KR970010112B1 - Chip-type three port electromagnetic wave-proofing filter - Google Patents
Chip-type three port electromagnetic wave-proofing filter Download PDFInfo
- Publication number
- KR970010112B1 KR970010112B1 KR94014638A KR19940014638A KR970010112B1 KR 970010112 B1 KR970010112 B1 KR 970010112B1 KR 94014638 A KR94014638 A KR 94014638A KR 19940014638 A KR19940014638 A KR 19940014638A KR 970010112 B1 KR970010112 B1 KR 970010112B1
- Authority
- KR
- South Korea
- Prior art keywords
- filter body
- chip
- electrodes
- condenser
- lead portions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/33—Arrangements for noise damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Abstract
A chip-shaped 3-lead filter for preventing electromagnetic waves comprises a ferrite device(2) in which lead portions(4,5) is installed by interposing coil winding recesses(6,6') on both sides of a filter body(3) and in which a condenser receiving recess(7) to which a chip condenser(12) is mounted is formed at a center portion of the filter body(3) and in which electrodes(8,8',9,9') are respectively formed on the bottom and upper sides of the filter body(3) and on the lower surface of the lead portions(4,5); an inductance extracting portion(10) in which a copper coil(11) is wound in coil winding recesses(6,6') of the ferrite device(2) and in which one end portion of the copper coil(11) is connected to the electrode(8') formed on an upper side of the filter body(3) and the other end portion thereof is electrically connected to the electrodes(9,9') formed on the lower surface of the lead portions(4,5); a chip condenser(12) which is inserted into the condenser receiving recess(7) formed on the center portion of the filter body and is electrically connected to the electrodes(8,8') coated on the upper and lower sides of the filter body(3); and a resin molding portion(13) which is an insulating epoxy resin and insulates the ferrite device(2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94014638A KR970010112B1 (en) | 1994-06-24 | 1994-06-24 | Chip-type three port electromagnetic wave-proofing filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR94014638A KR970010112B1 (en) | 1994-06-24 | 1994-06-24 | Chip-type three port electromagnetic wave-proofing filter |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960003519A KR960003519A (en) | 1996-01-26 |
KR970010112B1 true KR970010112B1 (en) | 1997-06-21 |
Family
ID=19386253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR94014638A KR970010112B1 (en) | 1994-06-24 | 1994-06-24 | Chip-type three port electromagnetic wave-proofing filter |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970010112B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10137672B2 (en) | 2014-03-17 | 2018-11-27 | Samsung Display Co., Ltd. | Lamination device and method |
-
1994
- 1994-06-24 KR KR94014638A patent/KR970010112B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10137672B2 (en) | 2014-03-17 | 2018-11-27 | Samsung Display Co., Ltd. | Lamination device and method |
Also Published As
Publication number | Publication date |
---|---|
KR960003519A (en) | 1996-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20011004 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |