KR960015638U - Lead frame - Google Patents
Lead frameInfo
- Publication number
- KR960015638U KR960015638U KR2019940026326U KR19940026326U KR960015638U KR 960015638 U KR960015638 U KR 960015638U KR 2019940026326 U KR2019940026326 U KR 2019940026326U KR 19940026326 U KR19940026326 U KR 19940026326U KR 960015638 U KR960015638 U KR 960015638U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- lead
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940026326U KR0129004Y1 (en) | 1994-10-10 | 1994-10-10 | Lead frame |
JP7220236A JP2820645B2 (en) | 1994-08-30 | 1995-08-29 | Semiconductor lead frame |
US08/520,429 US5723899A (en) | 1994-08-30 | 1995-08-29 | Semiconductor lead frame having connection bar and guide rings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940026326U KR0129004Y1 (en) | 1994-10-10 | 1994-10-10 | Lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960015638U true KR960015638U (en) | 1996-05-17 |
KR0129004Y1 KR0129004Y1 (en) | 1998-12-01 |
Family
ID=19395102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940026326U KR0129004Y1 (en) | 1994-08-30 | 1994-10-10 | Lead frame |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0129004Y1 (en) |
-
1994
- 1994-10-10 KR KR2019940026326U patent/KR0129004Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0129004Y1 (en) | 1998-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
N231 | Notification of change of applicant | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20060803 Year of fee payment: 9 |
|
LAPS | Lapse due to unpaid annual fee |