MA44406A - COOLED POWER ELECTRONICS MODULE, ENGINE AND VEHICLE INTEGRATING SUCH A MODULE - Google Patents

COOLED POWER ELECTRONICS MODULE, ENGINE AND VEHICLE INTEGRATING SUCH A MODULE

Info

Publication number
MA44406A
MA44406A MA044406A MA44406A MA44406A MA 44406 A MA44406 A MA 44406A MA 044406 A MA044406 A MA 044406A MA 44406 A MA44406 A MA 44406A MA 44406 A MA44406 A MA 44406A
Authority
MA
Morocco
Prior art keywords
module
engine
power electronics
cooled power
vehicle integrating
Prior art date
Application number
MA044406A
Other languages
French (fr)
Inventor
Guy Diemunsch
Original Assignee
Inst Vedecom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Vedecom filed Critical Inst Vedecom
Publication of MA44406A publication Critical patent/MA44406A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
MA044406A 2016-03-15 2017-03-01 COOLED POWER ELECTRONICS MODULE, ENGINE AND VEHICLE INTEGRATING SUCH A MODULE MA44406A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1652196A FR3049159B1 (en) 2016-03-15 2016-03-15 ELECTRONIC MODULE FOR COOLING POWER, ENGINE AND VEHICLE INCORPORATING SUCH A MODULE

Publications (1)

Publication Number Publication Date
MA44406A true MA44406A (en) 2021-04-21

Family

ID=56119535

Family Applications (1)

Application Number Title Priority Date Filing Date
MA044406A MA44406A (en) 2016-03-15 2017-03-01 COOLED POWER ELECTRONICS MODULE, ENGINE AND VEHICLE INTEGRATING SUCH A MODULE

Country Status (4)

Country Link
EP (1) EP3430873A1 (en)
FR (1) FR3049159B1 (en)
MA (1) MA44406A (en)
WO (1) WO2017158253A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3090839B1 (en) 2018-12-19 2021-05-14 Valeo Systemes Thermiques Cooling circuit for automotive vehicle component
CN112752478B (en) * 2020-12-14 2023-08-01 中车永济电机有限公司 Integrated double-sided air-cooled heat dissipation power module
CN117878071B (en) * 2024-03-12 2024-07-26 青岛澳芯瑞能半导体科技有限公司 IGBT semiconductor device and process method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3067399B2 (en) * 1992-07-03 2000-07-17 株式会社日立製作所 Semiconductor cooling device
FR2809281B1 (en) * 2000-05-22 2002-07-12 Alstom ELECTRONIC POWER DEVICE
US7068507B2 (en) * 2002-09-27 2006-06-27 Rockwell Automation Technologies, Inc. Compact liquid converter assembly
FR2853808B1 (en) * 2003-04-09 2006-09-15 Alstom POWER SWITCHING MODULE AND WAVEBACK EQUIPPED WITH SUCH MODULE
JP2006190972A (en) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp Power semiconductor device
JP4848187B2 (en) * 2006-01-17 2011-12-28 日立オートモティブシステムズ株式会社 Power converter
JP2012059952A (en) * 2010-09-09 2012-03-22 Mitsubishi Electric Corp Electronic apparatus cooling structure
JP6300363B2 (en) * 2014-07-03 2018-03-28 株式会社日立製作所 Power converter

Also Published As

Publication number Publication date
WO2017158253A1 (en) 2017-09-21
FR3049159A1 (en) 2017-09-22
FR3049159B1 (en) 2019-10-25
EP3430873A1 (en) 2019-01-23

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