KR970018056A - Method for forming contact hole in semiconductor device - Google Patents

Method for forming contact hole in semiconductor device Download PDF

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Publication number
KR970018056A
KR970018056A KR1019950031809A KR19950031809A KR970018056A KR 970018056 A KR970018056 A KR 970018056A KR 1019950031809 A KR1019950031809 A KR 1019950031809A KR 19950031809 A KR19950031809 A KR 19950031809A KR 970018056 A KR970018056 A KR 970018056A
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KR
South Korea
Prior art keywords
semiconductor device
film
contact hole
oxide film
forming
Prior art date
Application number
KR1019950031809A
Other languages
Korean (ko)
Inventor
이강현
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950031809A priority Critical patent/KR970018056A/en
Publication of KR970018056A publication Critical patent/KR970018056A/en

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Abstract

본 발명은 반도체 장치의 접촉구 형성 공정에 있어서 습식식각 수행시 발생하는 포토레지스트 부유물(photoresist blister, 이하 ‘PR 부유물’이라칭함)을 별도의 추가 공정 없이 건식시각시 동시에 제거하는 것에 관한 것으로 기판상에 하부막질을 형성하고, 상기 하부막질상에 산화막을 적층하고, 상기 산화막상에 포토레지스트를 도포하고, 패터닝하여 1차로 습식식각하는 공정과; 혼합개스를 이용하여 2차로 건식식각을 수행하여 상기 산화막과 상기 습식식각시 발생한 PR 부유물을 동시에 제거하는 공정을 포함하는 것이다.The present invention relates to removing photoresist blisters (hereinafter referred to as 'PR floats') generated during wet etching in a contact hole forming process of a semiconductor device at the same time on dry substrate without any additional process. Forming a lower film on the lower film, laminating an oxide film on the lower film, applying a photoresist on the oxide film, and patterning the film to wet-etch firstly; And performing a second dry etching process using a mixed gas to simultaneously remove the oxide film and the PR suspended solids generated during the wet etching process.

Description

반도체 장치의 접촉구 형성 방법Method for forming contact hole in semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2A도 내지 제2C도는 본 발명에 따른 반도체 장치 접촉구 형성 공정의 단면도.2A to 2C are cross-sectional views of a semiconductor device contact hole forming process according to the present invention.

Claims (2)

반도체 기판(10)상에 하부막질(12)을 형성하는 공정과; 상기 하부막질(12)상에 산화막(14)을 형성하는 공정과; 상기 산화막(14)을 소정의 두께로 습식식각하는 공정과; O2의 함량비가 적어도 25% 이상인 플로린계 개스와 O2의 혼합개스를 사용하여 상기 산화막(14)과 PR 부유물(l8)을 동시에 제거하는 공정을 포함하는 것을 특징으로 하는 반도체 장치의 접촉구 형성 방법.Forming a lower film (12) on the semiconductor substrate (10); Forming an oxide film (14) on the lower film (12); Wet etching the oxide film (14) to a predetermined thickness; Forming a contact hole of a semiconductor device, comprising simultaneously removing the oxide film 14 and the PR suspended solid 1 8 by using a mixed gas of florin-based gas having an O 2 content ratio of at least 25% or more and O 2 . Way. 제1항에 있어서, 상기 혼합개스의 성분이 CHF3와 O2로 이루어지는 것을 특징으로 하는 반도체 장치의 접촉구 형성 방법.The method of forming a contact hole in a semiconductor device according to claim 1, wherein the components of the mixed gas are composed of CHF 3 and O 2 . ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950031809A 1995-09-26 1995-09-26 Method for forming contact hole in semiconductor device KR970018056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950031809A KR970018056A (en) 1995-09-26 1995-09-26 Method for forming contact hole in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950031809A KR970018056A (en) 1995-09-26 1995-09-26 Method for forming contact hole in semiconductor device

Publications (1)

Publication Number Publication Date
KR970018056A true KR970018056A (en) 1997-04-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950031809A KR970018056A (en) 1995-09-26 1995-09-26 Method for forming contact hole in semiconductor device

Country Status (1)

Country Link
KR (1) KR970018056A (en)

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