KR950025634U - 칩마운터용 부품인식장치 - Google Patents

칩마운터용 부품인식장치

Info

Publication number
KR950025634U
KR950025634U KR2019940002783U KR19940002783U KR950025634U KR 950025634 U KR950025634 U KR 950025634U KR 2019940002783 U KR2019940002783 U KR 2019940002783U KR 19940002783 U KR19940002783 U KR 19940002783U KR 950025634 U KR950025634 U KR 950025634U
Authority
KR
South Korea
Prior art keywords
mounter
chip
component
component mounter
chip mounter
Prior art date
Application number
KR2019940002783U
Other languages
English (en)
Other versions
KR200149152Y1 (ko
Inventor
정동구
Original Assignee
삼성항공산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업주식회사 filed Critical 삼성항공산업주식회사
Priority to KR2019940002783U priority Critical patent/KR200149152Y1/ko
Publication of KR950025634U publication Critical patent/KR950025634U/ko
Application granted granted Critical
Publication of KR200149152Y1 publication Critical patent/KR200149152Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR2019940002783U 1994-02-16 1994-02-16 칩마운터용 부품인식장치 KR200149152Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940002783U KR200149152Y1 (ko) 1994-02-16 1994-02-16 칩마운터용 부품인식장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940002783U KR200149152Y1 (ko) 1994-02-16 1994-02-16 칩마운터용 부품인식장치

Publications (2)

Publication Number Publication Date
KR950025634U true KR950025634U (ko) 1995-09-18
KR200149152Y1 KR200149152Y1 (ko) 1999-06-15

Family

ID=19377296

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940002783U KR200149152Y1 (ko) 1994-02-16 1994-02-16 칩마운터용 부품인식장치

Country Status (1)

Country Link
KR (1) KR200149152Y1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146318B1 (ko) * 2006-04-06 2012-05-21 삼성테크윈 주식회사 칩마운터의 부품 흡착 인식방법
KR20210000043A (ko) * 2019-06-24 2021-01-04 삼성전자주식회사 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146318B1 (ko) * 2006-04-06 2012-05-21 삼성테크윈 주식회사 칩마운터의 부품 흡착 인식방법
KR20210000043A (ko) * 2019-06-24 2021-01-04 삼성전자주식회사 콜렛 장치 및 이를 이용한 반도체 장치의 제조 방법

Also Published As

Publication number Publication date
KR200149152Y1 (ko) 1999-06-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080227

Year of fee payment: 10

EXPY Expiration of term