KR970042803A - Phenolic resin molding material - Google Patents

Phenolic resin molding material Download PDF

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Publication number
KR970042803A
KR970042803A KR1019960026852A KR19960026852A KR970042803A KR 970042803 A KR970042803 A KR 970042803A KR 1019960026852 A KR1019960026852 A KR 1019960026852A KR 19960026852 A KR19960026852 A KR 19960026852A KR 970042803 A KR970042803 A KR 970042803A
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KR
South Korea
Prior art keywords
molding material
phenolic resin
resin molding
weight
material according
Prior art date
Application number
KR1019960026852A
Other languages
Korean (ko)
Inventor
마사또시 야모또
다모쓰 이시다
Original Assignee
엔다 나오또
스미또모 베이크라이트 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP17637395A external-priority patent/JP3290854B2/en
Priority claimed from JP33654395A external-priority patent/JPH09176447A/en
Application filed by 엔다 나오또, 스미또모 베이크라이트 가부시끼가이샤 filed Critical 엔다 나오또
Publication of KR970042803A publication Critical patent/KR970042803A/en

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Abstract

본 발명은 용융 상태에서의 유동성 및 내열성이 높으며,고온에서 경화성이 우수한, (a) 350 - 500의 수평균 분자량 및 1.5 - 2.5의 오르토-결합/파라-결합 비를 갖는 높은 오르토-노볼락형 페놀 수지, (b) 헥사메틸렌테트라아민, (c) 저분자 폴리올레핀 화합물, 및 (d) 충전재로 이루어지는 페놀 수지 성형 재료를 제공한다. 이러한 페놀 수지 성형 재료는 둘이상의 벤젠 고리를 갖는 결정성 페놀 화합물 및/또는 1가의 지방족 알폴을 더 함유하여, 유동성, 내열성 및 경화성을 더욱 개선할 수 있다.(A) a high ortho-novolak type polymer having a number average molecular weight of 350-500 and an ortho-bonding / para-bonding ratio of 1.5-2.5, which has high fluidity and heat resistance in a molten state and is excellent in curing at high temperatures (B) hexamethylenetetramine, (c) a low-molecular polyolefin compound, and (d) a filler. Such a phenolic resin molding material may further contain a crystalline phenolic compound having two or more benzene rings and / or monovalent aliphatic alpol to further improve fluidity, heat resistance and curability.

Description

페놀수지 성형 재료Phenolic resin molding material

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

Claims (12)

(a) 350 - 500의 수평균 분자량 및 1.5 - 2.5의 오르토-결할/파라-결합비를 갖는 높은 오르토-노볼락형 페놀 수지, (b) 헥사메틸렌테트라아민, (c) 저분자 폴리올레핀 화합물, 및 (d) 충전재를 함유하는 페놀 수지 성형 재료.(a) a high ortho-novolak phenol resin having a number average molecular weight of 350-500 and an ortho-novolak / para-bond ratio of 1.5-2.5, (b) hexamethylenetetramine, (c) a low molecular weight polyolefin compound, and (d) Phenolic resin molding material containing filler. 제 1항에 있어서, 둘 이상의 벤젠 고리를 갖는 결정성 페놀 화합물 (e)를 더 함유하는 페놀수지 성형 재료.The phenolic resin molding material according to claim 1, further comprising a crystalline phenol compound (e) having at least two benzene rings. 제 1항에 있어서, 1가의 지방족 알콜 (g)를 더 함유하는 페놀 수지 성형 재료.The phenolic resin molding material according to claim 1, further comprising a monovalent aliphatic alcohol (g). 제 1 항에 있어서, 둘이상의 벤젠 고리를 갖는 결정성 페놀 화합물 (e) 및 1가의 지방족 알콜 (g)를 더 함유하는 페놀 수지 성형 재료.The phenolic resin molding material according to claim 1, further comprising a crystalline phenol compound (e) having two or more benzene rings and a monovalent aliphatic alcohol (g). 제2항 또는 제4항에 있어서, 벤젠고리상에 둘이상의 히드록실기를 갖는 화합물(f)를 더 함유하는 페놀 수지 성형 재료.The phenolic resin molding material according to claim 2 or 4, further comprising a compound (f) having two or more hydroxyl groups on the benzene ring. 제1항에 있어서, 저분자폴리올레핀화합물(c)는 500 - 1500의 분자량을 갖는 폴리에틸렌인 페놀 수지 성형 재료,The low molecular weight polyolefin compound (c) according to claim 1, wherein the low molecular weight polyolefin compound (c) is a phenol resin molding material which is polyethylene having a molecular weight of 500 to 1500, 제3항 또는 제4항에 있어서, 1가의지방족알콜(g)는 5이하의 탄소수를 가지며, 80 - 140 ℃의 비등점을 갖는 페놀수지 성형재료.The phenolic resin molding material according to claim 3 or 4, wherein the monovalent aliphatic alcohol (g) has a carbon number of 5 or less and a boiling point of 80-140 캜. 제 1항에 있어서, 헥사메틸렌테트라아민 (b)의 양은 페놀 수지 (a) 100중량부에 대하여 7 - 30중량부인 페놀 수지 성형 재료.The phenolic resin molding material according to claim 1, wherein the amount of hexamethylenetetraamine (b) is 7 to 30 parts by weight per 100 parts by weight of the phenol resin (a). 제 1항, 제 2항 또는 제 4항중 어느 한 항에 있어서, 저분자 폴리올레핀 화합물 (c)의 양은 페놀 수지 (a) 또는 페놀 수지 (a) 및 결정성 페놀 화합물 (e)의 총량 100중량부에 대하여 0.1 - 10중량부인 페놀 수지 성형 재료.The positive resist composition according to any one of claims 1, 2 or 4, wherein the amount of the low-molecular polyolefin compound (c) is in the range of 100 parts by weight to 100 parts by weight of the total amount of the phenol resin (a) or the phenolic resin (a) 0.1 to 10 parts by weight per 100 parts by weight of the phenolic resin molding material. 제 1 항에 있어서, 헥사메틸렌테트라아민을 포함하는 수지 성분의 양이 20 - 70 중량% 이고, 충전재의 양은 80 - 30중량%인 페놀 수지 성형 재료.The phenolic resin molding material according to claim 1, wherein the amount of the resin component containing hexamethylenetetramine is 20 to 70% by weight and the amount of the filler is 80 to 30% by weight. 제 2항 또는 제 4항에 있어서, 결정성 페놀 화합물 (e)에 대한 페놀 수지 (a)의 혼합 중량비가 (a)/(e) = 20/80 - 90/10인 페놀 수지 성형 재료.The phenolic resin molding material according to claim 2 or 4, wherein the mixing weight ratio of the phenolic resin (a) to the crystalline phenolic compound (e) is (a) / (e) = 20/80 to 90/10. 제 1항에 있어서, 1가의 지방족 알콜 (g)의 양이 페놀 수지 100중량부에 대하여 1 - 20중량부인 페놀 수지 성형 재료.The phenolic resin molding material according to claim 1, wherein the amount of the monohydric aliphatic alcohol (g) is 1 - 20 parts by weight based on 100 parts by weight of the phenol resin.
KR1019960026852A 1995-07-12 1996-07-03 Phenolic resin molding material KR970042803A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP95-176373 1995-07-12
JP17637395A JP3290854B2 (en) 1995-07-12 1995-07-12 Phenolic resin molding material
JP95-336543 1995-12-25
JP33654395A JPH09176447A (en) 1995-12-25 1995-12-25 Phenol resin molding material

Publications (1)

Publication Number Publication Date
KR970042803A true KR970042803A (en) 1997-07-26

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KR1019960026852A KR970042803A (en) 1995-07-12 1996-07-03 Phenolic resin molding material

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KR (1) KR970042803A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101243755B1 (en) * 2010-05-11 2013-03-13 신흥화학(주) Fast curable phenol moulding compound for compressive or injection moulding with low ammonia volatile content after thermal hardness and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101243755B1 (en) * 2010-05-11 2013-03-13 신흥화학(주) Fast curable phenol moulding compound for compressive or injection moulding with low ammonia volatile content after thermal hardness and method for manufacturing the same

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