KR970018056A - Method for forming contact hole in semiconductor device - Google Patents
Method for forming contact hole in semiconductor device Download PDFInfo
- Publication number
- KR970018056A KR970018056A KR1019950031809A KR19950031809A KR970018056A KR 970018056 A KR970018056 A KR 970018056A KR 1019950031809 A KR1019950031809 A KR 1019950031809A KR 19950031809 A KR19950031809 A KR 19950031809A KR 970018056 A KR970018056 A KR 970018056A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- film
- contact hole
- oxide film
- forming
- Prior art date
Links
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- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 반도체 장치의 접촉구 형성 공정에 있어서 습식식각 수행시 발생하는 포토레지스트 부유물(photoresist blister, 이하 ‘PR 부유물’이라칭함)을 별도의 추가 공정 없이 건식시각시 동시에 제거하는 것에 관한 것으로 기판상에 하부막질을 형성하고, 상기 하부막질상에 산화막을 적층하고, 상기 산화막상에 포토레지스트를 도포하고, 패터닝하여 1차로 습식식각하는 공정과; 혼합개스를 이용하여 2차로 건식식각을 수행하여 상기 산화막과 상기 습식식각시 발생한 PR 부유물을 동시에 제거하는 공정을 포함하는 것이다.The present invention relates to removing photoresist blisters (hereinafter referred to as 'PR floats') generated during wet etching in a contact hole forming process of a semiconductor device at the same time on dry substrate without any additional process. Forming a lower film on the lower film, laminating an oxide film on the lower film, applying a photoresist on the oxide film, and patterning the film to wet-etch firstly; And performing a second dry etching process using a mixed gas to simultaneously remove the oxide film and the PR suspended solids generated during the wet etching process.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2A도 내지 제2C도는 본 발명에 따른 반도체 장치 접촉구 형성 공정의 단면도.2A to 2C are cross-sectional views of a semiconductor device contact hole forming process according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950031809A KR970018056A (en) | 1995-09-26 | 1995-09-26 | Method for forming contact hole in semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950031809A KR970018056A (en) | 1995-09-26 | 1995-09-26 | Method for forming contact hole in semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970018056A true KR970018056A (en) | 1997-04-30 |
Family
ID=66616422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950031809A KR970018056A (en) | 1995-09-26 | 1995-09-26 | Method for forming contact hole in semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970018056A (en) |
-
1995
- 1995-09-26 KR KR1019950031809A patent/KR970018056A/en not_active Application Discontinuation
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WITN | Withdrawal due to no request for examination |