KR960009269U - V grooved sensor cell - Google Patents
V grooved sensor cellInfo
- Publication number
- KR960009269U KR960009269U KR2019940021375U KR19940021375U KR960009269U KR 960009269 U KR960009269 U KR 960009269U KR 2019940021375 U KR2019940021375 U KR 2019940021375U KR 19940021375 U KR19940021375 U KR 19940021375U KR 960009269 U KR960009269 U KR 960009269U
- Authority
- KR
- South Korea
- Prior art keywords
- sensor cell
- grooved sensor
- grooved
- cell
- sensor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940021375U KR0125041Y1 (en) | 1994-08-24 | 1994-08-24 | Sensor cell with v-type trench |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940021375U KR0125041Y1 (en) | 1994-08-24 | 1994-08-24 | Sensor cell with v-type trench |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960009269U true KR960009269U (en) | 1996-03-16 |
KR0125041Y1 KR0125041Y1 (en) | 1999-02-18 |
Family
ID=19391359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940021375U KR0125041Y1 (en) | 1994-08-24 | 1994-08-24 | Sensor cell with v-type trench |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0125041Y1 (en) |
-
1994
- 1994-08-24 KR KR2019940021375U patent/KR0125041Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0125041Y1 (en) | 1999-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE59510852D1 (en) | Electrochemical sensor | |
DE69603416D1 (en) | Electrochemical immunobiosensor | |
DE69739030D1 (en) | ELECTROCHEMICAL SENSOR | |
FI953888A (en) | Sensor | |
BR9608046A (en) | Sensor | |
DE59509359D1 (en) | Sensor system | |
DE69627093D1 (en) | Hydrogen sensor | |
DE69512355D1 (en) | CELL CONSTRUCTION ELEMENT | |
DE69727485D1 (en) | ELECTROCHEMICAL SENSOR | |
DE59509790D1 (en) | Angle sensor | |
DE69524698D1 (en) | oxygen sensor | |
DE69527454D1 (en) | Hybrid sensor | |
DE69619850D1 (en) | sensor arrangement | |
DE59711247D1 (en) | Electrochemical sensor | |
DE69620552D1 (en) | Electrochemical sensor | |
FI101610B1 (en) | The sample sensor | |
DE69504437D1 (en) | Continuous condition sensor | |
DE69533859D1 (en) | ion sensor | |
DE69633441D1 (en) | ELECTROCHEMICAL SENSOR | |
ATA159897A (en) | SENSOR | |
DE59406432D1 (en) | Electrochemical sensor | |
DE59600923D1 (en) | Sensor arrangement | |
KR960003165U (en) | battery | |
KR960009269U (en) | V grooved sensor cell | |
DE59507112D1 (en) | Level sensor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
LAPS | Lapse due to unpaid annual fee |