MX163920B - Procedimiento mejorado para enchapar substratos polimericos substancialmente no conductivos - Google Patents

Procedimiento mejorado para enchapar substratos polimericos substancialmente no conductivos

Info

Publication number
MX163920B
MX163920B MX187101A MX18710181A MX163920B MX 163920 B MX163920 B MX 163920B MX 187101 A MX187101 A MX 187101A MX 18710181 A MX18710181 A MX 18710181A MX 163920 B MX163920 B MX 163920B
Authority
MX
Mexico
Prior art keywords
conductive polymer
substantially non
polymer substrates
improved procedure
plating substantially
Prior art date
Application number
MX187101A
Other languages
English (en)
Inventor
Daniel Joseph Combs
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of MX163920B publication Critical patent/MX163920B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
MX187101A 1980-05-01 1981-04-30 Procedimiento mejorado para enchapar substratos polimericos substancialmente no conductivos MX163920B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/145,534 US4374709A (en) 1980-05-01 1980-05-01 Process for plating polymeric substrates

Publications (1)

Publication Number Publication Date
MX163920B true MX163920B (es) 1992-06-30

Family

ID=22513544

Family Applications (1)

Application Number Title Priority Date Filing Date
MX187101A MX163920B (es) 1980-05-01 1981-04-30 Procedimiento mejorado para enchapar substratos polimericos substancialmente no conductivos

Country Status (12)

Country Link
US (1) US4374709A (es)
JP (1) JPS56169793A (es)
AU (1) AU526075B2 (es)
BR (1) BR8102678A (es)
CA (1) CA1192858A (es)
DE (1) DE3116743A1 (es)
ES (1) ES8205021A1 (es)
FR (1) FR2481718A1 (es)
GB (1) GB2075063B (es)
IT (1) IT1142499B (es)
MX (1) MX163920B (es)
NL (1) NL8102169A (es)

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DE3240643A1 (de) * 1982-11-04 1984-05-30 LPW-Chemie GmbH, 4040 Neuss Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten
DE3482273D1 (de) * 1983-06-24 1990-06-21 American Cyanamid Co Vorrichtung und verfahren zum kontinuierlichen plattieren von fasern.
JPS60258494A (ja) * 1984-06-01 1985-12-20 Nippon Sanmou Senshoku Kk 導電性高分子材料
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
US5004525A (en) * 1988-08-23 1991-04-02 Shipley Company Inc. Copper electroplating composition
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5336370A (en) * 1993-12-09 1994-08-09 Chipalkatti Makarand H Pre-treatment for plating technique
EP0795802A1 (en) * 1996-03-15 1997-09-17 Agfa-Gevaert N.V. A printhead structure made from an electroless plated plastic substrate
US6203582B1 (en) * 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6454926B1 (en) 1997-09-30 2002-09-24 Semitool Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
US6936153B1 (en) 1997-09-30 2005-08-30 Semitool, Inc. Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
US6258241B1 (en) 1997-12-10 2001-07-10 Lucent Technologies, Inc. Process for electroplating metals
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
EP1111096A3 (en) * 1999-12-15 2004-02-11 Shipley Company LLC Seed layer repair method
US6468672B1 (en) 2000-06-29 2002-10-22 Lacks Enterprises, Inc. Decorative chrome electroplate on plastics
GB0020414D0 (en) * 2000-08-18 2000-10-04 Avecia Ltd Dispersions containing polyether dispersants
US20040000488A1 (en) * 2002-06-28 2004-01-01 Applied Materials, Inc. CU ECP planarization by insertion of polymer treatment step between gap fill and bulk fill steps
US8465469B2 (en) * 2002-09-12 2013-06-18 Medtronic Vascular, Inc. Reinforced catheter and methods of making
US20040211657A1 (en) * 2003-04-11 2004-10-28 Ingelbrecht Hugo Gerard Eduard Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
US9399618B2 (en) * 2003-05-12 2016-07-26 Arkema Inc. High purity electrolytic sulfonic acid solutions
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US20060086620A1 (en) * 2004-10-21 2006-04-27 Chase Lee A Textured decorative plating on plastic components
TW200632147A (es) * 2004-11-12 2006-09-16
US7354354B2 (en) * 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
JP2007023361A (ja) * 2005-07-20 2007-02-01 Mitsubishi Engineering Plastics Corp 芳香族ポリカーボネート系樹脂成形品のメッキ方法およびメッキ成形品
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
US20090056991A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Binding of Molecule(s) of Interest, Coatings and Devices Formed Therefrom
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
KR101730983B1 (ko) 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
JP2011068995A (ja) * 2010-11-15 2011-04-07 Mitsubishi Engineering Plastics Corp 芳香族ポリカーボネート系樹脂成形品のメッキ方法およびメッキ成形品
US8747643B2 (en) * 2011-08-22 2014-06-10 Rohm And Haas Electronic Materials Llc Plating bath and method
CN103009708A (zh) * 2011-09-21 2013-04-03 深圳富泰宏精密工业有限公司 镀膜件及其制造方法
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
ITUD20130108A1 (it) 2013-08-13 2015-02-14 New Technology Consultants N T C Dispositivo di controllo del funzionamento di uno scambiatore di calore, scambiatore di calore comprendente detto dispositivo e relativo procedimento di controllo
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
KR102381803B1 (ko) 2016-08-15 2022-04-01 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금용 산성 수성 조성물
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

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GB493485A (en) * 1937-01-13 1938-10-10 Langbein Pfanhauser Werke Ag Process for the electrolytic production of metal coatings on objects with a non-conducting surface
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3751289A (en) * 1971-08-20 1973-08-07 M & T Chemicals Inc Method of preparing surfaces for electroplating
US3954570A (en) * 1974-11-11 1976-05-04 Amp Incorporated Sensitized polyimides and circuit elements thereof

Also Published As

Publication number Publication date
FR2481718A1 (fr) 1981-11-06
GB2075063A (en) 1981-11-11
JPH0224919B2 (es) 1990-05-31
CA1192858A (en) 1985-09-03
JPS56169793A (en) 1981-12-26
AU526075B2 (en) 1982-12-16
BR8102678A (pt) 1982-01-26
ES501765A0 (es) 1982-05-16
NL8102169A (nl) 1981-12-01
AU7001881A (en) 1981-11-05
US4374709A (en) 1983-02-22
FR2481718B1 (es) 1985-05-03
IT1142499B (it) 1986-10-08
DE3116743A1 (de) 1982-02-25
ES8205021A1 (es) 1982-05-16
GB2075063B (en) 1983-04-07
IT8148365A0 (it) 1981-04-29

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