KR970046734U - 웨이퍼 연마장치 - Google Patents

웨이퍼 연마장치

Info

Publication number
KR970046734U
KR970046734U KR2019950052643U KR19950052643U KR970046734U KR 970046734 U KR970046734 U KR 970046734U KR 2019950052643 U KR2019950052643 U KR 2019950052643U KR 19950052643 U KR19950052643 U KR 19950052643U KR 970046734 U KR970046734 U KR 970046734U
Authority
KR
South Korea
Prior art keywords
polishing machine
wafer polishing
wafer
machine
polishing
Prior art date
Application number
KR2019950052643U
Other languages
English (en)
Other versions
KR200173174Y1 (ko
Inventor
최기식
남철우
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950052643U priority Critical patent/KR200173174Y1/ko
Publication of KR970046734U publication Critical patent/KR970046734U/ko
Application granted granted Critical
Publication of KR200173174Y1 publication Critical patent/KR200173174Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR2019950052643U 1995-12-29 1995-12-29 웨이퍼 연마장치 KR200173174Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950052643U KR200173174Y1 (ko) 1995-12-29 1995-12-29 웨이퍼 연마장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950052643U KR200173174Y1 (ko) 1995-12-29 1995-12-29 웨이퍼 연마장치

Publications (2)

Publication Number Publication Date
KR970046734U true KR970046734U (ko) 1997-07-31
KR200173174Y1 KR200173174Y1 (ko) 2000-03-02

Family

ID=19441826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950052643U KR200173174Y1 (ko) 1995-12-29 1995-12-29 웨이퍼 연마장치

Country Status (1)

Country Link
KR (1) KR200173174Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100414741B1 (ko) * 1996-06-29 2004-03-30 주식회사 하이닉스반도체 반도체소자의제조방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100841094B1 (ko) 2005-12-20 2008-06-25 주식회사 실트론 실리콘 웨이퍼 연마장치, 이에 이용되는 리테이닝어셈블리, 및 이를 이용한 실리콘 웨이퍼 평평도 보정방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100414741B1 (ko) * 1996-06-29 2004-03-30 주식회사 하이닉스반도체 반도체소자의제조방법

Also Published As

Publication number Publication date
KR200173174Y1 (ko) 2000-03-02

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20091126

Year of fee payment: 11

EXPY Expiration of term