MX167978B - ALUMINUM COATING WITH ANAELECTRO-DEPOSITED NICKEL - Google Patents

ALUMINUM COATING WITH ANAELECTRO-DEPOSITED NICKEL

Info

Publication number
MX167978B
MX167978B MX202448A MX20244884A MX167978B MX 167978 B MX167978 B MX 167978B MX 202448 A MX202448 A MX 202448A MX 20244884 A MX20244884 A MX 20244884A MX 167978 B MX167978 B MX 167978B
Authority
MX
Mexico
Prior art keywords
anaelectro
aluminum coating
deposited nickel
coating
applying
Prior art date
Application number
MX202448A
Other languages
Spanish (es)
Inventor
Paul B Schultz
Eugene F Yarkosky
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of MX167978B publication Critical patent/MX167978B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

La presente invención se refiere a un procedimiento para recubrir un substrato de metal, que comprende: (a) aplicar un primer revestimiento protector sobre el substrato de metal; (b) aplicar un segundo revestimiento protector en el producto de la etapa (a); y (c) depositar un metal sobre el producto de la etapa (b).The present invention relates to a method of coating a metal substrate, comprising: (a) applying a first protective coating on the metal substrate; (b) applying a second protective coating on the product of step (a); and (c) depositing a metal on the product of step (b).

MX202448A 1983-08-22 1984-08-21 ALUMINUM COATING WITH ANAELECTRO-DEPOSITED NICKEL MX167978B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52535883A 1983-08-22 1983-08-22
HK98105637A HK1006860A1 (en) 1983-08-22 1998-06-18 Electroless nickel plating of aluminum

Publications (1)

Publication Number Publication Date
MX167978B true MX167978B (en) 1993-04-26

Family

ID=26316726

Family Applications (1)

Application Number Title Priority Date Filing Date
MX202448A MX167978B (en) 1983-08-22 1984-08-21 ALUMINUM COATING WITH ANAELECTRO-DEPOSITED NICKEL

Country Status (9)

Country Link
EP (1) EP0153369B1 (en)
JP (1) JPS60502057A (en)
AU (1) AU558946B2 (en)
BR (1) BR8407027A (en)
CA (1) CA1220101A (en)
DE (1) DE3486228T2 (en)
HK (1) HK1006860A1 (en)
MX (1) MX167978B (en)
WO (1) WO1985001070A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476688A (en) * 1988-08-29 1995-12-19 Ostolski; Marian J. Process for the preparation of noble metal coated non-noble metal substrates, coated materials produced in accordance therewith and compositions utilizing the coated materials
JP6411279B2 (en) * 2015-05-11 2018-10-24 東京エレクトロン株式会社 Plating process and storage medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US366529A (en) * 1887-07-12 James timms
JPS5345787A (en) * 1976-10-08 1978-04-24 Shiguma Ruutein Narodoni Podon Method of working nonncircular functional hole of drawing die
US4169171A (en) * 1977-11-07 1979-09-25 Harold Narcus Bright electroless plating process and plated articles produced thereby
JPS6015706B2 (en) * 1977-12-19 1985-04-20 株式会社東芝 Surface treatment method of Al and Al alloy for soldering
US4346128A (en) * 1980-03-31 1982-08-24 The Boeing Company Tank process for plating aluminum substrates including porous aluminum castings
US4358923A (en) * 1980-04-10 1982-11-16 Surface Technology, Inc. Composite coatings for open-end machinery parts
SU926064A1 (en) * 1980-07-15 1982-05-07 Алтайский Сельскохозяйственный Институт Aqueous solution for preparing metal surface to chemical nickel plating

Also Published As

Publication number Publication date
JPS60502057A (en) 1985-11-28
EP0153369B1 (en) 1993-10-13
AU558946B2 (en) 1987-02-12
JPH0319302B2 (en) 1991-03-14
BR8407027A (en) 1985-07-30
DE3486228T2 (en) 1994-04-14
WO1985001070A1 (en) 1985-03-14
EP0153369A4 (en) 1986-02-13
HK1006860A1 (en) 1999-03-19
DE3486228D1 (en) 1993-11-18
EP0153369A1 (en) 1985-09-04
CA1220101A (en) 1987-04-07
AU3217884A (en) 1985-03-29

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