KR970024058U - 연소실 냉각 장치 - Google Patents

연소실 냉각 장치

Info

Publication number
KR970024058U
KR970024058U KR2019950034927U KR19950034927U KR970024058U KR 970024058 U KR970024058 U KR 970024058U KR 2019950034927 U KR2019950034927 U KR 2019950034927U KR 19950034927 U KR19950034927 U KR 19950034927U KR 970024058 U KR970024058 U KR 970024058U
Authority
KR
South Korea
Prior art keywords
combustion chamber
cooling system
chamber cooling
combustion
cooling
Prior art date
Application number
KR2019950034927U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019950034927U priority Critical patent/KR970024058U/ko
Publication of KR970024058U publication Critical patent/KR970024058U/ko

Links

KR2019950034927U 1995-11-23 1995-11-23 연소실 냉각 장치 KR970024058U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950034927U KR970024058U (ko) 1995-11-23 1995-11-23 연소실 냉각 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950034927U KR970024058U (ko) 1995-11-23 1995-11-23 연소실 냉각 장치

Publications (1)

Publication Number Publication Date
KR970024058U true KR970024058U (ko) 1997-06-20

Family

ID=60906724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950034927U KR970024058U (ko) 1995-11-23 1995-11-23 연소실 냉각 장치

Country Status (1)

Country Link
KR (1) KR970024058U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10147616B2 (en) 2014-10-27 2018-12-04 Samsung Electronics Co., Ltd. Package frame and method of manufacturing semiconductor package using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10147616B2 (en) 2014-10-27 2018-12-04 Samsung Electronics Co., Ltd. Package frame and method of manufacturing semiconductor package using the same

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application