KR970077266A - Drying device for semiconductor wafers - Google Patents

Drying device for semiconductor wafers Download PDF

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Publication number
KR970077266A
KR970077266A KR1019960015554A KR19960015554A KR970077266A KR 970077266 A KR970077266 A KR 970077266A KR 1019960015554 A KR1019960015554 A KR 1019960015554A KR 19960015554 A KR19960015554 A KR 19960015554A KR 970077266 A KR970077266 A KR 970077266A
Authority
KR
South Korea
Prior art keywords
main body
wafer
drying apparatus
steam
steam generator
Prior art date
Application number
KR1019960015554A
Other languages
Korean (ko)
Inventor
조용준
정승필
송재인
박흥수
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960015554A priority Critical patent/KR970077266A/en
Publication of KR970077266A publication Critical patent/KR970077266A/en

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  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

본 발명은 반도체 웨이퍼의 건조 장치에 관한 것으로, 본 발명에 따른 웨이퍼 건조 장치는 축을 중심으로 원심 회전 가능한 건조 장치 본체와, 상기 본체를 밀봉하기 위한 커버와, 상기 본체 내에 회전 가능하게 설치되고, 증기를 발생시키는 증기 발생 장치와, 상기 증기 발생 장치로부터 공급되는 증기를 상기 본체 내에 분사할 수 있도록 상기 증기 발생 장치의 일단에서 방사 방향으로 설치된 복수의 분사 노즐과, 상기 본체 내에 설치되고 건조될 웨이퍼를 지지하는 웨이퍼 지지대를 포함한다. 본 발명에 의하면, IPA 증기를 이용한 웨이퍼 건조공정에서 웨이퍼가 고정 상태로 있지 않고 원심 회전되므로 반응성 파티클의 발생을 방지할 수 있다.The present invention relates to a drying apparatus for semiconductor wafers, and a wafer drying apparatus according to the present invention comprises a drying apparatus main body capable of centrifugal rotation about an axis, a cover for sealing the main body, A plurality of injection nozzles provided in a radial direction at one end of the steam generator so as to inject steam supplied from the steam generator into the main body; And a wafer support table for supporting the wafer. According to the present invention, in the wafer drying process using IPA vapor, since the wafer is not in a fixed state but centrifugally rotated, generation of reactive particles can be prevented.

Description

반도체 웨이퍼가의 건조 장치A drying apparatus for a semiconductor wafer

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명에 따른 웨이퍼 건조 장치의 구성을 개략적으로 나타낸 도면이다.FIG. 1 is a view schematically showing a configuration of a wafer drying apparatus according to the present invention.

Claims (2)

축을 중심으로 원심 회전 가능한 건조 장치 본체와, 상기 본체를 밀봉하기 위한 커버와, 상기 본체 내에 회전 가능하게 설치되고, 증기를 발생시키는 증기 발생 장치와, 상기 증기 발생 장치로부터 공급되는 증기를 상기 본체 내에 분사할 수 있도록 상기 증기 발생 장치의 일단에서 방사 방향으로 설치된 복수의 분사 노즐과, 상기 본체 내에 설치되고 건조될 웨이퍼를 지지하는 웨이퍼 지지대를 포함하는 것을 특징으로 하는 웨이퍼 건조 장치.1. A steam generator comprising: a drying apparatus main body capable of centrifugal rotation about an axis; a cover for sealing the main body; a steam generating device rotatably installed in the main body for generating steam; A plurality of spray nozzles provided in a radial direction at one end of the steam generating device so as to be able to spray the wafers; and a wafer support which is installed in the main body and supports wafers to be dried. 제1항에 있어서, 상기 증기 발생 장치는 증기 소스를 수용하는 저장조와, 상기 저장조 내에 수용된 증기소스를 가열하는 히터를 포함하는 것을 특징으로 하는 웨이퍼 건조 장치.The apparatus of claim 1, wherein the steam generator comprises a reservoir for receiving a vapor source and a heater for heating a vapor source contained in the reservoir. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960015554A 1996-05-11 1996-05-11 Drying device for semiconductor wafers KR970077266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960015554A KR970077266A (en) 1996-05-11 1996-05-11 Drying device for semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960015554A KR970077266A (en) 1996-05-11 1996-05-11 Drying device for semiconductor wafers

Publications (1)

Publication Number Publication Date
KR970077266A true KR970077266A (en) 1997-12-12

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ID=66220022

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960015554A KR970077266A (en) 1996-05-11 1996-05-11 Drying device for semiconductor wafers

Country Status (1)

Country Link
KR (1) KR970077266A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100490520B1 (en) * 2001-10-03 2005-05-19 호야 가부시키가이샤 Coating Film Drying Method, Coating Film Forming Method, and Coating Film Forming Apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100490520B1 (en) * 2001-10-03 2005-05-19 호야 가부시키가이샤 Coating Film Drying Method, Coating Film Forming Method, and Coating Film Forming Apparatus

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