KR960029734U - 단차를 가지는 히터블럭 - Google Patents

단차를 가지는 히터블럭

Info

Publication number
KR960029734U
KR960029734U KR2019950003495U KR19950003495U KR960029734U KR 960029734 U KR960029734 U KR 960029734U KR 2019950003495 U KR2019950003495 U KR 2019950003495U KR 19950003495 U KR19950003495 U KR 19950003495U KR 960029734 U KR960029734 U KR 960029734U
Authority
KR
South Korea
Prior art keywords
heater block
heater
block
Prior art date
Application number
KR2019950003495U
Other languages
English (en)
Other versions
KR0120454Y1 (ko
Inventor
이찬석
김병만
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019950003495U priority Critical patent/KR0120454Y1/ko
Publication of KR960029734U publication Critical patent/KR960029734U/ko
Application granted granted Critical
Publication of KR0120454Y1 publication Critical patent/KR0120454Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
KR2019950003495U 1995-02-28 1995-02-28 단차를 가지는 히터블럭 KR0120454Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950003495U KR0120454Y1 (ko) 1995-02-28 1995-02-28 단차를 가지는 히터블럭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950003495U KR0120454Y1 (ko) 1995-02-28 1995-02-28 단차를 가지는 히터블럭

Publications (2)

Publication Number Publication Date
KR960029734U true KR960029734U (ko) 1996-09-17
KR0120454Y1 KR0120454Y1 (ko) 1998-08-01

Family

ID=19408622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950003495U KR0120454Y1 (ko) 1995-02-28 1995-02-28 단차를 가지는 히터블럭

Country Status (1)

Country Link
KR (1) KR0120454Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3488138B2 (ja) * 1999-06-25 2004-01-19 株式会社新川 ワイヤボンディング装置

Also Published As

Publication number Publication date
KR0120454Y1 (ko) 1998-08-01

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