KR960034344A - 전자부품용 접착테이프 - Google Patents

전자부품용 접착테이프 Download PDF

Info

Publication number
KR960034344A
KR960034344A KR1019960009313A KR19960009313A KR960034344A KR 960034344 A KR960034344 A KR 960034344A KR 1019960009313 A KR1019960009313 A KR 1019960009313A KR 19960009313 A KR19960009313 A KR 19960009313A KR 960034344 A KR960034344 A KR 960034344A
Authority
KR
South Korea
Prior art keywords
semi
group
weight
layer
cured
Prior art date
Application number
KR1019960009313A
Other languages
English (en)
Other versions
KR0150931B1 (ko
Inventor
유끼노로 사꾸모또
다께시 하시모또
다께시 니시가와
후미요시 야마나시
Original Assignee
호소까와 마사지로
가부시끼가이샤 도모에가와세이시쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 호소까와 마사지로, 가부시끼가이샤 도모에가와세이시쇼 filed Critical 호소까와 마사지로
Publication of KR960034344A publication Critical patent/KR960034344A/ko
Application granted granted Critical
Publication of KR0150931B1 publication Critical patent/KR0150931B1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02Copolymers with acrylonitrile
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J119/00Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00
    • C09J119/006Rubber characterised by functional groups, e.g. telechelic diene polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826Connecting between the body and an opposite side of the item with respect to the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73215Layer and wire connectors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/1452Polymer derived only from ethylenically unsaturated monomer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/1452Polymer derived only from ethylenically unsaturated monomer
    • Y10T428/1457Silicon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/1476Release layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848Three or more layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852Adhesive compositions
    • Y10T428/2878Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2887Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31667Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31786Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797Next to addition polymer from unsaturated monomers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • Y10T428/3188Next to cellulosic
    • Y10T428/31895Paper or wood

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Silicon Polymers (AREA)
  • Die Bonding (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은, 비교적 저온으로 접착, 경화할 수 있으며, 충분한 내열성, 신뢰성 등을 가지는 전자부품용 접착 테이프를 제공한다.
본 발명의 전자부품용 접착 테이프는 테이프 박리성 필름의 한면에 (a) 중량 평균 분자량 10,000 내지 200,000 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기 당량 500 내지 10,000인 하기 일반식(I)의 표시되는 피페라디닐에틸아마노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체와,
(식중 k, m 및 n은 몰비로서, n=1에 대하여 k=3 내지 175, m=0.3 내지 93이다) (b) 2개 이상의 말레이미드기를 함유하는 화합물을 주성분으로 하는 접착층을 적층하여 이루어지고, 이 접착층에 B단계까지 경화된 것으로서, 서로 다른 경화도를 가진 2개 이상의 반경화층으로 구성된다.

Description

전자부품용 접착테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 박리성 필름의 한면에, (a) 중량 평균 분자량 10,000 내지 200,000, 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기 당량 500 내지 10,000인 하기 일반식(I)으로 표시되는 피페라디닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체와,
    (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물을 함유하고,
    (식중, p는 0 내지 7의 정수를 의미함.)
    (식중, MI=말레이미드기, R=H 또는 CH3r=1 내지 5)
    성분 (a) 100중량부에 대하여, 성분(b)는 10 내지 900 중량부인 접착층을 적층하여 이루어지고, 그 접착층이 B단계까지 경화된 것으로서, 서로 다른 경화도를 가지는 2이상의 반경화층으로 이루어진 것을 특징으로 하는 전자부품용 접착 테이프.
  2. 제1항에 있어서, 접착층의 표면에 추가로 박리성 필름이 설치된 것을 특징으로 하는 전자부품용 접착테이프.
  3. 제1항에 있어서, 접착층에 입경 1㎛ 이하의 충진재가 4 내지 40중량% 함유된 것을 특징으로 하는 전자부품용 접착 테이프.
  4. 제1항에 있어서, B단계 상태로 경화된 접착층이, 슬라이드 속도 0.01 내지 0.3㎛/sec인 고경화도의 반경화층과, 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 반경화층으로 이루어지며, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 반경화층의 슬라이드 속도(V2) 가, V2V1의 관계를 가지는 것을 특징으로 하는 전자부품용 접착 테이프.
  5. 제1항에 있어서, B단계까지 경하된 접착층이 슬라이드 속도가 0.1 내지 10.0㎛/sec인 저경화도의 제1의 반경화층, 슬라이드 속도 0.3㎛/sec이하의 고경화도의 반경화층 및 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 제2의 반경화층을 순차 적층하여 이루어지며, 또한 고경화도의 반경화층의 슬라이드 속도(V3)와 저경화도의 제1의 반경화층의 슬라이드 속도(V4)및 제2의 반경화층의 슬라이드 속도(V5) 가 V4V3및 V5V3의 관계를 가지는 것을 특징으로 하는 전자부품용 접착 테이프.
  6. 박리성 필름의 한면에, (a) 중량 평균 분자량 10,000 내지 200,000, 아크릴로니트릴 함유율 5 내지 50중량%, 아미노기당량 500 내지 10,000인 하기 일반식(I)으로 표시되는 피페라디닐에틸아미노카르보닐기 함유 부타디엔-아크릴로니트릴 공중합체,
    (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물.
    (식중, p는 0 내지 7의 정수를 의미함.)
    (식중, MI=말레이미드기, R=H 또는 CH3r=1 내지 5)및 (c) 하기 일반식(III)으로 표시되는 디아민 화합물
    H2N-R1-NH2(Ⅲ)
    (식중, R1은 2가의 지방족기, 방향족기 또는 지환식기를 나타냄) 또는 중량 평균 분자량 200 내지 7,000의 하기 일반식(IV)으로 표시되는 아미노기 함유 폴리실록산 화합물을 함유하고
    (식중, R2는 2가의 지방족기, 방향족기 또는 지환식기를 나타내며, s는 0 내지 7의 정수를 의미함); 성분 (a) 100중량부에 대하여, 성분 (b)와 성분(c)의 총합이 10 내지 900중량부이며, 성분 (c)의 마이노기 1몰 당량에 대한 성분 (b)의 말레이미드기가 1 내지 100몰 당량인 접착층을 적층하여 이루어지며, 그 접착층이 B 단계 상태로 경화된 것으로써, 서로 다른 경화도를 가진 2 이상의 반경화층으로 이루어진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  7. 제6항에 있어서, 접착층의 표면에, 추가로 박리성 필름이 설치된 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  8. 제6항에 있어서, 접착층이 입경 1㎛ 이하의 충진재가 4 내지 40중량% 함유되어 있는 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  9. 제6항에 있어서, B단계 상태로 경화된 접착층이, 슬라이드 속도 0.01 내지 0.3㎛/sec인 고경화도의 반경화층과, 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도의 반경화층으로 이루어지고, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 반경화층의 슬라이드 속도(V2)가 V2V1의 관계를 가진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물
  10. 제6항에 있어서, B단계까지 경화된 접착층이, 슬라이드 속도가 0.1 내지 10.0㎛/sec인 저경화도의 제1의 반경화층, 슬라이드 속도 0.3㎛/sec이하의 고경화도의 반경화층 및 슬라이드 속도 0.1 내지 10.0㎛/sec인 저경화도이 제2의 반경화층을 순차 적응하여 이루어지고, 또한 고경화도의 반경화층의 슬라이드 속도(V1)와 저경화도의 제1의 반경화층의 슬라이드 속도(V4)및 제2의 반경화층의 슬라이드 속도(V5)가 V4V3및 V5V3의 관계를 가진 것을 (식중, k, m 및 n은 몰비로서, n=1에 대하여, k=3 내지 175, m=0.3 내지 93인 범위의 수를 나타냄.) (b) 하기식(II-1) 내지 식(II-6)으로 표시되는 화합물에서 선택된 2개 이상의 말레이미드기를 함유하는 화합물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960009313A 1995-03-30 1996-03-29 전자부품용 접착테이프 KR0150931B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-95917 1995-03-30
JP7095917A JP2896751B2 (ja) 1995-03-30 1995-03-30 電子部品用接着テープ

Publications (2)

Publication Number Publication Date
KR960034344A true KR960034344A (ko) 1996-10-22
KR0150931B1 KR0150931B1 (ko) 1998-10-01

Family

ID=14150637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960009313A KR0150931B1 (ko) 1995-03-30 1996-03-29 전자부품용 접착테이프

Country Status (4)

Country Link
US (1) US5609956A (ko)
JP (1) JP2896751B2 (ko)
KR (1) KR0150931B1 (ko)
TW (1) TW450990B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100642678B1 (ko) * 2004-07-13 2006-11-10 가부시키가이샤 도모에가와 세이시쇼 전자부품용 접착테이프 및 전자부품

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001131501A (ja) * 1999-11-04 2001-05-15 Hitachi Chem Co Ltd 三層接着フィルム、半導体チップ搭載用基板及び半導体装置
JP2001152107A (ja) * 1999-11-25 2001-06-05 Hitachi Chem Co Ltd 積層接着フィルム、半導体チップ搭載用基板及び半導体装置
US7390570B2 (en) * 2004-05-13 2008-06-24 The Yokohama Rubber Co., Ltd. Maleimide terminated rubber and curable composition produced by using the maleimide terminated rubber
US8105880B2 (en) 2007-12-05 2012-01-31 Analog Devices, Inc. Method for attaching a semiconductor die to a leadframe, and a semiconductor device
JP5110441B2 (ja) 2008-01-15 2012-12-26 大日本印刷株式会社 半導体装置用配線部材、半導体装置用複合配線部材、および樹脂封止型半導体装置
TWI501371B (zh) * 2009-01-13 2015-09-21 Dainippon Printing Co Ltd A wiring member for a semiconductor device, a composite wiring member for a semiconductor device, and a resin-sealed type semiconductor device
JP2014529627A (ja) 2011-08-29 2014-11-13 ティコナ・エルエルシー 芳香族アミド化合物
US9074133B2 (en) 2011-08-29 2015-07-07 Ticona Llc Thermotropic liquid crystalline polymer with improved low shear viscosity
KR20140059825A (ko) 2011-08-29 2014-05-16 티코나 엘엘씨 고유동성 액정 중합체 조성물
WO2013032971A1 (en) 2011-08-29 2013-03-07 Ticona Llc Melt-extruded substrate for use in thermoformed articles
TW201319118A (zh) 2011-08-29 2013-05-16 Ticona Llc 低熔融黏度液晶聚合物之熔融聚合
WO2013032981A1 (en) 2011-08-29 2013-03-07 Ticona Llc High flow liquid crystalline polymer composition
WO2013032977A1 (en) 2011-08-29 2013-03-07 Ticona Llc Heat-resistant liquid crystalline polymer composition having a low melting temperature
WO2013032967A1 (en) 2011-08-29 2013-03-07 Ticona Llc Cast molded parts formed form a liquid crystalline polymer
TW201313884A (zh) 2011-08-29 2013-04-01 Ticona Llc 液晶聚合物之固態聚合
WO2014130275A2 (en) 2013-02-22 2014-08-28 Ticona Llc High performance polymer composition with improved flow properties
JP6625050B2 (ja) 2013-06-07 2019-12-25 ティコナ・エルエルシー 高強度サーモトロピック液晶ポリマー

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2732020B2 (ja) * 1993-10-22 1998-03-25 株式会社巴川製紙所 電子部品用接着テープおよび液状接着剤
JP3137518B2 (ja) * 1993-10-29 2001-02-26 株式会社巴川製紙所 電子部品用液状接着剤およびそれを用いる絶縁接着層の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100642678B1 (ko) * 2004-07-13 2006-11-10 가부시키가이샤 도모에가와 세이시쇼 전자부품용 접착테이프 및 전자부품

Also Published As

Publication number Publication date
US5609956A (en) 1997-03-11
KR0150931B1 (ko) 1998-10-01
JPH08269405A (ja) 1996-10-15
JP2896751B2 (ja) 1999-05-31
TW450990B (en) 2001-08-21

Similar Documents

Publication Publication Date Title
KR960034344A (ko) 전자부품용 접착테이프
KR950011573A (ko) 전자 부품용 접착 테이프 및 액상 접착제
KR970001495A (ko) 전자 부품용 접착 테이프
KR950011574A (ko) 전자 부품용 접착 테이프 및 액상 접착제
KR930702463A (ko) 고분자 단량체를 함유하는 폴리올레핀 압감 접착제 조성물
EP0464706B1 (en) Ultraviolet-curable silicone composition
US6545076B2 (en) Silicone composition for forming a release coating
KR900004882A (ko) 자동차 피복 조성물
KR910020145A (ko) 개선된 감압성 접착제
US5530063A (en) Room temperature curable organopolysiloxane composition
KR920007795A (ko) 실리콘 고무적층체 및 그의 제조방법
CA1331116C (en) Silicone encapsulated devices
KR900003322A (ko) 높은 고형물 함량을 갖는 실리콘 기재 감압성 접착제
WO2006104236A1 (en) Hot-melt silicone adhesive
CA2029627A1 (en) Coating composition
WO2004111151A2 (en) Silicone-based pressure-sensitive adhesive and adhesive tape
KR840008672A (ko) 액체 오가노실록산 수지조성물
KR950704396A (ko) 무수물 수지를 함유하는 경화성 조성물(Curable composition containing anhydride resins)
EP1947133A1 (en) Ultraviolet-curable silicone composition
BR0211230A (pt) Composição de revestimento, substrato e aduto de isocianato útil
TW364005B (en) Liquid adhesive for electronic parts and adhesive tape
EP1221468A1 (en) Essentially solventless silicone composition for forming cured release coatings
KR890008258A (ko) 저온 경화성 조성물
EP1229092A3 (en) Polymer composition, cured product, laminate and method for producing the cured product
KR960041310A (ko) 전자 부품용 접착 테이프 및 액상 접착제

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080530

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee