KR970072357A - Lead frame for semiconductor device, manufacturing method thereof and punch and die for manufacturing same - Google Patents
Lead frame for semiconductor device, manufacturing method thereof and punch and die for manufacturing same Download PDFInfo
- Publication number
- KR970072357A KR970072357A KR1019970013253A KR19970013253A KR970072357A KR 970072357 A KR970072357 A KR 970072357A KR 1019970013253 A KR1019970013253 A KR 1019970013253A KR 19970013253 A KR19970013253 A KR 19970013253A KR 970072357 A KR970072357 A KR 970072357A
- Authority
- KR
- South Korea
- Prior art keywords
- punch
- semiconductor device
- lead frame
- manufacturing
- region
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000004080 punching Methods 0.000 claims abstract 4
- 239000007769 metal material Substances 0.000 claims 4
- 239000000463 material Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
본 발명은 특히 광반도체장치에 호적한 반도체장치용 리드프레임 및 그 제조방법 및 이것을 제조하기 위한 펀치 및 금형에 관한 것으로서, 오목형상부에 살붙임, 컵이빠짐 및 균열이 발생하는 일없이 다수개의 발광소자 또는 칩사이즈가 큰 발광소자를 탑재할 수 있는 반도체장치용 리드프레임의 제조방법을 제공하는 것을 목적으로한 것이며, 그 해결수단으로서, 프레스수단에 의해 띠형상금속재료의 긴쪽방향의 측면을 펀칭해서 돌기현상부를 형성하고, 이어서 이 돌기형상부의 선단부를 재료측면으로부터 평면형상의 펀치로쳐서 평탄화하고, 이어서 이 평탄화한 영역을 재료측면으로부터 만곡형상펀치로 쳐서 부채형상부를 형성하고, 이어서 이 부채형 상부의 선단부를 재료측면으로부터 볼록형상의 펀치로쳐서 오목형상부를 형성하는 것을 특징으로 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a semiconductor device suitable for an optical semiconductor device, a method for manufacturing the same, and a punch and a mold for manufacturing the same. It is an object of the present invention to provide a method for manufacturing a lead frame for a semiconductor device in which a light emitting device or a light emitting device having a large chip size can be mounted. Punching is formed to form a projection, and then the tip of the projection is flattened by a flat punch from the material side, and then the flattened area is hit with a curved punch from the material side to form a fan-shaped portion, and then this fan-shaped. A concave portion is formed by hitting the upper end portion with a convex punch from the material side. It will have to.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 실시형태의 반도체장치용 리드프레임의 제조공정도, 제2도는 제1도에 있어서, 돌기형상부를 평면형상의 펀치로치는 동작을 설명하는 도면, 제3도는 본 실시형태의 만곡형상펀치 및 부채형상부의 작용을 설명하는 도면, 제4도는 본 실시형태의 금형 및 오목형상부를 표시한 사시도, 제5도는 본 실시형태의 반도체장치용 리드프레임의 오목형상부를 표시한 상면도, 제6도는 일반적인 발광다이오드의 구성을 표시한 측면도.FIG. 1 is a manufacturing process diagram of a lead frame for a semiconductor device according to the present embodiment, and FIG. 2 is a diagram for explaining the operation of turning the projection into a flat punch in FIG. 1, and FIG. 3 is a curved punch of the present embodiment. And FIG. 4 is a perspective view showing the mold and the concave portion of the present embodiment, and FIG. 5 is a top view showing the concave portion of the lead frame for a semiconductor device of the present embodiment. Side view showing the structure of a typical light emitting diode.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8089242A JP2871586B2 (en) | 1996-04-11 | 1996-04-11 | Lead frame for semiconductor device, method of manufacturing the same, punch and die for manufacturing the same |
JP96-89242 | 1996-04-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970072357A true KR970072357A (en) | 1997-11-07 |
KR100237735B1 KR100237735B1 (en) | 2000-01-15 |
Family
ID=13965290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970013253A KR100237735B1 (en) | 1996-04-11 | 1997-04-10 | Lead frame for semiconductor and manufacturing method of the same, and punches and molds for fabricating that |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2871586B2 (en) |
KR (1) | KR100237735B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004107443A1 (en) * | 2003-06-03 | 2004-12-09 | Asetronics Ag | Insulated metal substrate with at least one light diode, light diode matrix and production method |
-
1996
- 1996-04-11 JP JP8089242A patent/JP2871586B2/en not_active Expired - Fee Related
-
1997
- 1997-04-10 KR KR1019970013253A patent/KR100237735B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2871586B2 (en) | 1999-03-17 |
KR100237735B1 (en) | 2000-01-15 |
JPH09283804A (en) | 1997-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910002570A (en) | Blank cutting device and cutting method | |
RU2004122410A (en) | PRESS METHOD AND PRODUCT OBTAINED BY THIS METHOD | |
BR9812796A (en) | Handle for container end and method for manufacturing it | |
DE59606093D1 (en) | DEEP-DRAWING TOOL WITH INTEGRATED HOLDING-DOWN HOLDER | |
KR860000690A (en) | Manufacturing apparatus and method of shadow mask | |
KR970072357A (en) | Lead frame for semiconductor device, manufacturing method thereof and punch and die for manufacturing same | |
KR850003065A (en) | Metal and resin holder for fixing semiconductor device to radiant radiator and manufacturing method | |
AR001386A1 (en) | Male snap button component, particularly for clothing items. | |
DE50304208D1 (en) | Progressive Die | |
KR910019192A (en) | Lead frame for semiconductor device and manufacturing method | |
KR910019155A (en) | Lead Forming Method of Semiconductor Device | |
KR950005400A (en) | Manufacturing method of mandrel for blind rivet | |
KR880003370A (en) | Shadow Mask Forming Device | |
CN1939613B (en) | Stripped thorn hole turnover method, radiator fin therewith and mould thereof | |
KR970003895A (en) | Manufacturing method of lead frame | |
ES2145578T3 (en) | ELASTIC CONTACT TAB AND PROCEDURE FOR ITS MANUFACTURE FROM A METAL PLATE. | |
SU940957A1 (en) | Method of producing ring part of sheet blank | |
JPH1147852A (en) | Spacer mounting structure of synthetic resin molded goods and method therefor | |
KR940011101A (en) | Drawing device | |
RU1807861C (en) | Method for fabrication of cutting tool for chopping vegetables from sheet blank | |
JPH07142667A (en) | Method of making dimple in semiconductor chip mount portion of lead frame | |
KR970003891A (en) | Semiconductor Lead Frame Cutting Method | |
RU2000116690A (en) | METHOD FOR STAMPING PARTS FROM SHEET BILLS ON PRESSES | |
KR970053691A (en) | Reforming apparatus for removing burrs | |
KR960021238A (en) | Forming method for the wide part |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120924 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20130924 Year of fee payment: 15 |
|
LAPS | Lapse due to unpaid annual fee |