-07-22 | 삼성전자주식회사 | 금속 배선 형성방법 |
-
2011
- 2011-08-10 WO PCT/EP2011/063752 patent/WO2012022660A1/de active Application Filing
- 2011-08-10 BR BR112013003430A patent/BR112013003430A2/pt active Search and Examination
- 2011-08-10 DE DE102011080745A patent/DE102011080745A1/de not_active Withdrawn
- 2011-08-10 EP EP11744001.6A patent/EP2606162A1/de not_active Withdrawn
- 2011-08-10 MX MX2013001838A patent/MX344173B/es active IP Right Grant
- 2011-08-10 US US13/817,309 patent/US20130143071A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20130143071A1 (en) | 2013-06-06 |
MX344173B (es) | 2016-12-07 |
EP2606162A1 (de) | 2013-06-26 |
WO2012022660A1 (de) | 2012-02-23 |
DE102011080745A1 (de) | 2012-02-23 |
BR112013003430A2 (pt) | 2016-06-21 |
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Legal Events
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FG | Grant or registration |