LT3057736T - Lazerinio mikroapdirbimo būdas ir įrenginys - Google Patents

Lazerinio mikroapdirbimo būdas ir įrenginys

Info

Publication number
LT3057736T
LT3057736T LTEP14796718.6T LT14796718T LT3057736T LT 3057736 T LT3057736 T LT 3057736T LT 14796718 T LT14796718 T LT 14796718T LT 3057736 T LT3057736 T LT 3057736T
Authority
LT
Lithuania
Prior art keywords
laser micromachining
micromachining
laser
Prior art date
Application number
LTEP14796718.6T
Other languages
English (en)
Inventor
Francois Courvoisier
Pierre-Ambroise Lacourt
Arnaud COUAIRON
Original Assignee
Centre National De La Recherche Scientifique (C.N.R.S.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National De La Recherche Scientifique (C.N.R.S.) filed Critical Centre National De La Recherche Scientifique (C.N.R.S.)
Publication of LT3057736T publication Critical patent/LT3057736T/lt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Lasers (AREA)
LTEP14796718.6T 2013-10-17 2014-10-16 Lazerinio mikroapdirbimo būdas ir įrenginys LT3057736T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1360131A FR3012059B1 (fr) 2013-10-17 2013-10-17 Methode et dispositif de micro-usinage par laser
PCT/EP2014/072255 WO2015055779A1 (fr) 2013-10-17 2014-10-16 Methode et dispositif de micro-usinage par laser

Publications (1)

Publication Number Publication Date
LT3057736T true LT3057736T (lt) 2018-05-10

Family

ID=49713339

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP14796718.6T LT3057736T (lt) 2013-10-17 2014-10-16 Lazerinio mikroapdirbimo būdas ir įrenginys

Country Status (6)

Country Link
US (1) US11059129B2 (lt)
EP (1) EP3057736B1 (lt)
JP (1) JP6512612B2 (lt)
FR (1) FR3012059B1 (lt)
LT (1) LT3057736T (lt)
WO (1) WO2015055779A1 (lt)

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JP6810951B2 (ja) * 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置
JP6825125B2 (ja) 2016-11-01 2021-02-03 コリア フード リサーチ インスティチュート 高分解能テラヘルツ波集光モジュール、散乱光検出モジュール、及びテラヘルツ波ベッセルビームを用いた高分解能検査装置
DE102017116477B4 (de) * 2017-07-21 2021-08-19 Asphericon Gmbh Polarisationswandler mit reflektiver Axikonoptik, Laseroptik, und Verfahren zur Herstellung eines Polarisationswandlers
CN107824959B (zh) * 2017-11-13 2024-02-02 华中科技大学 一种激光打孔方法及***
US11482826B2 (en) 2018-01-12 2022-10-25 Ricoh Company, Ltd. Optical processing apparatus, optical processing method, and optically-processed product production method
US11150484B2 (en) * 2018-05-18 2021-10-19 Lawrence Livermore National Security, Llc System and method for curved light sheet projection during two-photon polymerization
WO2020190489A1 (en) * 2019-03-21 2020-09-24 Corning Incorporated Systems for and methods of forming micro-holes in glass-based objects using an annular vortex laser beam
DE102020105540A1 (de) * 2019-10-11 2021-04-15 Trumpf Laser- Und Systemtechnik Gmbh Optisches Stanzen von Mikrolöchern in Dünnglas
CN110824716B (zh) * 2019-12-26 2021-09-07 河南科技大学 一种灵活调控自聚焦光束自聚焦焦距的方法
CN111360415B (zh) * 2020-03-20 2021-03-30 吉林大学 一种利用化学处理辅助激光加工制备金刚石涡旋光束发生器的方法及其应用
US11630265B2 (en) 2020-04-15 2023-04-18 Google Llc Glass fiber hole plates for 2D fiber collimators and methods for alignment and fabrication for optical switching applications
WO2021262537A1 (en) * 2020-06-25 2021-12-30 Corning Incorporated Methods for laser processing transparent workpieces using radially variable laser beam focal columns
CN112130439B (zh) * 2020-09-25 2021-07-13 北京理工大学 一种基于飞秒激光制备的可变防伪计算机全息图
CN112317961B (zh) * 2020-10-09 2022-06-24 哈尔滨工业大学 一种超薄水膜辅助脉冲激光微加工装置及其加工方法
CN112388185B (zh) * 2020-11-23 2022-09-30 西安中科微精光子科技股份有限公司 针对非线性形变的激光切割补偿方法、装置及存储介质
WO2023286265A1 (ja) * 2021-07-16 2023-01-19 三菱電機株式会社 レーザ加工装置及びレーザ加工方法
DE102022101094A1 (de) * 2022-01-18 2023-07-20 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Laserbohren einer Bohrung in ein Werkstück sowie Laserbohrvorrichtung

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US6580054B1 (en) * 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
JP4158481B2 (ja) * 2002-10-21 2008-10-01 セイコーエプソン株式会社 レーザー加工方法およびその装置、並びにその装置を用いた穴あけ加工方法
JP4729883B2 (ja) * 2003-10-31 2011-07-20 セイコーエプソン株式会社 基板の加工方法、マイクロレンズシートの製造方法、透過型スクリーン、プロジェクタ、表示装置並びに基板の加工装置
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JP4645892B2 (ja) * 2005-03-29 2011-03-09 アイシン精機株式会社 レーザ加工装置及び方法
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DE102006042280A1 (de) * 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
JP4483793B2 (ja) * 2006-01-27 2010-06-16 セイコーエプソン株式会社 微細構造体の製造方法及び製造装置
JP5522881B2 (ja) * 2006-09-06 2014-06-18 イムラ アメリカ インコーポレイテッド 材料を接合するための方法
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JP5531261B2 (ja) * 2009-03-27 2014-06-25 国立大学法人 千葉大学 レーザー加工方法、円偏光光渦レーザービームを用いたレーザー加工方法、針状体を有する部材の製造方法、および針状体を有する部材
FR2989294B1 (fr) * 2012-04-13 2022-10-14 Centre Nat Rech Scient Dispositif et methode de nano-usinage par laser

Also Published As

Publication number Publication date
WO2015055779A1 (fr) 2015-04-23
FR3012059A1 (fr) 2015-04-24
US11059129B2 (en) 2021-07-13
JP6512612B2 (ja) 2019-05-15
EP3057736A1 (fr) 2016-08-24
US20160271727A1 (en) 2016-09-22
JP2016535675A (ja) 2016-11-17
FR3012059B1 (fr) 2016-01-08
EP3057736B1 (fr) 2018-01-10

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