KR960026360U - Heat dissipation structure of heating element installed in enclosed space - Google Patents

Heat dissipation structure of heating element installed in enclosed space

Info

Publication number
KR960026360U
KR960026360U KR2019940032735U KR19940032735U KR960026360U KR 960026360 U KR960026360 U KR 960026360U KR 2019940032735 U KR2019940032735 U KR 2019940032735U KR 19940032735 U KR19940032735 U KR 19940032735U KR 960026360 U KR960026360 U KR 960026360U
Authority
KR
South Korea
Prior art keywords
heat dissipation
heating element
enclosed space
dissipation structure
element installed
Prior art date
Application number
KR2019940032735U
Other languages
Korean (ko)
Other versions
KR0125020Y1 (en
Inventor
한상현
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019940032735U priority Critical patent/KR0125020Y1/en
Publication of KR960026360U publication Critical patent/KR960026360U/en
Application granted granted Critical
Publication of KR0125020Y1 publication Critical patent/KR0125020Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR2019940032735U 1994-12-02 1994-12-02 Radiation structure for heating element installation hermetic space KR0125020Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940032735U KR0125020Y1 (en) 1994-12-02 1994-12-02 Radiation structure for heating element installation hermetic space

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940032735U KR0125020Y1 (en) 1994-12-02 1994-12-02 Radiation structure for heating element installation hermetic space

Publications (2)

Publication Number Publication Date
KR960026360U true KR960026360U (en) 1996-07-22
KR0125020Y1 KR0125020Y1 (en) 1998-12-15

Family

ID=19400282

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940032735U KR0125020Y1 (en) 1994-12-02 1994-12-02 Radiation structure for heating element installation hermetic space

Country Status (1)

Country Link
KR (1) KR0125020Y1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100911007B1 (en) * 2007-05-18 2009-08-05 삼성에스디아이 주식회사 Chassis base assembly and display apparatus including the same
KR101159733B1 (en) * 2010-10-12 2012-06-28 주식회사 유라코퍼레이션 Radiate Heat Unit of PCB Board

Also Published As

Publication number Publication date
KR0125020Y1 (en) 1998-12-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20070530

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee