KR950704801A - Electrically Conductive Resin Pastes and Multilayer Ceramic Capacitors Having a Terminal Electrode Comprised of the Same - Google Patents

Electrically Conductive Resin Pastes and Multilayer Ceramic Capacitors Having a Terminal Electrode Comprised of the Same

Info

Publication number
KR950704801A
KR950704801A KR1019950701759A KR19950701759A KR950704801A KR 950704801 A KR950704801 A KR 950704801A KR 1019950701759 A KR1019950701759 A KR 1019950701759A KR 19950701759 A KR19950701759 A KR 19950701759A KR 950704801 A KR950704801 A KR 950704801A
Authority
KR
South Korea
Prior art keywords
resin
electrically conductive
multilayer ceramic
conductive resin
terminal electrode
Prior art date
Application number
KR1019950701759A
Other languages
Korean (ko)
Inventor
아끼라 이나바
다까유끼 오바
Original Assignee
미리암 디. 메코너헤이
이.아이.듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이.아이.듀폰 디 네모아 앤드 캄파니 filed Critical 미리암 디. 메코너헤이
Publication of KR950704801A publication Critical patent/KR950704801A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

고온 소성을 요하지 않는 다층 세라믹 칩 커패시터용 단자 전극의 제조에 사용하기 위한 전기 전도성 수지 페이스트 및 그에 의해 형성된 칩 커패시터가 개시된다. 수지 페이스트는 유기 매질에 분산된 귀금속 분말, 수지 결합제 및 경화제로 이루어진 전기 전도성 충전제의 혼합물을 함유하며 상기 수지 결합제는 에폭시 수지와 열가소성 또는 열경화성 수지 중 적어도 2종의 수지의 혼합물을 함유하며 귀금속 분말 대 열경화성 수지의 중량비는 약 100 : 5 내지 100: 45이다.Disclosed are electrically conductive resin pastes and chip capacitors formed thereby for use in the production of terminal electrodes for multilayer ceramic chip capacitors that do not require high temperature firing. The resin paste contains a mixture of an electrically conductive filler consisting of a noble metal powder, a resin binder and a curing agent dispersed in an organic medium, the resin binder containing a mixture of an epoxy resin and at least two resins of thermoplastic or thermosetting resins. The weight ratio of the thermosetting resin is about 100: 5 to 100: 45.

Description

전기 전도성 수지 페이스트 및 이것으로 구성된 단자 전극을 갖는 다층 세라믹 커패시터(Electrically Conductive Resin Pastes and Multilayer Ceramic Capacitors Having a Terminal Electrode Comprised of the Same)Electrically Conductive Resin Pastes and Multilayer Ceramic Capacitors Having a Terminal Electrode Comprised of the Same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

유기 매질에 분산된 귀금속 분말, 수지 결합제 및 경화제로 이루어져 있으며, 상기 수지 결합제가 에폭시 수지와 열경화성 또는 열가소성 수지 중 적어도 2종의 수지의 혼합물을 함유하며, 귀금속 분말 대 열경화성 수지의 중량비가 약 100 : 5 내지 100 : 45인 것을 특징으로 하는, 다층 세라믹 칩 커패시터용 단자 전극의 제조에 사용하기 위한 전기 전도성 수지 페이스트.It is composed of a noble metal powder, a resin binder and a curing agent dispersed in an organic medium, wherein the resin binder contains a mixture of an epoxy resin and at least two resins of a thermosetting or thermoplastic resin, and the weight ratio of the noble metal powder to the thermosetting resin is about 100: An electrically conductive resin paste for use in the manufacture of terminal electrodes for multilayer ceramic chip capacitors, which is 5 to 100: 45. 내부 전극을 뽑아내기 위한 부위들이 마주 보도록 배열되는 방법으로 부착된 전기 전도성 내부 전극을 갖는 다수의 유전체 박판을 교대로 적층시키고, 보호층용 유전체 박판으로 최외층을 적층시켜 그들을 집적시키고, 제1항의 전기 전도성 수지 페이스트를 집적된 적층물내의 상기 부위에 가하고 이를 소성시켜 단자 전극을 형성시킴으로써 제조된 다층 세라믹 칩 커패시터.The plurality of dielectric thin plates having electrically conductive inner electrodes attached in such a manner that the portions for extracting the inner electrodes are arranged to face each other are alternately laminated, and the outermost layers are laminated with the protective thin dielectric thin plates to integrate them, and the electric of claim 1 A multilayer ceramic chip capacitor prepared by applying a conductive resin paste to said site in an integrated stack and firing it to form a terminal electrode. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950701759A 1992-11-04 1993-11-03 Electrically Conductive Resin Pastes and Multilayer Ceramic Capacitors Having a Terminal Electrode Comprised of the Same KR950704801A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4-294893 1992-11-04
JP4294893A JPH06267784A (en) 1992-11-04 1992-11-04 Conductive resin paste and laminated ceramic chip capacitor with terminal electrode consisting of same
PCT/US1993/010325 WO1994010697A1 (en) 1992-11-04 1993-11-03 Electrically conductive resin pastes and multilayer ceramic capacitors having a terminal electrode comprised of the same

Publications (1)

Publication Number Publication Date
KR950704801A true KR950704801A (en) 1995-11-20

Family

ID=17813618

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950701759A KR950704801A (en) 1992-11-04 1993-11-03 Electrically Conductive Resin Pastes and Multilayer Ceramic Capacitors Having a Terminal Electrode Comprised of the Same

Country Status (5)

Country Link
EP (1) EP0667031A1 (en)
JP (1) JPH06267784A (en)
KR (1) KR950704801A (en)
CN (1) CN1038370C (en)
WO (1) WO1994010697A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100225928B1 (en) * 1992-03-12 1999-10-15 정윤이 Method of manufacturing sealed terminal and cell manufactured by it

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JP3330836B2 (en) * 1997-01-22 2002-09-30 太陽誘電株式会社 Manufacturing method of laminated electronic components
TWI269325B (en) 2002-03-07 2006-12-21 Tdk Corp Laminated electronic component
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7751174B2 (en) 2002-12-09 2010-07-06 Matsushita Electric Industrial Co., Ltd. Electronic part with external electrode
WO2007072894A1 (en) 2005-12-22 2007-06-28 Namics Corporation Thermosetting conductive paste and multilayer ceramic component having external electrode which is formed by using such thermosetting conductive paste
JP2007234800A (en) * 2006-02-28 2007-09-13 Tdk Corp Electronic component and manufacturing method thereof
JP2007234828A (en) 2006-02-28 2007-09-13 Tdk Corp Electronic component and manufacturing method thereof
EP2034496B1 (en) * 2006-06-28 2013-10-23 Murata Manufacturing Co. Ltd. Ceramic electronic component and method for manufacturing same
JP2008255279A (en) * 2007-04-06 2008-10-23 Walsin Technology Corp Terminal composition for electric component
JP5439954B2 (en) 2009-06-01 2014-03-12 株式会社村田製作所 Multilayer electronic component and manufacturing method thereof
JP2011204849A (en) * 2010-03-25 2011-10-13 Murata Mfg Co Ltd Method of manufacturing laminated ceramic electronic component
JP5708009B2 (en) * 2011-02-17 2015-04-30 セイコーエプソン株式会社 Optical module and electronic equipment
KR102004759B1 (en) 2012-06-11 2019-07-29 삼성전기주식회사 Conductive paste composition for external electrode and multi-layered ceramic electronic parts fabricated by using the same
JP2014107157A (en) * 2012-11-28 2014-06-09 Sumitomo Metal Mining Co Ltd Conductive resin paste and electronic element using the same
JP2014120382A (en) * 2012-12-18 2014-06-30 Sumitomo Metal Mining Co Ltd Conductive resin paste and electronic element using the same
KR102097329B1 (en) * 2013-09-12 2020-04-06 삼성전기주식회사 Multi-layered ceramic capacitor, manufacturing method thereof and board for mounting the same
JP5877239B2 (en) * 2014-12-24 2016-03-02 ナミックス株式会社 Conductive paste for external electrode and multilayer ceramic electronic component provided with external electrode formed using the same
CN104629260B (en) * 2014-12-29 2017-09-15 广东风华高新科技股份有限公司 The end-blocking slurry of chip multilayer ceramic capacitor, chip multilayer ceramic capacitor and preparation method thereof
CN106571229B (en) 2015-10-09 2018-11-09 株式会社村田制作所 Electronic unit
JP2017073539A (en) * 2015-10-09 2017-04-13 株式会社村田製作所 Electronic component
JP6673273B2 (en) * 2016-09-28 2020-03-25 株式会社村田製作所 Electronic components
JP6919515B2 (en) * 2017-11-15 2021-08-18 株式会社村田製作所 Multilayer ceramic capacitors
JP2020107704A (en) * 2018-12-27 2020-07-09 Tdk株式会社 Electronic component
JP2020107705A (en) * 2018-12-27 2020-07-09 Tdk株式会社 Electronic component
US10937596B2 (en) * 2019-02-06 2021-03-02 Tdk Corporation Electronic component

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US4575432A (en) * 1984-07-09 1986-03-11 W. R. Grace & Co. Conductive thermosetting compositions and process for using same
JPS62164757A (en) * 1986-01-14 1987-07-21 Shinto Paint Co Ltd Solderable, electrically conductive composition
GB8921742D0 (en) * 1989-09-27 1989-11-08 Cookson Group Plc Conductive polymer composition
JPH03188180A (en) * 1989-12-18 1991-08-16 Hitachi Chem Co Ltd Conductive film adhesive, method for adhesion, semiconductor device, and preparation of semiconductor device
JPH04239710A (en) * 1991-01-23 1992-08-27 Nec Corp Laminated ceramic capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100225928B1 (en) * 1992-03-12 1999-10-15 정윤이 Method of manufacturing sealed terminal and cell manufactured by it

Also Published As

Publication number Publication date
CN1091854A (en) 1994-09-07
JPH06267784A (en) 1994-09-22
WO1994010697A1 (en) 1994-05-11
EP0667031A1 (en) 1995-08-16
CN1038370C (en) 1998-05-13

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A201 Request for examination
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Free format text: REJECTION OF TRIAL FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19990224

Effective date: 19990930