KR980006321A - Capacitor Formation Method for DRAM Device - Google Patents
Capacitor Formation Method for DRAM Device Download PDFInfo
- Publication number
- KR980006321A KR980006321A KR1019960022877A KR19960022877A KR980006321A KR 980006321 A KR980006321 A KR 980006321A KR 1019960022877 A KR1019960022877 A KR 1019960022877A KR 19960022877 A KR19960022877 A KR 19960022877A KR 980006321 A KR980006321 A KR 980006321A
- Authority
- KR
- South Korea
- Prior art keywords
- photoresist pattern
- film
- forming
- charge storage
- storage electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/84—Electrodes with an enlarged surface, e.g. formed by texturisation being a rough surface, e.g. using hemispherical grains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
- H01L28/92—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by patterning layers, e.g. by etching conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
본 발명의 저장 용량이 개선된 디램의 캐패시터 형성방법이 개시된다. 개시된 본 발명은 트랜지스터와 트랜지스터 상부에 절연막이 형성되고, 트랜지스터의 접합 영역중 어느 하나가 노출되도록 절연막을 식각하여 콘택홀이 형성된 반도체 기판을 제공하는 단계; 반도체 기판 전면에 후막의 전하 저장 전극용 폴리실리콘막을 증착하는 단계; 전하 저장 전극용 폴리실리콘막 상부에 일정 거리 만큼 간격을 갖고, 반구의 형태로 배열된 포토레지스트 패턴을 형성하는 단계; 포토레지스트 패턴에 의하여 전하 저장 전극용 폴리실리콘막을 일정 깊이만큼 식각하는 단계; 포토레지스트 패턴을 제거하는 단계를 포함하여, 원통의 표면적만큼 디램의 용량을 증대시킬 수 있다.Disclosed is a method of forming a capacitor of a DRAM having an improved storage capacity of the present invention. The present invention provides a semiconductor substrate having a contact hole formed by forming an insulating film on a transistor and an upper portion of the transistor, and etching the insulating film so that any one of the junction regions of the transistor is exposed; Depositing a polysilicon film for a charge storage electrode of a thick film on the entire surface of the semiconductor substrate; Forming a photoresist pattern spaced by a predetermined distance on the polysilicon film for the charge storage electrode and arranged in a hemispherical shape; Etching the polysilicon layer for the charge storage electrode by a photoresist pattern to a predetermined depth; Including the step of removing the photoresist pattern, it is possible to increase the capacity of the DRAM by the surface area of the cylinder.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2a 내지 제2c는 본 발명의 디램 소자의 캐패시터 중 전하 저장 전극의 형성방법을 설명하기 위한 단면도.2A to 2C are cross-sectional views illustrating a method of forming a charge storage electrode in a capacitor of a DRAM device of the present invention.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960022877A KR980006321A (en) | 1996-06-21 | 1996-06-21 | Capacitor Formation Method for DRAM Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960022877A KR980006321A (en) | 1996-06-21 | 1996-06-21 | Capacitor Formation Method for DRAM Device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980006321A true KR980006321A (en) | 1998-03-30 |
Family
ID=66287578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960022877A KR980006321A (en) | 1996-06-21 | 1996-06-21 | Capacitor Formation Method for DRAM Device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR980006321A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7023037B2 (en) | 2000-08-11 | 2006-04-04 | Samsung Electronics Co., Ltd. | Integrated circuit devices having dielectric regions protected with multi-layer insulation structures |
-
1996
- 1996-06-21 KR KR1019960022877A patent/KR980006321A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7023037B2 (en) | 2000-08-11 | 2006-04-04 | Samsung Electronics Co., Ltd. | Integrated circuit devices having dielectric regions protected with multi-layer insulation structures |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |