KR970018468A - Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same - Google Patents

Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same Download PDF

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Publication number
KR970018468A
KR970018468A KR1019950031511A KR19950031511A KR970018468A KR 970018468 A KR970018468 A KR 970018468A KR 1019950031511 A KR1019950031511 A KR 1019950031511A KR 19950031511 A KR19950031511 A KR 19950031511A KR 970018468 A KR970018468 A KR 970018468A
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KR
South Korea
Prior art keywords
lead frame
tie bar
semiconductor chip
leadframe
extended
Prior art date
Application number
KR1019950031511A
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Korean (ko)
Inventor
정도수
정현조
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950031511A priority Critical patent/KR970018468A/en
Publication of KR970018468A publication Critical patent/KR970018468A/en

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 명은 실장되어질 반도체 칩에 형성된 본딩패드를 대응하고, 그 본딩패드들에 전기적으로 연결되는 리드들과, 리드프레임을 지지하기 위한 타이바를 갖는 리드프레임에 있어서, 상기 타이바가 성형공정의 진행시 성형수지를 리드프레임의 상부와 하부에 균형 있게 충진될 수 있도록 리드프레임의 내측 방향으로 연장되어 있는 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임 및 반도체 칩 패키지를 제공함으로써, 패키지 성형공정에서의 리드프레임 상부와 하부로 유입되는 성형수지의 유입속도 차이를 줄여 크랙의 발생을 방지하여 반도체 칩 패키지의 신뢰성을 개선시키는 효과를 나타내는 것을 특징으로 한다.The present invention corresponds to a bonding pad formed on a semiconductor chip to be mounted, and has a lead frame having leads electrically connected to the bonding pads and a tie bar for supporting the lead frame, wherein the tie bar is formed during the molding process. By providing a lead frame and a semiconductor chip package having an extended tie bar, characterized in that the resin is extended in the inward direction of the lead frame so that the resin can be balanced in the upper and lower portions of the lead frame, the lead frame in the package forming process It is characterized in that the effect of improving the reliability of the semiconductor chip package by preventing the occurrence of cracks by reducing the difference in the flow rate of the molding resin flowing into the upper and lower parts.

Description

연장된 타이바를 갖는 리드프레임 및 이를 이용한 반도체 칩 패키지Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본발명에 따른 리드 온 칩 패키지용 리드프레임의 일 실시예로써, 리드프레임과 반도체 칩의 결합된 상태를 나타내는 평면도.3 is a plan view illustrating a combined state of a lead frame and a semiconductor chip according to one embodiment of a lead frame for a lead-on chip package according to the present invention.

제4도는 제3도의 리드프레임을 포함하는 리드 온 칩 패키지의 성형공정에서 모의 실험을 통하여 에폭시 성형 수지가 유입되는 상태를 나타낸 단면도.4 is a cross-sectional view showing a state in which the epoxy molding resin is introduced through the simulation in the molding process of the lead-on chip package including the lead frame of FIG.

Claims (6)

실장 되어질 반도체 칩에 형성된 본딩패드들에 대응되고, 그 본딩패드들에 전기적으로 연결되는 리드들과, 리드프레임을 지지하기 위한 타이바를 갖는 리드프레임에 있어서, 상기 타이바가 성형공정의 진행시 성형수지를 리드프레임의 상부와 하부에 균형있게 충진될 수 있도록 리드프레임의 말단부에서 내측 방향으로 연장되어 형성되어 있는 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임.A lead frame having leads corresponding to bonding pads formed on a semiconductor chip to be mounted and electrically connected to the bonding pads, and a tie bar for supporting the lead frame, wherein the tie bars are formed of a molding resin during the molding process. Lead frame having an extended tie bar, characterized in that extending in the inward direction from the distal end of the lead frame so as to be balanced in the upper and lower portions of the lead frame. 제1하에 있어서, 상기 타이바가 성형 수지의 원활한 유동을 위하여 그 타이바를 관통하는 복수개의 구멍이 형성되어 있는 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임.The lead frame according to claim 1, wherein the tie bars are formed with a plurality of holes penetrating the tie bars for smooth flow of the molding resin. 제1항에 있어서, 상기 타이바가 적어도 하나 이상의 굴곡된 부위가 형성되어 있는 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임.The leadframe having an extended tie bar according to claim 1, wherein the tie bar is formed with at least one curved portion. 제2항에 있어서, 상기 관통구멍이 적어도 하나 이상인 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임.3. A leadframe with elongated tie bars according to claim 2, wherein said through holes are at least one. 제1항에 있어서, 상기 타이바는 실장될 반도체 칩의 영역을 넘지 않는 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임.2. The leadframe as recited in claim 1, wherein said tie bar does not exceed an area of a semiconductor chip to be mounted. 복구개의 본딩패드들이 상면에 형성된 반도체 칩과, 그 반도체 칩의 상면에 접착수단에 의해 부착되어 상기 본딩패드들과 전기적으로 연결되는 리드들과, 타이바를 갖는 리드프레임과, 상기 반도체 칩과 리드들 및 타이바를 내부에 봉지시킨 봉지수단을 포함하는 리드 온 칩 구조를 갖는 반도체 칩 패키지에 있어서, 상기 타이바가 성형공정의 진행시 성형수지를 리드프레임의 상부와 하부에 균형있게 충전될 수 있도록 리드프레임의 말단부에서 내측 방향으로 연장되어 형성되어 있는 것을 특징으로 하는 연장된 타이바를 갖는 리드프레임을 이용한 라드 온 칩 구조를 갖는 반도체 칩 패키지.A semiconductor chip having a recovery bond pads formed on an upper surface thereof, leads connected to an upper surface of the semiconductor chip by adhesive means to be electrically connected to the bonding pads, a lead frame having a tie bar, and the semiconductor chip and leads And a lead-on chip structure including an encapsulation means in which a tie bar is enclosed therein, the lead chip having a lead-on chip structure comprising: a lead frame such that the tie bar can be filled in the upper and lower portions of the lead frame in a balanced manner during the molding process; The semiconductor chip package having a rod-on-chip structure using a lead frame having an extended tie bar, characterized in that it is formed extending in the inward direction from the distal end of the.
KR1019950031511A 1995-09-23 1995-09-23 Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same KR970018468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950031511A KR970018468A (en) 1995-09-23 1995-09-23 Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950031511A KR970018468A (en) 1995-09-23 1995-09-23 Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same

Publications (1)

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KR970018468A true KR970018468A (en) 1997-04-30

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KR1019950031511A KR970018468A (en) 1995-09-23 1995-09-23 Leadframe with Extended Tie Bar and Semiconductor Chip Package Using the Same

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KR (1) KR970018468A (en)

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