KR960043134A - Multichip Semiconductor Package Using Intermediate Conductive Base and Manufacturing Method Thereof - Google Patents
Multichip Semiconductor Package Using Intermediate Conductive Base and Manufacturing Method Thereof Download PDFInfo
- Publication number
- KR960043134A KR960043134A KR1019950014292A KR19950014292A KR960043134A KR 960043134 A KR960043134 A KR 960043134A KR 1019950014292 A KR1019950014292 A KR 1019950014292A KR 19950014292 A KR19950014292 A KR 19950014292A KR 960043134 A KR960043134 A KR 960043134A
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- KR
- South Korea
- Prior art keywords
- conductive base
- intermediate conductive
- silicon substrate
- semiconductor package
- manufacturing
- Prior art date
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 멀티층에 의한 베어칩을 실장공정을 이용하지 않고서도 단일 금속층에 의한 베어칩들의 실장이 가능하도록 하기 위하여, 상술한 바와같이 본 발명에 따른 중간 도전성 베이스를 이용한 멀티칩 반도체 패키지 및 그 제조방법에 의하면, 실리콘 기판의 소정영역에 형성된 적어도 하나 이상의 전극패드와; 상기 전극패드의 사이 사이에 배열 형성되며, 상기 실리콘 기판상에 비 도전성 접착제가 개재되어 다이 본딩된 베어칩들 및 중간 도전성 베이스와; 상기 중간 도전성 베이스 및 전극패드를 매개로 하여 베어칩들의 상호간을 전기적으로 연결하고 있는 적어도 3개 이상의 본딩 와이어로 구성되는 중간 도전성 베이스를 이용한 멀티칩 반도체 패키지 및 그 제조방법에 관한 것이다.The present invention provides a multi-chip semiconductor package using an intermediate conductive base according to the present invention, and the same, in order to be able to mount the bare chips by a single metal layer without using a mounting process for mounting a bare chip by a multi-layer. According to the manufacturing method, at least one electrode pad formed in a predetermined region of the silicon substrate; A bare chip and an intermediate conductive base which are formed between the electrode pads and are die-bonded with a non-conductive adhesive interposed on the silicon substrate; The present invention relates to a multichip semiconductor package using an intermediate conductive base including at least three bonding wires electrically connecting bare chips to each other through the intermediate conductive base and the electrode pad, and a method of manufacturing the same.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 따른 중간 도전성 베이스를 이용한 멀티칩 반도체 패키지의 일실시예를 나타낸 단면도, 제3도(가)∼(라)는 본 발명에 따른 중간 도전성 베이스를 이용한 멀티칩 반도체 패키지 제조방법의 일실시예를 나타낸 제조공정도, 제4도는 본 발명에 따른 중간 도전성 베이스를 이용한 멀티칩 반도체 패키지의 회로적인 접속관계를 나타낸 도면이다.2 is a cross-sectional view showing an embodiment of a multi-chip semiconductor package using an intermediate conductive base according to the present invention, Figure 3 (a) to (d) is a method for manufacturing a multi-chip semiconductor package using an intermediate conductive base according to the present invention 4 is a diagram illustrating a circuit connection relationship of a multichip semiconductor package using an intermediate conductive base according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950014292A KR0142975B1 (en) | 1995-05-31 | 1995-05-31 | Multichip Semiconductor Package Using Intermediate Conductive Base and Manufacturing Method Thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950014292A KR0142975B1 (en) | 1995-05-31 | 1995-05-31 | Multichip Semiconductor Package Using Intermediate Conductive Base and Manufacturing Method Thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960043134A true KR960043134A (en) | 1996-12-23 |
KR0142975B1 KR0142975B1 (en) | 1998-07-01 |
Family
ID=66525897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950014292A KR0142975B1 (en) | 1995-05-31 | 1995-05-31 | Multichip Semiconductor Package Using Intermediate Conductive Base and Manufacturing Method Thereof |
Country Status (1)
Country | Link |
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KR (1) | KR0142975B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100537893B1 (en) * | 1998-11-04 | 2006-02-28 | 삼성전자주식회사 | Leadframe and multichip package using the same |
-
1995
- 1995-05-31 KR KR1019950014292A patent/KR0142975B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100537893B1 (en) * | 1998-11-04 | 2006-02-28 | 삼성전자주식회사 | Leadframe and multichip package using the same |
Also Published As
Publication number | Publication date |
---|---|
KR0142975B1 (en) | 1998-07-01 |
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