KR970006981Y1 - Fixing apparatus of device - Google Patents

Fixing apparatus of device Download PDF

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Publication number
KR970006981Y1
KR970006981Y1 KR2019900020755U KR900020755U KR970006981Y1 KR 970006981 Y1 KR970006981 Y1 KR 970006981Y1 KR 2019900020755 U KR2019900020755 U KR 2019900020755U KR 900020755 U KR900020755 U KR 900020755U KR 970006981 Y1 KR970006981 Y1 KR 970006981Y1
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KR
South Korea
Prior art keywords
pcb substrate
present
fixed
lead
elastic piece
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Application number
KR2019900020755U
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Korean (ko)
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KR920013681U (en
Inventor
문지영
Original Assignee
금성일렉트론 주식회사
문정환
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Application filed by 금성일렉트론 주식회사, 문정환 filed Critical 금성일렉트론 주식회사
Priority to KR2019900020755U priority Critical patent/KR970006981Y1/en
Publication of KR920013681U publication Critical patent/KR920013681U/en
Application granted granted Critical
Publication of KR970006981Y1 publication Critical patent/KR970006981Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads

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  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

내용없음No content

Description

디바이스의 고정장치Fixture of the device

제 1 도는 본 고안장치의 디바이스 정면도1 is a front view of the device of the present device

제 2 도는 본 고안장치의 종단면도2 is a longitudinal cross-sectional view of the device of the present invention

제 3 도는 종래의 디바이스 정면도3 is a front view of a conventional device

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

1 : 디바이스2 : 팩케이지1: Device 2: Package

3 : 리드4 : 탄성편3: lead 4: elastic piece

5 : PCB 기판6 : 삽입공5: PCB board 6: insertion hole

본 고안은 디바이스를 PCB 기판에 고정시키기 위한 장치에 관한 것으로서, 특히 별도의 공구를 사용하지 않고도 PCB 기판에 고정 또는 분해시킬 수 있도록 한 것이다.The present invention relates to a device for fixing a device to a PCB substrate, in particular to be able to be fixed or disassembled on the PCB substrate without using a separate tool.

종래에는 제 3 도와 같이 디바이스(11)는 양측으로 절곡된 리드(12)가 다수개 형성되어 있어 디바이스(11)를 PCB 기판(도시는 생략함)에 고정시키기 위해서는 리드(12)를 PCB 기판상의 구멍에 삽입하고 PCB 기판의 배면에서 납땜 고정하도록 되어 있다.Conventionally, as shown in FIG. 3, the device 11 has a plurality of leads 12 that are bent to both sides, so that the lead 12 is fixed on the PCB substrate in order to fix the device 11 to the PCB substrate (not shown). It is intended to be inserted into a hole and soldered to the back of the PCB board.

그러나 이러한 종래의 디바이스를 사용도중, 파손이나 고장 등으로 인해 교체하고자 할 경우에는 PCB 기판의 납땜부위를 인두 등의 공구를 사용하여 제거시킨후 교체하여야 되었고, 또한 교체후에도 디바이스(11)를 납땜고정시켜야 되었으므로 디바이스(11)의 고정 및 교체작업이 번거로운 결점이 있었다.However, if the conventional device is to be replaced due to breakage or breakdown during use, the soldering part of the PCB board must be removed by using a tool such as a soldering iron, and then the device 11 is soldered and fixed. As a result, fixing and replacing the device 11 were cumbersome.

본 고안은 종래의 이와 같은 결점을 감안하여 안출한 것으로서, 디바이스의 리드에 탄성편을 형성하여 납땜을 하지 않고도 PCB기판에 고정 및 분해시킬 수 있도록 하는데 그 목적이 있다.The present invention has been made in view of the above-mentioned drawbacks, and an object thereof is to form an elastic piece on a lead of a device so that the PCB can be fixed and disassembled without soldering.

상기 목적을 달성하기 위해, 본 고안은 디바이스의 팩케이지 양측으로 다수개의 리드를 절곡형성하여 된것에 있어서, 리드의 외측으로 탄성편을 형성하여 리드를 PCB 기판의 삽입공에 끼우면 탄성편에 의해 디바이스가 PCB 기판에 고정될 수 있도록 한 디바이스의 고정장치가 제공된다.In order to achieve the above object, the present invention is formed by bending a plurality of leads on both sides of the package of the device, by forming an elastic piece on the outside of the lead to insert the lead into the insertion hole of the PCB substrate by the device A device holding device is provided so that the device can be secured to the PCB substrate.

이하, 본 고안을 일실시예로 도시한 첨부된 도면 제 1 도 및 제 2 도를 참고로하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 1 and 2 of the accompanying drawings.

첨부도면 제 1 도는 본 고안의 디바이스 정면도이고 제 2 도는 본 고안 장치의 일부 종단면도로서, 디바이스(1)의 팩케이지(2) 양측면에 절곡된 다수개의 리드(3)가 형성되어 있고 각 리드(3)에는 탄성편(4)이 형성되어 있다.1 is a front view of the device of the present invention and FIG. 2 is a partial longitudinal cross-sectional view of the device of the present invention, in which a plurality of leads 3 are bent on both sides of the package 2 of the device 1 and each lead ( The elastic piece 4 is formed in 3).

따라서 디바이스(1)의 리드(3)를 제 2 도에서와 같이 PCB 기판(5)에 형성된 삽입공(6)에 끼우면 탄성편(4)이 삽입공(6)에 의해 내측으로 밀려 압축되어 결합되므로 디바이스(1)가 PCB 기판(5)에 견고히 고정된다.Therefore, when the lead 3 of the device 1 is inserted into the insertion hole 6 formed in the PCB substrate 5 as shown in FIG. 2, the elastic piece 4 is pushed inward by the insertion hole 6 to be compressed and joined. The device 1 is thus firmly fixed to the PCB substrate 5.

이와 같이 디바이스(1)를 PCB 기판(5)에 고정하여 사용하다가 교체 및 수리를 하기 위해 PCB 기판(5)에서 분리시키고자 할 경우에는 팩케이지(2)를 손가락으로 잡고 상방으로 잡아당기면 디바이스(1)가 분리되므로 새로운 디바이스를 전술한 바와 같은 동작에 의해 PCB 기판(5)에 고정시키게 되는 것이다.As described above, when the device 1 is fixed to the PCB substrate 5 and is to be separated from the PCB substrate 5 for replacement and repair, the device 1 may be held by the finger and pulled upwards. Since 1) is separated, the new device is fixed to the PCB substrate 5 by the operation as described above.

이상에서와 같이 본 고안장치는 리드(3)의 외측으로 탄성편(4)을 형성하는 간단한 구조에 의해 납땜을 하지 않고도 디바이스(1)를 PCB 기판(5)상에 고정시킬 수 있어 생산성을 향상시킬 수 있게 됨은 물론 교체작업이 용이해지게 되는 효과가 있다.As described above, the device of the present invention can fix the device 1 on the PCB substrate 5 without soldering due to the simple structure of forming the elastic piece 4 on the outside of the lid 3, thereby improving productivity. As well as being able to make the replacement operation is easy.

Claims (1)

(정정) 팩케이지(2) 양측으로 다수개의 리드(3)를 절곡 형성하여서 된 디바이스에 있어서, 상기 리드(3)가 PCB 기판(5)의 삽입공(6)에 고정되도록 상기 리드의 바깥면에 탄성편(4)을 형성한 것을 특징으로 하는 디바이스의 고정장치.(Correction) In a device formed by bending a plurality of leads 3 on both sides of a package 2, the outer surface of the leads so that the leads 3 are fixed to the insertion holes 6 of the PCB substrate 5. An elastic piece (4) formed in the device, characterized in that the fixing device.
KR2019900020755U 1990-12-24 1990-12-24 Fixing apparatus of device KR970006981Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900020755U KR970006981Y1 (en) 1990-12-24 1990-12-24 Fixing apparatus of device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900020755U KR970006981Y1 (en) 1990-12-24 1990-12-24 Fixing apparatus of device

Publications (2)

Publication Number Publication Date
KR920013681U KR920013681U (en) 1992-07-27
KR970006981Y1 true KR970006981Y1 (en) 1997-07-11

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ID=19307656

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900020755U KR970006981Y1 (en) 1990-12-24 1990-12-24 Fixing apparatus of device

Country Status (1)

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KR (1) KR970006981Y1 (en)

Also Published As

Publication number Publication date
KR920013681U (en) 1992-07-27

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