KR960032769U - 합금으로 이루어진 리드 프레임 - Google Patents
합금으로 이루어진 리드 프레임Info
- Publication number
- KR960032769U KR960032769U KR2019950003880U KR19950003880U KR960032769U KR 960032769 U KR960032769 U KR 960032769U KR 2019950003880 U KR2019950003880 U KR 2019950003880U KR 19950003880 U KR19950003880 U KR 19950003880U KR 960032769 U KR960032769 U KR 960032769U
- Authority
- KR
- South Korea
- Prior art keywords
- alloy
- lead frame
- frame made
- lead
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950003880U KR200178132Y1 (ko) | 1995-03-07 | 1995-03-07 | 합금으로 이루어진 리드 프레임 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950003880U KR200178132Y1 (ko) | 1995-03-07 | 1995-03-07 | 합금으로 이루어진 리드 프레임 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960032769U true KR960032769U (ko) | 1996-10-24 |
KR200178132Y1 KR200178132Y1 (ko) | 2000-05-01 |
Family
ID=19408861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950003880U KR200178132Y1 (ko) | 1995-03-07 | 1995-03-07 | 합금으로 이루어진 리드 프레임 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200178132Y1 (ko) |
-
1995
- 1995-03-07 KR KR2019950003880U patent/KR200178132Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200178132Y1 (ko) | 2000-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20080128 Year of fee payment: 9 |
|
LAPS | Lapse due to unpaid annual fee |